JPS5325360A - Production of semiconductor device - Google Patents

Production of semiconductor device

Info

Publication number
JPS5325360A
JPS5325360A JP9968976A JP9968976A JPS5325360A JP S5325360 A JPS5325360 A JP S5325360A JP 9968976 A JP9968976 A JP 9968976A JP 9968976 A JP9968976 A JP 9968976A JP S5325360 A JPS5325360 A JP S5325360A
Authority
JP
Japan
Prior art keywords
production
semiconductor device
pawls
jig
package
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9968976A
Other languages
Japanese (ja)
Inventor
Morio Toyooka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP9968976A priority Critical patent/JPS5325360A/en
Publication of JPS5325360A publication Critical patent/JPS5325360A/en
Pending legal-status Critical Current

Links

Landscapes

  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE: Positioning of package is performed without using any jig by defining the position with the pawls of a lead frame in covering an external member.
COPYRIGHT: (C)1978,JPO&Japio
JP9968976A 1976-08-23 1976-08-23 Production of semiconductor device Pending JPS5325360A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9968976A JPS5325360A (en) 1976-08-23 1976-08-23 Production of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9968976A JPS5325360A (en) 1976-08-23 1976-08-23 Production of semiconductor device

Publications (1)

Publication Number Publication Date
JPS5325360A true JPS5325360A (en) 1978-03-09

Family

ID=14253998

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9968976A Pending JPS5325360A (en) 1976-08-23 1976-08-23 Production of semiconductor device

Country Status (1)

Country Link
JP (1) JPS5325360A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58138350U (en) * 1982-03-10 1983-09-17 日本電気ホームエレクトロニクス株式会社 lead frame
JPS58170045A (en) * 1982-03-31 1983-10-06 Fujitsu Ltd Semiconductor package
US5263242A (en) * 1991-05-07 1993-11-23 Cn Industries Ltd. Method of making semiconductor package with segmented lead frame
US5452511A (en) * 1993-11-04 1995-09-26 Chang; Alexander H. C. Composite lead frame manufacturing method

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58138350U (en) * 1982-03-10 1983-09-17 日本電気ホームエレクトロニクス株式会社 lead frame
JPS58170045A (en) * 1982-03-31 1983-10-06 Fujitsu Ltd Semiconductor package
JPS6347269B2 (en) * 1982-03-31 1988-09-21 Fujitsu Ltd
US5263242A (en) * 1991-05-07 1993-11-23 Cn Industries Ltd. Method of making semiconductor package with segmented lead frame
US5452511A (en) * 1993-11-04 1995-09-26 Chang; Alexander H. C. Composite lead frame manufacturing method

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