JPS5422775A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS5422775A
JPS5422775A JP8737977A JP8737977A JPS5422775A JP S5422775 A JPS5422775 A JP S5422775A JP 8737977 A JP8737977 A JP 8737977A JP 8737977 A JP8737977 A JP 8737977A JP S5422775 A JPS5422775 A JP S5422775A
Authority
JP
Japan
Prior art keywords
semiconductor device
zrsio
sio
compound
protective film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP8737977A
Other languages
Japanese (ja)
Other versions
JPS6023497B2 (en
Inventor
Masatoshi Seki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP52087379A priority Critical patent/JPS6023497B2/en
Publication of JPS5422775A publication Critical patent/JPS5422775A/en
Publication of JPS6023497B2 publication Critical patent/JPS6023497B2/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Formation Of Insulating Films (AREA)

Abstract

PURPOSE: To obtain a semiconductor device featuring a stable surface by using the SiO2 compound such as ZrSiO4 or the like for the protective film.
COPYRIGHT: (C)1979,JPO&Japio
JP52087379A 1977-07-22 1977-07-22 semiconductor equipment Expired JPS6023497B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP52087379A JPS6023497B2 (en) 1977-07-22 1977-07-22 semiconductor equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP52087379A JPS6023497B2 (en) 1977-07-22 1977-07-22 semiconductor equipment

Publications (2)

Publication Number Publication Date
JPS5422775A true JPS5422775A (en) 1979-02-20
JPS6023497B2 JPS6023497B2 (en) 1985-06-07

Family

ID=13913253

Family Applications (1)

Application Number Title Priority Date Filing Date
JP52087379A Expired JPS6023497B2 (en) 1977-07-22 1977-07-22 semiconductor equipment

Country Status (1)

Country Link
JP (1) JPS6023497B2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5756949A (en) * 1980-09-22 1982-04-05 Nec Corp Semiconductor device
JPS5785634A (en) * 1980-11-14 1982-05-28 Shokubai Kasei Kogyo Kk Manufacture of mold

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5756949A (en) * 1980-09-22 1982-04-05 Nec Corp Semiconductor device
JPS6134256B2 (en) * 1980-09-22 1986-08-06 Nippon Electric Co
JPS5785634A (en) * 1980-11-14 1982-05-28 Shokubai Kasei Kogyo Kk Manufacture of mold

Also Published As

Publication number Publication date
JPS6023497B2 (en) 1985-06-07

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