JPS56123879A - Thick film circuit substrate - Google Patents
Thick film circuit substrateInfo
- Publication number
- JPS56123879A JPS56123879A JP2752280A JP2752280A JPS56123879A JP S56123879 A JPS56123879 A JP S56123879A JP 2752280 A JP2752280 A JP 2752280A JP 2752280 A JP2752280 A JP 2752280A JP S56123879 A JPS56123879 A JP S56123879A
- Authority
- JP
- Japan
- Prior art keywords
- slit
- organic film
- circuit substrate
- thick film
- film circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Abstract
PURPOSE: To flatten an organic film in the neighborhood of a slit and facilitate removal of residual resistance paste by providing a land near a region where a slit is provided on the substrate with regard to a thick film circuit substrate used for a thermal head.
CONSTITUTION: When a conductor pattern 4 is preformed on an alumina substrate 1, a land 5 of the same material as a conductor pattern 4 is formed in the external periphery of a plotted region where a slit 2 of an organic film 2 is provided. Following to this process, the organic film 2 where a slit 3 is formed, is pressureattached, this process, in turn easing an unevenness in the organic film 2 near the slit 3. Resultingly the organic film has a flat surface, so that there is no residual resisitance paste which is unnecessary when an unnecessary part is removed. Thus it is possible to form a fine pattern of a resistance.
COPYRIGHT: (C)1981,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2752280A JPS56123879A (en) | 1980-03-04 | 1980-03-04 | Thick film circuit substrate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2752280A JPS56123879A (en) | 1980-03-04 | 1980-03-04 | Thick film circuit substrate |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS56123879A true JPS56123879A (en) | 1981-09-29 |
JPS6362398B2 JPS6362398B2 (en) | 1988-12-02 |
Family
ID=12223449
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2752280A Granted JPS56123879A (en) | 1980-03-04 | 1980-03-04 | Thick film circuit substrate |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS56123879A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60171173A (en) * | 1984-02-15 | 1985-09-04 | Copal Co Ltd | Thermal head |
JPS61114862A (en) * | 1984-11-09 | 1986-06-02 | Hitachi Ltd | Manufacture of thermosensitive recording head |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5513051U (en) * | 1978-07-11 | 1980-01-28 | ||
JPS5522956A (en) * | 1978-08-08 | 1980-02-19 | Toshiba Corp | Heat sensitive head |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5513051B2 (en) * | 1974-06-05 | 1980-04-05 |
-
1980
- 1980-03-04 JP JP2752280A patent/JPS56123879A/en active Granted
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5513051U (en) * | 1978-07-11 | 1980-01-28 | ||
JPS5522956A (en) * | 1978-08-08 | 1980-02-19 | Toshiba Corp | Heat sensitive head |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60171173A (en) * | 1984-02-15 | 1985-09-04 | Copal Co Ltd | Thermal head |
JPS61114862A (en) * | 1984-11-09 | 1986-06-02 | Hitachi Ltd | Manufacture of thermosensitive recording head |
JPH0542350B2 (en) * | 1984-11-09 | 1993-06-28 | Hitachi Ltd |
Also Published As
Publication number | Publication date |
---|---|
JPS6362398B2 (en) | 1988-12-02 |
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