JPS51114868A - Position alignment equipment - Google Patents
Position alignment equipmentInfo
- Publication number
- JPS51114868A JPS51114868A JP50039103A JP3910375A JPS51114868A JP S51114868 A JPS51114868 A JP S51114868A JP 50039103 A JP50039103 A JP 50039103A JP 3910375 A JP3910375 A JP 3910375A JP S51114868 A JPS51114868 A JP S51114868A
- Authority
- JP
- Japan
- Prior art keywords
- position alignment
- alignment equipment
- equipment
- automate
- pellets
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
- Control Of Position Or Direction (AREA)
Abstract
PURPOSE: Automate the correction of positions of pellets, etc., inclusive of position detection in the wire bonding process.
COPYRIGHT: (C)1976,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP50039103A JPS51114868A (en) | 1975-04-02 | 1975-04-02 | Position alignment equipment |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP50039103A JPS51114868A (en) | 1975-04-02 | 1975-04-02 | Position alignment equipment |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS51114868A true JPS51114868A (en) | 1976-10-08 |
Family
ID=12543723
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP50039103A Pending JPS51114868A (en) | 1975-04-02 | 1975-04-02 | Position alignment equipment |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS51114868A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63196056A (en) * | 1987-02-10 | 1988-08-15 | Mitsubishi Electric Corp | Device for assembling semiconductor |
-
1975
- 1975-04-02 JP JP50039103A patent/JPS51114868A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63196056A (en) * | 1987-02-10 | 1988-08-15 | Mitsubishi Electric Corp | Device for assembling semiconductor |
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