JPS5295175A - Pellet bonding - Google Patents

Pellet bonding

Info

Publication number
JPS5295175A
JPS5295175A JP1145676A JP1145676A JPS5295175A JP S5295175 A JPS5295175 A JP S5295175A JP 1145676 A JP1145676 A JP 1145676A JP 1145676 A JP1145676 A JP 1145676A JP S5295175 A JPS5295175 A JP S5295175A
Authority
JP
Japan
Prior art keywords
pellet
pellet bonding
attaching
bonding
board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1145676A
Other languages
Japanese (ja)
Inventor
Masayoshi Yoshimura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP1145676A priority Critical patent/JPS5295175A/en
Publication of JPS5295175A publication Critical patent/JPS5295175A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements

Landscapes

  • Die Bonding (AREA)

Abstract

PURPOSE: To prevent from the pellet crack while bonding by attaching at the radiation board through the conductive adherent layer after attaching the pellet on the thin copper board by the use of gold silicon layer.
COPYRIGHT: (C)1977,JPO&Japio
JP1145676A 1976-02-06 1976-02-06 Pellet bonding Pending JPS5295175A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1145676A JPS5295175A (en) 1976-02-06 1976-02-06 Pellet bonding

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1145676A JPS5295175A (en) 1976-02-06 1976-02-06 Pellet bonding

Publications (1)

Publication Number Publication Date
JPS5295175A true JPS5295175A (en) 1977-08-10

Family

ID=11778585

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1145676A Pending JPS5295175A (en) 1976-02-06 1976-02-06 Pellet bonding

Country Status (1)

Country Link
JP (1) JPS5295175A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016208766A (en) * 2015-04-27 2016-12-08 株式会社デンソー Controller-integrated dynamo-electric machine

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016208766A (en) * 2015-04-27 2016-12-08 株式会社デンソー Controller-integrated dynamo-electric machine

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