JPS548834A - Semiconductor rectifying device - Google Patents

Semiconductor rectifying device

Info

Publication number
JPS548834A
JPS548834A JP7385777A JP7385777A JPS548834A JP S548834 A JPS548834 A JP S548834A JP 7385777 A JP7385777 A JP 7385777A JP 7385777 A JP7385777 A JP 7385777A JP S548834 A JPS548834 A JP S548834A
Authority
JP
Japan
Prior art keywords
rectifying device
semiconductor rectifying
electrode portion
extended electrode
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP7385777A
Other languages
Japanese (ja)
Other versions
JPS6130429B2 (en
Inventor
Eiji Jimi
Takahiro Sawano
Haruyuki Goto
Fumio Tanabe
Yoshiharu Yotsumoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP7385777A priority Critical patent/JPS548834A/en
Publication of JPS548834A publication Critical patent/JPS548834A/en
Publication of JPS6130429B2 publication Critical patent/JPS6130429B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/102—Material of the semiconductor or solid state bodies
    • H01L2924/1025—Semiconducting materials
    • H01L2924/10251—Elemental semiconductors, i.e. Group IV
    • H01L2924/10253—Silicon [Si]

Abstract

PURPOSE: To provide better heat-fatigue-proof property and a simplified surrounding holder, by improving the extended electrode portion of the semiconductor pellet and the extended electrode portion of the rectifying element.
COPYRIGHT: (C)1979,JPO&Japio
JP7385777A 1977-06-23 1977-06-23 Semiconductor rectifying device Granted JPS548834A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7385777A JPS548834A (en) 1977-06-23 1977-06-23 Semiconductor rectifying device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7385777A JPS548834A (en) 1977-06-23 1977-06-23 Semiconductor rectifying device

Publications (2)

Publication Number Publication Date
JPS548834A true JPS548834A (en) 1979-01-23
JPS6130429B2 JPS6130429B2 (en) 1986-07-14

Family

ID=13530242

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7385777A Granted JPS548834A (en) 1977-06-23 1977-06-23 Semiconductor rectifying device

Country Status (1)

Country Link
JP (1) JPS548834A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58161355A (en) * 1982-03-18 1983-09-24 Sanken Electric Co Ltd Semiconductor rectifying element
JPS61161490A (en) * 1984-12-27 1986-07-22 フラマトーム Device for displacing and connecting cluster of control element in nuclear reactor

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58161355A (en) * 1982-03-18 1983-09-24 Sanken Electric Co Ltd Semiconductor rectifying element
JPS61161490A (en) * 1984-12-27 1986-07-22 フラマトーム Device for displacing and connecting cluster of control element in nuclear reactor

Also Published As

Publication number Publication date
JPS6130429B2 (en) 1986-07-14

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