JPS52114271A - Semiconductor pellet mounting structure for substrate - Google Patents

Semiconductor pellet mounting structure for substrate

Info

Publication number
JPS52114271A
JPS52114271A JP2991876A JP2991876A JPS52114271A JP S52114271 A JPS52114271 A JP S52114271A JP 2991876 A JP2991876 A JP 2991876A JP 2991876 A JP2991876 A JP 2991876A JP S52114271 A JPS52114271 A JP S52114271A
Authority
JP
Japan
Prior art keywords
substrate
mounting structure
semiconductor pellet
pellet
pellet mounting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2991876A
Other languages
Japanese (ja)
Inventor
Tadatoshi Kawakami
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP2991876A priority Critical patent/JPS52114271A/en
Publication of JPS52114271A publication Critical patent/JPS52114271A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/2612—Auxiliary members for layer connectors, e.g. spacers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15151—Shape the die mounting substrate comprising an aperture, e.g. for underfilling, outgassing, window type wire connections

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)

Abstract

PURPOSE: To prevent peeling of a pellet by brazing the pellet to a substrate in which a hole smaller than the pellet area is opened, through a kovar board of nearly an equivalent area as the semiconductor pellet.
COPYRIGHT: (C)1977,JPO&Japio
JP2991876A 1976-03-22 1976-03-22 Semiconductor pellet mounting structure for substrate Pending JPS52114271A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2991876A JPS52114271A (en) 1976-03-22 1976-03-22 Semiconductor pellet mounting structure for substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2991876A JPS52114271A (en) 1976-03-22 1976-03-22 Semiconductor pellet mounting structure for substrate

Publications (1)

Publication Number Publication Date
JPS52114271A true JPS52114271A (en) 1977-09-24

Family

ID=12289364

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2991876A Pending JPS52114271A (en) 1976-03-22 1976-03-22 Semiconductor pellet mounting structure for substrate

Country Status (1)

Country Link
JP (1) JPS52114271A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60249351A (en) * 1984-05-24 1985-12-10 Fujitsu Ltd Boil-cooled type circuit board
JPS60254644A (en) * 1984-05-31 1985-12-16 Fujitsu Ltd Circuit board for ebullition/cooling

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60249351A (en) * 1984-05-24 1985-12-10 Fujitsu Ltd Boil-cooled type circuit board
JPH038587B2 (en) * 1984-05-24 1991-02-06 Fujitsu Ltd
JPS60254644A (en) * 1984-05-31 1985-12-16 Fujitsu Ltd Circuit board for ebullition/cooling
JPH0315822B2 (en) * 1984-05-31 1991-03-04 Fujitsu Ltd

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