JPS57153457A - Semiconductor mounting apparatus - Google Patents

Semiconductor mounting apparatus

Info

Publication number
JPS57153457A
JPS57153457A JP3846081A JP3846081A JPS57153457A JP S57153457 A JPS57153457 A JP S57153457A JP 3846081 A JP3846081 A JP 3846081A JP 3846081 A JP3846081 A JP 3846081A JP S57153457 A JPS57153457 A JP S57153457A
Authority
JP
Japan
Prior art keywords
substrate
coupled
heat sink
mounting apparatus
pad
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP3846081A
Other languages
Japanese (ja)
Other versions
JPS6217872B2 (en
Inventor
Hiroyuki Hamaguchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP3846081A priority Critical patent/JPS57153457A/en
Publication of JPS57153457A publication Critical patent/JPS57153457A/en
Publication of JPS6217872B2 publication Critical patent/JPS6217872B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

PURPOSE:To permit a mounting with a high density, a good thermal dispersion property and of a short wiring length by a method wherein a chip is coupled to a heat sink having a space capable of attaching a semiconductor chip to the under face and formed independently and is mounted on a substrate. CONSTITUTION:The back face of semiconductor chip 13 with a lead is coupled to the under face of a heat sink 7. A leg 8 of the heat sink 7 is soldered to a pad 11 on a substrate 9. Thereafter, a lead 12 is coupled to a pad 10 on the substrate 9.
JP3846081A 1981-03-17 1981-03-17 Semiconductor mounting apparatus Granted JPS57153457A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3846081A JPS57153457A (en) 1981-03-17 1981-03-17 Semiconductor mounting apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3846081A JPS57153457A (en) 1981-03-17 1981-03-17 Semiconductor mounting apparatus

Publications (2)

Publication Number Publication Date
JPS57153457A true JPS57153457A (en) 1982-09-22
JPS6217872B2 JPS6217872B2 (en) 1987-04-20

Family

ID=12525861

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3846081A Granted JPS57153457A (en) 1981-03-17 1981-03-17 Semiconductor mounting apparatus

Country Status (1)

Country Link
JP (1) JPS57153457A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2592222A1 (en) * 1985-07-08 1987-06-26 Nec Corp MOUNTING AND WIRING MODULE FOR SEMICONDUCTOR CHIPS
EP0359928A2 (en) * 1988-09-21 1990-03-28 International Business Machines Corporation Integrated circuit package with cooling means

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS482463U (en) * 1971-05-21 1973-01-12
JPS55113351A (en) * 1979-02-23 1980-09-01 Hitachi Ltd Integrated circuit module

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS482463U (en) * 1971-05-21 1973-01-12
JPS55113351A (en) * 1979-02-23 1980-09-01 Hitachi Ltd Integrated circuit module

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2592222A1 (en) * 1985-07-08 1987-06-26 Nec Corp MOUNTING AND WIRING MODULE FOR SEMICONDUCTOR CHIPS
US4748538A (en) * 1985-07-08 1988-05-31 Nec Corporation Semiconductor module
EP0359928A2 (en) * 1988-09-21 1990-03-28 International Business Machines Corporation Integrated circuit package with cooling means

Also Published As

Publication number Publication date
JPS6217872B2 (en) 1987-04-20

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