JPS5213771A - Semiconductor unit manufacturing process - Google Patents

Semiconductor unit manufacturing process

Info

Publication number
JPS5213771A
JPS5213771A JP50089475A JP8947575A JPS5213771A JP S5213771 A JPS5213771 A JP S5213771A JP 50089475 A JP50089475 A JP 50089475A JP 8947575 A JP8947575 A JP 8947575A JP S5213771 A JPS5213771 A JP S5213771A
Authority
JP
Japan
Prior art keywords
semiconductor unit
manufacturing process
unit manufacturing
semiconductor
sure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP50089475A
Other languages
Japanese (ja)
Inventor
Kazunari Michii
Kenji Yamane
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP50089475A priority Critical patent/JPS5213771A/en
Publication of JPS5213771A publication Critical patent/JPS5213771A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto

Landscapes

  • Wire Bonding (AREA)

Abstract

PURPOSE: To permit a sure and easy bonding of inner leads in flexible films inside and outside a semiconductor unit.
COPYRIGHT: (C)1977,JPO&Japio
JP50089475A 1975-07-22 1975-07-22 Semiconductor unit manufacturing process Pending JPS5213771A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP50089475A JPS5213771A (en) 1975-07-22 1975-07-22 Semiconductor unit manufacturing process

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP50089475A JPS5213771A (en) 1975-07-22 1975-07-22 Semiconductor unit manufacturing process

Publications (1)

Publication Number Publication Date
JPS5213771A true JPS5213771A (en) 1977-02-02

Family

ID=13971740

Family Applications (1)

Application Number Title Priority Date Filing Date
JP50089475A Pending JPS5213771A (en) 1975-07-22 1975-07-22 Semiconductor unit manufacturing process

Country Status (1)

Country Link
JP (1) JPS5213771A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5384678A (en) * 1976-12-29 1978-07-26 Fujitsu Ltd Electrode forming method of semiconductor device
JPS6068637A (en) * 1983-09-26 1985-04-19 Oki Electric Ind Co Ltd Bump electrode of semiconductor

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4921982A (en) * 1972-06-20 1974-02-26

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4921982A (en) * 1972-06-20 1974-02-26

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5384678A (en) * 1976-12-29 1978-07-26 Fujitsu Ltd Electrode forming method of semiconductor device
JPS6068637A (en) * 1983-09-26 1985-04-19 Oki Electric Ind Co Ltd Bump electrode of semiconductor

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