JPS5422775A - Semiconductor device - Google Patents
Semiconductor deviceInfo
- Publication number
- JPS5422775A JPS5422775A JP8737977A JP8737977A JPS5422775A JP S5422775 A JPS5422775 A JP S5422775A JP 8737977 A JP8737977 A JP 8737977A JP 8737977 A JP8737977 A JP 8737977A JP S5422775 A JPS5422775 A JP S5422775A
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- zrsio
- sio
- compound
- protective film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Formation Of Insulating Films (AREA)
Abstract
PURPOSE: To obtain a semiconductor device featuring a stable surface by using the SiO2 compound such as ZrSiO4 or the like for the protective film.
COPYRIGHT: (C)1979,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP52087379A JPS6023497B2 (en) | 1977-07-22 | 1977-07-22 | semiconductor equipment |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP52087379A JPS6023497B2 (en) | 1977-07-22 | 1977-07-22 | semiconductor equipment |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5422775A true JPS5422775A (en) | 1979-02-20 |
JPS6023497B2 JPS6023497B2 (en) | 1985-06-07 |
Family
ID=13913253
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP52087379A Expired JPS6023497B2 (en) | 1977-07-22 | 1977-07-22 | semiconductor equipment |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6023497B2 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5756949A (en) * | 1980-09-22 | 1982-04-05 | Nec Corp | Semiconductor device |
JPS5785634A (en) * | 1980-11-14 | 1982-05-28 | Shokubai Kasei Kogyo Kk | Manufacture of mold |
-
1977
- 1977-07-22 JP JP52087379A patent/JPS6023497B2/en not_active Expired
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5756949A (en) * | 1980-09-22 | 1982-04-05 | Nec Corp | Semiconductor device |
JPS6134256B2 (en) * | 1980-09-22 | 1986-08-06 | Nippon Electric Co | |
JPS5785634A (en) * | 1980-11-14 | 1982-05-28 | Shokubai Kasei Kogyo Kk | Manufacture of mold |
Also Published As
Publication number | Publication date |
---|---|
JPS6023497B2 (en) | 1985-06-07 |
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