JPS5412270A - Integrated circuit rackage - Google Patents
Integrated circuit rackageInfo
- Publication number
- JPS5412270A JPS5412270A JP7463977A JP7463977A JPS5412270A JP S5412270 A JPS5412270 A JP S5412270A JP 7463977 A JP7463977 A JP 7463977A JP 7463977 A JP7463977 A JP 7463977A JP S5412270 A JPS5412270 A JP S5412270A
- Authority
- JP
- Japan
- Prior art keywords
- rackage
- integrated circuit
- chips
- holes
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
PURPOSE: To make possible direct mounting of chips to heat sinks and enhance heat radiating effect by using a substrate opened with holes at its IC-chip-mounting portions as well as to facilitate bonding by making the depth of the holes equal to the thickness of the chips.
COPYRIGHT: (C)1979,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7463977A JPS5412270A (en) | 1977-06-22 | 1977-06-22 | Integrated circuit rackage |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7463977A JPS5412270A (en) | 1977-06-22 | 1977-06-22 | Integrated circuit rackage |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5412270A true JPS5412270A (en) | 1979-01-29 |
Family
ID=13552972
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP7463977A Pending JPS5412270A (en) | 1977-06-22 | 1977-06-22 | Integrated circuit rackage |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5412270A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4598308A (en) * | 1984-04-02 | 1986-07-01 | Burroughs Corporation | Easily repairable, low cost, high speed electromechanical assembly of integrated circuit die |
JPH098213A (en) * | 1995-06-16 | 1997-01-10 | Nec Corp | Method for mounting semiconductor element and multichip module manufactured by it |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4845174A (en) * | 1971-02-05 | 1973-06-28 |
-
1977
- 1977-06-22 JP JP7463977A patent/JPS5412270A/en active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4845174A (en) * | 1971-02-05 | 1973-06-28 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4598308A (en) * | 1984-04-02 | 1986-07-01 | Burroughs Corporation | Easily repairable, low cost, high speed electromechanical assembly of integrated circuit die |
JPH098213A (en) * | 1995-06-16 | 1997-01-10 | Nec Corp | Method for mounting semiconductor element and multichip module manufactured by it |
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