JPS5372456A - Glass sealing semiconductor device - Google Patents

Glass sealing semiconductor device

Info

Publication number
JPS5372456A
JPS5372456A JP14777276A JP14777276A JPS5372456A JP S5372456 A JPS5372456 A JP S5372456A JP 14777276 A JP14777276 A JP 14777276A JP 14777276 A JP14777276 A JP 14777276A JP S5372456 A JPS5372456 A JP S5372456A
Authority
JP
Japan
Prior art keywords
semiconductor device
glass sealing
sealing semiconductor
placing
prevent
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14777276A
Other languages
Japanese (ja)
Inventor
Eiji Yamamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP14777276A priority Critical patent/JPS5372456A/en
Publication of JPS5372456A publication Critical patent/JPS5372456A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/49105—Connecting at different heights
    • H01L2224/49109—Connecting at different heights outside the semiconductor or solid-state body

Landscapes

  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE: To prevent the sealing glass to cause cracks and to enable multi-pin configuration, by placing the lead frame with a plural number of stages toward height direction.
COPYRIGHT: (C)1978,JPO&Japio
JP14777276A 1976-12-10 1976-12-10 Glass sealing semiconductor device Pending JPS5372456A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14777276A JPS5372456A (en) 1976-12-10 1976-12-10 Glass sealing semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14777276A JPS5372456A (en) 1976-12-10 1976-12-10 Glass sealing semiconductor device

Publications (1)

Publication Number Publication Date
JPS5372456A true JPS5372456A (en) 1978-06-27

Family

ID=15437822

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14777276A Pending JPS5372456A (en) 1976-12-10 1976-12-10 Glass sealing semiconductor device

Country Status (1)

Country Link
JP (1) JPS5372456A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56126948A (en) * 1980-03-12 1981-10-05 Hitachi Ltd Highly integrated semiconductor
US4542259A (en) * 1984-09-19 1985-09-17 Olin Corporation High density packages
US4796078A (en) * 1987-06-15 1989-01-03 International Business Machines Corporation Peripheral/area wire bonding technique
JPH0297041A (en) * 1988-10-03 1990-04-09 Nec Kyushu Ltd Ceramic package
JP2004261512A (en) * 2003-03-04 2004-09-24 Pentax Corp Solid-state image pickup element and electronic endoscope
JPWO2016047130A1 (en) * 2014-09-22 2017-04-27 旭化成エレクトロニクス株式会社 Hall sensor and lens module

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56126948A (en) * 1980-03-12 1981-10-05 Hitachi Ltd Highly integrated semiconductor
US4542259A (en) * 1984-09-19 1985-09-17 Olin Corporation High density packages
US4796078A (en) * 1987-06-15 1989-01-03 International Business Machines Corporation Peripheral/area wire bonding technique
JPH0297041A (en) * 1988-10-03 1990-04-09 Nec Kyushu Ltd Ceramic package
JP2004261512A (en) * 2003-03-04 2004-09-24 Pentax Corp Solid-state image pickup element and electronic endoscope
JPWO2016047130A1 (en) * 2014-09-22 2017-04-27 旭化成エレクトロニクス株式会社 Hall sensor and lens module

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