JPS5422773A - Glass-sealed semiconductor device and its manufacture - Google Patents
Glass-sealed semiconductor device and its manufactureInfo
- Publication number
- JPS5422773A JPS5422773A JP8738777A JP8738777A JPS5422773A JP S5422773 A JPS5422773 A JP S5422773A JP 8738777 A JP8738777 A JP 8738777A JP 8738777 A JP8738777 A JP 8738777A JP S5422773 A JPS5422773 A JP S5422773A
- Authority
- JP
- Japan
- Prior art keywords
- manufacture
- semiconductor device
- glass
- sealed semiconductor
- pellet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
PURPOSE: To manufacture a thin and miniature semiconductor device by covering a cap and giving the glass sealing to the space areas after connecting the pellet on the tab and the peripheral leads.
COPYRIGHT: (C)1979,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP52087387A JPS6058591B2 (en) | 1977-07-22 | 1977-07-22 | Glass-encapsulated semiconductor device and its manufacturing method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP52087387A JPS6058591B2 (en) | 1977-07-22 | 1977-07-22 | Glass-encapsulated semiconductor device and its manufacturing method |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5422773A true JPS5422773A (en) | 1979-02-20 |
JPS6058591B2 JPS6058591B2 (en) | 1985-12-20 |
Family
ID=13913471
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP52087387A Expired JPS6058591B2 (en) | 1977-07-22 | 1977-07-22 | Glass-encapsulated semiconductor device and its manufacturing method |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6058591B2 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61253115A (en) * | 1985-04-30 | 1986-11-11 | Kanai Hiroyuki | Direct cooling method in cold wet type wire drawing |
-
1977
- 1977-07-22 JP JP52087387A patent/JPS6058591B2/en not_active Expired
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61253115A (en) * | 1985-04-30 | 1986-11-11 | Kanai Hiroyuki | Direct cooling method in cold wet type wire drawing |
Also Published As
Publication number | Publication date |
---|---|
JPS6058591B2 (en) | 1985-12-20 |
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