JPS56123879A - Thick film circuit substrate - Google Patents

Thick film circuit substrate

Info

Publication number
JPS56123879A
JPS56123879A JP2752280A JP2752280A JPS56123879A JP S56123879 A JPS56123879 A JP S56123879A JP 2752280 A JP2752280 A JP 2752280A JP 2752280 A JP2752280 A JP 2752280A JP S56123879 A JPS56123879 A JP S56123879A
Authority
JP
Japan
Prior art keywords
slit
organic film
circuit substrate
thick film
film circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2752280A
Other languages
Japanese (ja)
Other versions
JPS6362398B2 (en
Inventor
Takafumi Endo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP2752280A priority Critical patent/JPS56123879A/en
Publication of JPS56123879A publication Critical patent/JPS56123879A/en
Publication of JPS6362398B2 publication Critical patent/JPS6362398B2/ja
Granted legal-status Critical Current

Links

Abstract

PURPOSE: To flatten an organic film in the neighborhood of a slit and facilitate removal of residual resistance paste by providing a land near a region where a slit is provided on the substrate with regard to a thick film circuit substrate used for a thermal head.
CONSTITUTION: When a conductor pattern 4 is preformed on an alumina substrate 1, a land 5 of the same material as a conductor pattern 4 is formed in the external periphery of a plotted region where a slit 2 of an organic film 2 is provided. Following to this process, the organic film 2 where a slit 3 is formed, is pressureattached, this process, in turn easing an unevenness in the organic film 2 near the slit 3. Resultingly the organic film has a flat surface, so that there is no residual resisitance paste which is unnecessary when an unnecessary part is removed. Thus it is possible to form a fine pattern of a resistance.
COPYRIGHT: (C)1981,JPO&Japio
JP2752280A 1980-03-04 1980-03-04 Thick film circuit substrate Granted JPS56123879A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2752280A JPS56123879A (en) 1980-03-04 1980-03-04 Thick film circuit substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2752280A JPS56123879A (en) 1980-03-04 1980-03-04 Thick film circuit substrate

Publications (2)

Publication Number Publication Date
JPS56123879A true JPS56123879A (en) 1981-09-29
JPS6362398B2 JPS6362398B2 (en) 1988-12-02

Family

ID=12223449

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2752280A Granted JPS56123879A (en) 1980-03-04 1980-03-04 Thick film circuit substrate

Country Status (1)

Country Link
JP (1) JPS56123879A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60171173A (en) * 1984-02-15 1985-09-04 Copal Co Ltd Thermal head
JPS61114862A (en) * 1984-11-09 1986-06-02 Hitachi Ltd Manufacture of thermosensitive recording head

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5513051U (en) * 1978-07-11 1980-01-28
JPS5522956A (en) * 1978-08-08 1980-02-19 Toshiba Corp Heat sensitive head

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5513051B2 (en) * 1974-06-05 1980-04-05

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5513051U (en) * 1978-07-11 1980-01-28
JPS5522956A (en) * 1978-08-08 1980-02-19 Toshiba Corp Heat sensitive head

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60171173A (en) * 1984-02-15 1985-09-04 Copal Co Ltd Thermal head
JPS61114862A (en) * 1984-11-09 1986-06-02 Hitachi Ltd Manufacture of thermosensitive recording head
JPH0542350B2 (en) * 1984-11-09 1993-06-28 Hitachi Ltd

Also Published As

Publication number Publication date
JPS6362398B2 (en) 1988-12-02

Similar Documents

Publication Publication Date Title
JPS56123879A (en) Thick film circuit substrate
JPS5235281A (en) Peparation of flexible base for printed circuit
JPS52149076A (en) Semiconductor integrated circuit and its preparing method
JPS5298750A (en) Method of forming imitation etched pattern
JPS533081A (en) Integrated circuit wiring method
JPS535571A (en) Circuit block and its manufacture
JPS534469A (en) Semiconductor device
JPS51118391A (en) Manufacturing process for semiconducter unit
JPS52117550A (en) Electrode formation method
JPS53139476A (en) Manufacture of semiconductor device
JPS5217846A (en) Liquid crystal indicator
JPS5341177A (en) Mounting method of electronic parts
JPS5412265A (en) Production of semiconductor elements
JPS52131462A (en) Manufacture of semiconductor device
JPS5289326A (en) Conductive recording medium
JPS52146209A (en) Formation of epitaxial layer
JPS5380167A (en) Manufacture of semiconductor device
JPS52147084A (en) Production of semiconductor device
JPS5368070A (en) Etching method
JPS5336467A (en) Semiconductor pellet fixture to metal substrate
JPS5384712A (en) Photographic material
JPS5251872A (en) Production of semiconductor device
JPS5227371A (en) Pattern film formed on upper surface of substrate
JPS53118993A (en) Manufacture for semiconductor device
JPS5217005A (en) Manufacturing method of magnetic recording sheet