JPS5377178A - Chuking device of semiconductor element substrate - Google Patents

Chuking device of semiconductor element substrate

Info

Publication number
JPS5377178A
JPS5377178A JP15325876A JP15325876A JPS5377178A JP S5377178 A JPS5377178 A JP S5377178A JP 15325876 A JP15325876 A JP 15325876A JP 15325876 A JP15325876 A JP 15325876A JP S5377178 A JPS5377178 A JP S5377178A
Authority
JP
Japan
Prior art keywords
chuking
semiconductor element
element substrate
chucking
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP15325876A
Other languages
Japanese (ja)
Other versions
JPS5343021B2 (en
Inventor
Munenori Kanai
Makoto Asakawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Telegraph and Telephone Corp
Original Assignee
Nippon Telegraph and Telephone Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Telegraph and Telephone Corp filed Critical Nippon Telegraph and Telephone Corp
Priority to JP15325876A priority Critical patent/JPS5377178A/en
Publication of JPS5377178A publication Critical patent/JPS5377178A/en
Publication of JPS5343021B2 publication Critical patent/JPS5343021B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Feeding Of Workpieces (AREA)
  • Sheets, Magazines, And Separation Thereof (AREA)
  • Gripping Jigs, Holding Jigs, And Positioning Jigs (AREA)

Abstract

PURPOSE: To make possible chucking in a vacuum by the oscillating and vertical motions in the radiation direction of a wafer of 3 or more notched chucking jaws encircling the outside circumference of the substrate.
COPYRIGHT: (C)1978,JPO&Japio
JP15325876A 1976-12-20 1976-12-20 Chuking device of semiconductor element substrate Granted JPS5377178A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15325876A JPS5377178A (en) 1976-12-20 1976-12-20 Chuking device of semiconductor element substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15325876A JPS5377178A (en) 1976-12-20 1976-12-20 Chuking device of semiconductor element substrate

Publications (2)

Publication Number Publication Date
JPS5377178A true JPS5377178A (en) 1978-07-08
JPS5343021B2 JPS5343021B2 (en) 1978-11-16

Family

ID=15558512

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15325876A Granted JPS5377178A (en) 1976-12-20 1976-12-20 Chuking device of semiconductor element substrate

Country Status (1)

Country Link
JP (1) JPS5377178A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60142068U (en) * 1984-02-27 1985-09-20 住倉工業株式会社 Chucking mechanism in cutlet spring tightening machine
JPS6489530A (en) * 1987-09-30 1989-04-04 Toshiba Corp Automatic setting device for semiconductor wafer

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60142068U (en) * 1984-02-27 1985-09-20 住倉工業株式会社 Chucking mechanism in cutlet spring tightening machine
JPS6489530A (en) * 1987-09-30 1989-04-04 Toshiba Corp Automatic setting device for semiconductor wafer

Also Published As

Publication number Publication date
JPS5343021B2 (en) 1978-11-16

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