JPS5216168A - Sealing method of semiconductor device - Google Patents

Sealing method of semiconductor device

Info

Publication number
JPS5216168A
JPS5216168A JP9188875A JP9188875A JPS5216168A JP S5216168 A JPS5216168 A JP S5216168A JP 9188875 A JP9188875 A JP 9188875A JP 9188875 A JP9188875 A JP 9188875A JP S5216168 A JPS5216168 A JP S5216168A
Authority
JP
Japan
Prior art keywords
semiconductor device
sealing method
base
cap
prepared
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9188875A
Other languages
Japanese (ja)
Inventor
Seishiro Owaki
Hidekatsu Muroi
Morio Toyooka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP9188875A priority Critical patent/JPS5216168A/en
Publication of JPS5216168A publication Critical patent/JPS5216168A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE: To prevent the sliding of the attaching position of the base and the cap, by sealing by baking the unit prepared by overlaying the cap on the base which is prepared by unifying the lead frame and the ceramic base with the glass layer.
COPYRIGHT: (C)1977,JPO&Japio
JP9188875A 1975-07-30 1975-07-30 Sealing method of semiconductor device Pending JPS5216168A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9188875A JPS5216168A (en) 1975-07-30 1975-07-30 Sealing method of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9188875A JPS5216168A (en) 1975-07-30 1975-07-30 Sealing method of semiconductor device

Publications (1)

Publication Number Publication Date
JPS5216168A true JPS5216168A (en) 1977-02-07

Family

ID=14039086

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9188875A Pending JPS5216168A (en) 1975-07-30 1975-07-30 Sealing method of semiconductor device

Country Status (1)

Country Link
JP (1) JPS5216168A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58201325A (en) * 1982-05-20 1983-11-24 Fujitsu Ltd Sealing method of ceramic package
JPS607738A (en) * 1983-06-28 1985-01-16 Fujitsu Ltd Method and device for manufacturing semiconductor device

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58201325A (en) * 1982-05-20 1983-11-24 Fujitsu Ltd Sealing method of ceramic package
JPH0419708B2 (en) * 1982-05-20 1992-03-31 Fujitsu Ltd
JPS607738A (en) * 1983-06-28 1985-01-16 Fujitsu Ltd Method and device for manufacturing semiconductor device
JPH0125226B2 (en) * 1983-06-28 1989-05-16 Fujitsu Ltd

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