JPS5216168A - Sealing method of semiconductor device - Google Patents
Sealing method of semiconductor deviceInfo
- Publication number
- JPS5216168A JPS5216168A JP9188875A JP9188875A JPS5216168A JP S5216168 A JPS5216168 A JP S5216168A JP 9188875 A JP9188875 A JP 9188875A JP 9188875 A JP9188875 A JP 9188875A JP S5216168 A JPS5216168 A JP S5216168A
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- sealing method
- base
- cap
- prepared
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
PURPOSE: To prevent the sliding of the attaching position of the base and the cap, by sealing by baking the unit prepared by overlaying the cap on the base which is prepared by unifying the lead frame and the ceramic base with the glass layer.
COPYRIGHT: (C)1977,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9188875A JPS5216168A (en) | 1975-07-30 | 1975-07-30 | Sealing method of semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9188875A JPS5216168A (en) | 1975-07-30 | 1975-07-30 | Sealing method of semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5216168A true JPS5216168A (en) | 1977-02-07 |
Family
ID=14039086
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP9188875A Pending JPS5216168A (en) | 1975-07-30 | 1975-07-30 | Sealing method of semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5216168A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58201325A (en) * | 1982-05-20 | 1983-11-24 | Fujitsu Ltd | Sealing method of ceramic package |
JPS607738A (en) * | 1983-06-28 | 1985-01-16 | Fujitsu Ltd | Method and device for manufacturing semiconductor device |
-
1975
- 1975-07-30 JP JP9188875A patent/JPS5216168A/en active Pending
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58201325A (en) * | 1982-05-20 | 1983-11-24 | Fujitsu Ltd | Sealing method of ceramic package |
JPH0419708B2 (en) * | 1982-05-20 | 1992-03-31 | Fujitsu Ltd | |
JPS607738A (en) * | 1983-06-28 | 1985-01-16 | Fujitsu Ltd | Method and device for manufacturing semiconductor device |
JPH0125226B2 (en) * | 1983-06-28 | 1989-05-16 | Fujitsu Ltd |
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