JPS5422773A - Glass-sealed semiconductor device and its manufacture - Google Patents

Glass-sealed semiconductor device and its manufacture

Info

Publication number
JPS5422773A
JPS5422773A JP8738777A JP8738777A JPS5422773A JP S5422773 A JPS5422773 A JP S5422773A JP 8738777 A JP8738777 A JP 8738777A JP 8738777 A JP8738777 A JP 8738777A JP S5422773 A JPS5422773 A JP S5422773A
Authority
JP
Japan
Prior art keywords
manufacture
semiconductor device
glass
sealed semiconductor
pellet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP8738777A
Other languages
Japanese (ja)
Other versions
JPS6058591B2 (en
Inventor
Eiji Yamamoto
Hiroshi Tsuneno
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP52087387A priority Critical patent/JPS6058591B2/en
Publication of JPS5422773A publication Critical patent/JPS5422773A/en
Publication of JPS6058591B2 publication Critical patent/JPS6058591B2/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

PURPOSE: To manufacture a thin and miniature semiconductor device by covering a cap and giving the glass sealing to the space areas after connecting the pellet on the tab and the peripheral leads.
COPYRIGHT: (C)1979,JPO&Japio
JP52087387A 1977-07-22 1977-07-22 Glass-encapsulated semiconductor device and its manufacturing method Expired JPS6058591B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP52087387A JPS6058591B2 (en) 1977-07-22 1977-07-22 Glass-encapsulated semiconductor device and its manufacturing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP52087387A JPS6058591B2 (en) 1977-07-22 1977-07-22 Glass-encapsulated semiconductor device and its manufacturing method

Publications (2)

Publication Number Publication Date
JPS5422773A true JPS5422773A (en) 1979-02-20
JPS6058591B2 JPS6058591B2 (en) 1985-12-20

Family

ID=13913471

Family Applications (1)

Application Number Title Priority Date Filing Date
JP52087387A Expired JPS6058591B2 (en) 1977-07-22 1977-07-22 Glass-encapsulated semiconductor device and its manufacturing method

Country Status (1)

Country Link
JP (1) JPS6058591B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61253115A (en) * 1985-04-30 1986-11-11 Kanai Hiroyuki Direct cooling method in cold wet type wire drawing

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61253115A (en) * 1985-04-30 1986-11-11 Kanai Hiroyuki Direct cooling method in cold wet type wire drawing

Also Published As

Publication number Publication date
JPS6058591B2 (en) 1985-12-20

Similar Documents

Publication Publication Date Title
JPS5422773A (en) Glass-sealed semiconductor device and its manufacture
JPS5228868A (en) Semiconductor device
JPS5213380A (en) Rainfall alarm
JPS5346222A (en) Solid state pick up unit
JPS5362473A (en) Production of semiconductor device
JPS5313353A (en) Display tube and its manufacture
JPS5210038A (en) Terminal device
JPS5374368A (en) Package for semiconductor device
JPS51112292A (en) Semiconductor device
JPS5258370A (en) Semiconductor device
JPS5216168A (en) Sealing method of semiconductor device
JPS548834A (en) Semiconductor rectifying device
JPS52134395A (en) Led display device
JPS52128087A (en) Semiconductor display unit
JPS5211765A (en) Method of manufacturing semiconductor device
JPS53100772A (en) Package structure of semiconductor device
JPS5233349A (en) Humidifier
JPS5387167A (en) Production of glass sealed semiconductor device
JPS5433666A (en) Manufacture for semiconductor device and its manufacturing unit
JPS52126348A (en) Cap-attaching device of electric shaver
JPS51146967A (en) Finger ring
JPS5284961A (en) Manufacture of sealed tube
JPS51135164A (en) Device of changing the direction of wind
JPS51132720A (en) Solid image-pickup device
JPS5397368A (en) Semiconductor device