JPS5325360A - Production of semiconductor device - Google Patents
Production of semiconductor deviceInfo
- Publication number
- JPS5325360A JPS5325360A JP9968976A JP9968976A JPS5325360A JP S5325360 A JPS5325360 A JP S5325360A JP 9968976 A JP9968976 A JP 9968976A JP 9968976 A JP9968976 A JP 9968976A JP S5325360 A JPS5325360 A JP S5325360A
- Authority
- JP
- Japan
- Prior art keywords
- production
- semiconductor device
- pawls
- jig
- package
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Abstract
PURPOSE: Positioning of package is performed without using any jig by defining the position with the pawls of a lead frame in covering an external member.
COPYRIGHT: (C)1978,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9968976A JPS5325360A (en) | 1976-08-23 | 1976-08-23 | Production of semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9968976A JPS5325360A (en) | 1976-08-23 | 1976-08-23 | Production of semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5325360A true JPS5325360A (en) | 1978-03-09 |
Family
ID=14253998
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP9968976A Pending JPS5325360A (en) | 1976-08-23 | 1976-08-23 | Production of semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5325360A (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58138350U (en) * | 1982-03-10 | 1983-09-17 | 日本電気ホームエレクトロニクス株式会社 | lead frame |
JPS58170045A (en) * | 1982-03-31 | 1983-10-06 | Fujitsu Ltd | Semiconductor package |
US5263242A (en) * | 1991-05-07 | 1993-11-23 | Cn Industries Ltd. | Method of making semiconductor package with segmented lead frame |
US5452511A (en) * | 1993-11-04 | 1995-09-26 | Chang; Alexander H. C. | Composite lead frame manufacturing method |
-
1976
- 1976-08-23 JP JP9968976A patent/JPS5325360A/en active Pending
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58138350U (en) * | 1982-03-10 | 1983-09-17 | 日本電気ホームエレクトロニクス株式会社 | lead frame |
JPS58170045A (en) * | 1982-03-31 | 1983-10-06 | Fujitsu Ltd | Semiconductor package |
JPS6347269B2 (en) * | 1982-03-31 | 1988-09-21 | Fujitsu Ltd | |
US5263242A (en) * | 1991-05-07 | 1993-11-23 | Cn Industries Ltd. | Method of making semiconductor package with segmented lead frame |
US5452511A (en) * | 1993-11-04 | 1995-09-26 | Chang; Alexander H. C. | Composite lead frame manufacturing method |
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