JPS5412270A - Integrated circuit rackage - Google Patents

Integrated circuit rackage

Info

Publication number
JPS5412270A
JPS5412270A JP7463977A JP7463977A JPS5412270A JP S5412270 A JPS5412270 A JP S5412270A JP 7463977 A JP7463977 A JP 7463977A JP 7463977 A JP7463977 A JP 7463977A JP S5412270 A JPS5412270 A JP S5412270A
Authority
JP
Japan
Prior art keywords
rackage
integrated circuit
chips
holes
chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7463977A
Other languages
Japanese (ja)
Inventor
Mitsuru Nitta
Toshi Sano
Akihiro Dotani
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP7463977A priority Critical patent/JPS5412270A/en
Publication of JPS5412270A publication Critical patent/JPS5412270A/en
Pending legal-status Critical Current

Links

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

PURPOSE: To make possible direct mounting of chips to heat sinks and enhance heat radiating effect by using a substrate opened with holes at its IC-chip-mounting portions as well as to facilitate bonding by making the depth of the holes equal to the thickness of the chips.
COPYRIGHT: (C)1979,JPO&Japio
JP7463977A 1977-06-22 1977-06-22 Integrated circuit rackage Pending JPS5412270A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7463977A JPS5412270A (en) 1977-06-22 1977-06-22 Integrated circuit rackage

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7463977A JPS5412270A (en) 1977-06-22 1977-06-22 Integrated circuit rackage

Publications (1)

Publication Number Publication Date
JPS5412270A true JPS5412270A (en) 1979-01-29

Family

ID=13552972

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7463977A Pending JPS5412270A (en) 1977-06-22 1977-06-22 Integrated circuit rackage

Country Status (1)

Country Link
JP (1) JPS5412270A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4598308A (en) * 1984-04-02 1986-07-01 Burroughs Corporation Easily repairable, low cost, high speed electromechanical assembly of integrated circuit die
JPH098213A (en) * 1995-06-16 1997-01-10 Nec Corp Method for mounting semiconductor element and multichip module manufactured by it

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4845174A (en) * 1971-02-05 1973-06-28

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4845174A (en) * 1971-02-05 1973-06-28

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4598308A (en) * 1984-04-02 1986-07-01 Burroughs Corporation Easily repairable, low cost, high speed electromechanical assembly of integrated circuit die
JPH098213A (en) * 1995-06-16 1997-01-10 Nec Corp Method for mounting semiconductor element and multichip module manufactured by it

Similar Documents

Publication Publication Date Title
JPS5435689A (en) Semiconductor integrated circuit device
JPS5423484A (en) Semiconductor integrated circuit and its manufacture
JPS53108382A (en) Semiconductor device
JPS5412270A (en) Integrated circuit rackage
JPS5326689A (en) Semiconductor integrated circuit unit
JPS53126276A (en) Heat dissipation construction of multichip mounting substrate
JPS53128285A (en) Semiconductor device and production of the same
JPS53139468A (en) Mounting structure of resin mold semiconductor device
JPS5416992A (en) Light emitting diode
JPS53144695A (en) Semiconductor laser device
JPS5411666A (en) Microwave high output transistor
JPS53126275A (en) Semiconductor device
JPS5394885A (en) Mount structure for semiconductor laser element
JPS53121490A (en) Semiconductor device
JPS52114271A (en) Semiconductor pellet mounting structure for substrate
JPS5333077A (en) Semiconductor integrated circuit
JPS5220773A (en) Semi-conductor element
JPS5418280A (en) Resin sealed semiconductor device
JPS5411690A (en) Semiconductor laser unit
JPS5432078A (en) Semiconductor device
JPS542069A (en) Semiconductor device
JPS53115179A (en) Cooling method of circuit parts
JPS5399782A (en) Semiconductor integrated circuit device and its manufacture
JPS52103983A (en) Semiconductor integrated circuit
JPS53139476A (en) Manufacture of semiconductor device