JPS5336467A - Semiconductor pellet fixture to metal substrate - Google Patents

Semiconductor pellet fixture to metal substrate

Info

Publication number
JPS5336467A
JPS5336467A JP11079076A JP11079076A JPS5336467A JP S5336467 A JPS5336467 A JP S5336467A JP 11079076 A JP11079076 A JP 11079076A JP 11079076 A JP11079076 A JP 11079076A JP S5336467 A JPS5336467 A JP S5336467A
Authority
JP
Japan
Prior art keywords
fixture
metal substrate
semiconductor pellet
pellet
exfoliation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11079076A
Other languages
Japanese (ja)
Inventor
Hitoshi Ishimori
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP11079076A priority Critical patent/JPS5336467A/en
Publication of JPS5336467A publication Critical patent/JPS5336467A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H01L2224/83191—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/1015—Shape
    • H01L2924/10155—Shape being other than a cuboid
    • H01L2924/10158—Shape being other than a cuboid at the passive surface

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)

Abstract

PURPOSE: To prevent an exfoliation between the metal plate and the pellet and thus to remove air bubbles within the soldered layer by providing a semispherical solder material and a protrusion on the pellet rear surface.
COPYRIGHT: (C)1978,JPO&Japio
JP11079076A 1976-09-17 1976-09-17 Semiconductor pellet fixture to metal substrate Pending JPS5336467A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11079076A JPS5336467A (en) 1976-09-17 1976-09-17 Semiconductor pellet fixture to metal substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11079076A JPS5336467A (en) 1976-09-17 1976-09-17 Semiconductor pellet fixture to metal substrate

Publications (1)

Publication Number Publication Date
JPS5336467A true JPS5336467A (en) 1978-04-04

Family

ID=14544688

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11079076A Pending JPS5336467A (en) 1976-09-17 1976-09-17 Semiconductor pellet fixture to metal substrate

Country Status (1)

Country Link
JP (1) JPS5336467A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010040651A (en) * 2008-08-01 2010-02-18 Fuji Electric Systems Co Ltd Semiconductor device and method of manufacturing the same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010040651A (en) * 2008-08-01 2010-02-18 Fuji Electric Systems Co Ltd Semiconductor device and method of manufacturing the same

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