JPS533084A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS533084A
JPS533084A JP7695576A JP7695576A JPS533084A JP S533084 A JPS533084 A JP S533084A JP 7695576 A JP7695576 A JP 7695576A JP 7695576 A JP7695576 A JP 7695576A JP S533084 A JPS533084 A JP S533084A
Authority
JP
Japan
Prior art keywords
semiconductor device
occuring
simplification
achieve
elements
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7695576A
Other languages
Japanese (ja)
Inventor
Masaru Nakamura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP7695576A priority Critical patent/JPS533084A/en
Publication of JPS533084A publication Critical patent/JPS533084A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto

Abstract

PURPOSE: To achieve the simplification of production process and prevent the leakage defect between elements occuring in Au material by forming laminated wiring layers of Ti-Pt-Al.
COPYRIGHT: (C)1978,JPO&Japio
JP7695576A 1976-06-29 1976-06-29 Semiconductor device Pending JPS533084A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7695576A JPS533084A (en) 1976-06-29 1976-06-29 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7695576A JPS533084A (en) 1976-06-29 1976-06-29 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS533084A true JPS533084A (en) 1978-01-12

Family

ID=13620192

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7695576A Pending JPS533084A (en) 1976-06-29 1976-06-29 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS533084A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6038850A (en) * 1983-08-11 1985-02-28 Nippon Telegr & Teleph Corp <Ntt> Semiconductor device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6038850A (en) * 1983-08-11 1985-02-28 Nippon Telegr & Teleph Corp <Ntt> Semiconductor device

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