JPS52143763A - Soldering method to holding substrate for semiconductor substrates - Google Patents

Soldering method to holding substrate for semiconductor substrates

Info

Publication number
JPS52143763A
JPS52143763A JP6002776A JP6002776A JPS52143763A JP S52143763 A JPS52143763 A JP S52143763A JP 6002776 A JP6002776 A JP 6002776A JP 6002776 A JP6002776 A JP 6002776A JP S52143763 A JPS52143763 A JP S52143763A
Authority
JP
Japan
Prior art keywords
holding substrate
semiconductor substrates
soldering method
substrate
holding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6002776A
Other languages
Japanese (ja)
Inventor
Sakae Kikuchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP6002776A priority Critical patent/JPS52143763A/en
Publication of JPS52143763A publication Critical patent/JPS52143763A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H01L2224/83193—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed on both the semiconductor or solid-state body and another item or body to be connected to the semiconductor or solid-state body

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)

Abstract

PURPOSE: To improve reliability and workability by brazing a semiconductor substrate and holding substrate by gold-tin alloy.
COPYRIGHT: (C)1977,JPO&Japio
JP6002776A 1976-05-26 1976-05-26 Soldering method to holding substrate for semiconductor substrates Pending JPS52143763A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6002776A JPS52143763A (en) 1976-05-26 1976-05-26 Soldering method to holding substrate for semiconductor substrates

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6002776A JPS52143763A (en) 1976-05-26 1976-05-26 Soldering method to holding substrate for semiconductor substrates

Publications (1)

Publication Number Publication Date
JPS52143763A true JPS52143763A (en) 1977-11-30

Family

ID=13130165

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6002776A Pending JPS52143763A (en) 1976-05-26 1976-05-26 Soldering method to holding substrate for semiconductor substrates

Country Status (1)

Country Link
JP (1) JPS52143763A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5643736A (en) * 1979-09-18 1981-04-22 Nec Corp Attaching method of semiconductor element
JPS5778144A (en) * 1980-11-04 1982-05-15 Hitachi Ltd Semiconductor device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5643736A (en) * 1979-09-18 1981-04-22 Nec Corp Attaching method of semiconductor element
JPH0118580B2 (en) * 1979-09-18 1989-04-06 Nippon Electric Co
JPS5778144A (en) * 1980-11-04 1982-05-15 Hitachi Ltd Semiconductor device

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