JPS5372456A - Glass sealing semiconductor device - Google Patents
Glass sealing semiconductor deviceInfo
- Publication number
- JPS5372456A JPS5372456A JP14777276A JP14777276A JPS5372456A JP S5372456 A JPS5372456 A JP S5372456A JP 14777276 A JP14777276 A JP 14777276A JP 14777276 A JP14777276 A JP 14777276A JP S5372456 A JPS5372456 A JP S5372456A
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- glass sealing
- sealing semiconductor
- placing
- prevent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/49105—Connecting at different heights
- H01L2224/49109—Connecting at different heights outside the semiconductor or solid-state body
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Abstract
PURPOSE: To prevent the sealing glass to cause cracks and to enable multi-pin configuration, by placing the lead frame with a plural number of stages toward height direction.
COPYRIGHT: (C)1978,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14777276A JPS5372456A (en) | 1976-12-10 | 1976-12-10 | Glass sealing semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14777276A JPS5372456A (en) | 1976-12-10 | 1976-12-10 | Glass sealing semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5372456A true JPS5372456A (en) | 1978-06-27 |
Family
ID=15437822
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP14777276A Pending JPS5372456A (en) | 1976-12-10 | 1976-12-10 | Glass sealing semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5372456A (en) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS56126948A (en) * | 1980-03-12 | 1981-10-05 | Hitachi Ltd | Highly integrated semiconductor |
US4542259A (en) * | 1984-09-19 | 1985-09-17 | Olin Corporation | High density packages |
US4796078A (en) * | 1987-06-15 | 1989-01-03 | International Business Machines Corporation | Peripheral/area wire bonding technique |
JPH0297041A (en) * | 1988-10-03 | 1990-04-09 | Nec Kyushu Ltd | Ceramic package |
JP2004261512A (en) * | 2003-03-04 | 2004-09-24 | Pentax Corp | Solid-state image pickup element and electronic endoscope |
JPWO2016047130A1 (en) * | 2014-09-22 | 2017-04-27 | 旭化成エレクトロニクス株式会社 | Hall sensor and lens module |
-
1976
- 1976-12-10 JP JP14777276A patent/JPS5372456A/en active Pending
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS56126948A (en) * | 1980-03-12 | 1981-10-05 | Hitachi Ltd | Highly integrated semiconductor |
US4542259A (en) * | 1984-09-19 | 1985-09-17 | Olin Corporation | High density packages |
US4796078A (en) * | 1987-06-15 | 1989-01-03 | International Business Machines Corporation | Peripheral/area wire bonding technique |
JPH0297041A (en) * | 1988-10-03 | 1990-04-09 | Nec Kyushu Ltd | Ceramic package |
JP2004261512A (en) * | 2003-03-04 | 2004-09-24 | Pentax Corp | Solid-state image pickup element and electronic endoscope |
JPWO2016047130A1 (en) * | 2014-09-22 | 2017-04-27 | 旭化成エレクトロニクス株式会社 | Hall sensor and lens module |
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