JPS5232269A - Hermetic sealing method of semiconductor devices - Google Patents

Hermetic sealing method of semiconductor devices

Info

Publication number
JPS5232269A
JPS5232269A JP10826575A JP10826575A JPS5232269A JP S5232269 A JPS5232269 A JP S5232269A JP 10826575 A JP10826575 A JP 10826575A JP 10826575 A JP10826575 A JP 10826575A JP S5232269 A JPS5232269 A JP S5232269A
Authority
JP
Japan
Prior art keywords
semiconductor devices
sealing method
hermetic sealing
massproduction
concave
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP10826575A
Other languages
Japanese (ja)
Other versions
JPS5921171B2 (en
Inventor
Fujio Oda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP10826575A priority Critical patent/JPS5921171B2/en
Publication of JPS5232269A publication Critical patent/JPS5232269A/en
Publication of JPS5921171B2 publication Critical patent/JPS5921171B2/en
Expired legal-status Critical Current

Links

Landscapes

  • Measuring Fluid Pressure (AREA)
  • Casings For Electric Apparatus (AREA)

Abstract

PURPOSE: To obtain hermetically sealed semiconductor devices with sufficient surface protection and suitable for massproduction by combining semiconductor devices with a thru hole and a container with a concave.
COPYRIGHT: (C)1977,JPO&Japio
JP10826575A 1975-09-05 1975-09-05 How to seal semiconductor devices Expired JPS5921171B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10826575A JPS5921171B2 (en) 1975-09-05 1975-09-05 How to seal semiconductor devices

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10826575A JPS5921171B2 (en) 1975-09-05 1975-09-05 How to seal semiconductor devices

Publications (2)

Publication Number Publication Date
JPS5232269A true JPS5232269A (en) 1977-03-11
JPS5921171B2 JPS5921171B2 (en) 1984-05-18

Family

ID=14480259

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10826575A Expired JPS5921171B2 (en) 1975-09-05 1975-09-05 How to seal semiconductor devices

Country Status (1)

Country Link
JP (1) JPS5921171B2 (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0316159A (en) * 1989-05-23 1991-01-24 Shinko Electric Ind Co Ltd Electronic device
JP2006503176A (en) * 2002-05-07 2006-01-26 マイクロファブリカ インク Electrochemically molded and hermetically sealed microstructure and method and apparatus for producing the microstructure
JP2009135296A (en) * 2007-11-30 2009-06-18 Nec Corp Vacuum package and manufacturing method thereof
JP2014036081A (en) * 2012-08-08 2014-02-24 Seiko Epson Corp Method for manufacturing electronic device, electronic device, electronic equipment, and movable body
JP2014179608A (en) * 1998-03-31 2014-09-25 Honeywell Internatl Inc Method for fabricating wafer-pair having plugged and sealed chamber
JP2015207727A (en) * 2014-04-23 2015-11-19 セイコーエプソン株式会社 Package, electronic device, manufacturing method of electronic device, electronic apparatus and movable body

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010153976A (en) * 2008-12-24 2010-07-08 Epson Toyocom Corp Piezoelectric device and method of manufacturing the same

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0316159A (en) * 1989-05-23 1991-01-24 Shinko Electric Ind Co Ltd Electronic device
JP2014179608A (en) * 1998-03-31 2014-09-25 Honeywell Internatl Inc Method for fabricating wafer-pair having plugged and sealed chamber
JP2006503176A (en) * 2002-05-07 2006-01-26 マイクロファブリカ インク Electrochemically molded and hermetically sealed microstructure and method and apparatus for producing the microstructure
JP2009135296A (en) * 2007-11-30 2009-06-18 Nec Corp Vacuum package and manufacturing method thereof
US7795585B2 (en) 2007-11-30 2010-09-14 Nec Corporation Vacuum package and manufacturing process thereof
JP4665959B2 (en) * 2007-11-30 2011-04-06 日本電気株式会社 Vacuum package
JP2014036081A (en) * 2012-08-08 2014-02-24 Seiko Epson Corp Method for manufacturing electronic device, electronic device, electronic equipment, and movable body
JP2015207727A (en) * 2014-04-23 2015-11-19 セイコーエプソン株式会社 Package, electronic device, manufacturing method of electronic device, electronic apparatus and movable body

Also Published As

Publication number Publication date
JPS5921171B2 (en) 1984-05-18

Similar Documents

Publication Publication Date Title
JPS5232269A (en) Hermetic sealing method of semiconductor devices
JPS5255871A (en) Production of semiconductor
JPS5372456A (en) Glass sealing semiconductor device
JPS5367358A (en) Semiconductor device
JPS527788A (en) Method to test water proof of pocket watch
JPS5218394A (en) Comparing electrode
JPS5280865A (en) Watch case
JPS51122377A (en) Manufacturing method of glass sealed semiconductor
JPS51142981A (en) Production method of semiconductor devices
JPS5420667A (en) Sealing method of hermetic package
JPS5223272A (en) Method of manufacturing glass passivation semiconductor device
JPS51111478A (en) A method of producing semiconductor crystal
JPS52155968A (en) Semiconductor wafer and its production
JPS51117589A (en) Glass sealed solar battery equipment and its manufacturing method
JPS5374368A (en) Package for semiconductor device
JPS5411671A (en) Sealing method of semiconductor device
JPS53100772A (en) Package structure of semiconductor device
JPS5231671A (en) Sealing method of semiconductor device
JPS5313353A (en) Display tube and its manufacture
JPS5216168A (en) Sealing method of semiconductor device
JPS51122375A (en) Semiconductor device
JPS5210056A (en) Quartz oscillator
JPS5339868A (en) Packaging method of semiconductor device
JPS51147176A (en) Method of semiconductor package
JPS538567A (en) Sealing structure of semiconductor device