JPS6489530A - Automatic setting device for semiconductor wafer - Google Patents
Automatic setting device for semiconductor waferInfo
- Publication number
- JPS6489530A JPS6489530A JP24738287A JP24738287A JPS6489530A JP S6489530 A JPS6489530 A JP S6489530A JP 24738287 A JP24738287 A JP 24738287A JP 24738287 A JP24738287 A JP 24738287A JP S6489530 A JPS6489530 A JP S6489530A
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor wafer
- clicks
- cam
- roller
- contact
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
PURPOSE:To allow a damage-free setting and resetting of a semiconductor wafer by providing a plurality of clicks holding the semiconductor by contact with the surrounding of the semiconductor wafer, and driving means for displacing such clicks in the radius direction of the semiconductor wafer. CONSTITUTION:For clicks 14, 14,... are formed so that they change positions along a radius direction line at the bottom of a housing 10 and hold and release a semiconductor wafer 21. In other words, a pair of mechanisms supporting a shaft 17 around which one end of two types of arms 15, 16 comprising not only the clicks 14, 14 at the tip but also a roller 18 by bearing on the way thereof are formed. The arms 15, 16 are connected by an extension coil spring 17 in extension. According to the constitution, each click 14 is constantly energized in such a way as to be pulled toward the center of the housing 10, thereby causing a roller 18 to come in contact with the peripheral of a cam 13. Therefore, upon rotation of the cam 13 the roller 18 is displaced in the radius direction while being in contact with the peripheral of the cam 13, whereby the click 14 is also displaced in the radium direction.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24738287A JPS6489530A (en) | 1987-09-30 | 1987-09-30 | Automatic setting device for semiconductor wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24738287A JPS6489530A (en) | 1987-09-30 | 1987-09-30 | Automatic setting device for semiconductor wafer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6489530A true JPS6489530A (en) | 1989-04-04 |
Family
ID=17162599
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP24738287A Pending JPS6489530A (en) | 1987-09-30 | 1987-09-30 | Automatic setting device for semiconductor wafer |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6489530A (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5377178A (en) * | 1976-12-20 | 1978-07-08 | Nippon Telegr & Teleph Corp <Ntt> | Chuking device of semiconductor element substrate |
| JPS6054448A (en) * | 1983-09-05 | 1985-03-28 | Toshiba Corp | Attaching and detaching mechanism of wafer |
| JPS6171944A (en) * | 1984-09-15 | 1986-04-12 | インデツクス‐フエルバルツングス ゲゼルシヤフト ミツト ベシユレンクテル ハフツング | Operating device for work |
-
1987
- 1987-09-30 JP JP24738287A patent/JPS6489530A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5377178A (en) * | 1976-12-20 | 1978-07-08 | Nippon Telegr & Teleph Corp <Ntt> | Chuking device of semiconductor element substrate |
| JPS6054448A (en) * | 1983-09-05 | 1985-03-28 | Toshiba Corp | Attaching and detaching mechanism of wafer |
| JPS6171944A (en) * | 1984-09-15 | 1986-04-12 | インデツクス‐フエルバルツングス ゲゼルシヤフト ミツト ベシユレンクテル ハフツング | Operating device for work |
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