JPS57117263A - Cooler for dual-in-line package type integrated circuit element - Google Patents

Cooler for dual-in-line package type integrated circuit element

Info

Publication number
JPS57117263A
JPS57117263A JP346781A JP346781A JPS57117263A JP S57117263 A JPS57117263 A JP S57117263A JP 346781 A JP346781 A JP 346781A JP 346781 A JP346781 A JP 346781A JP S57117263 A JPS57117263 A JP S57117263A
Authority
JP
Japan
Prior art keywords
dual
package type
line package
cooler
integrated circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP346781A
Other languages
Japanese (ja)
Inventor
Toshiki Hattori
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP346781A priority Critical patent/JPS57117263A/en
Publication of JPS57117263A publication Critical patent/JPS57117263A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

PURPOSE:To make a dual-in-line package type IC element to absorb heat much more by a method wherein radiating fins are fixed to the lower side of an IC mounted with a chip being a heater inside of the IC. CONSTITUTION:The radiating fins 22 are arranged on the lower side of the IC21 to be cooled. Heat generated from the chip on the lower part of the inside of the IC21 is transmitted to the lower side of the IC, and is transmitted moreover to the fins 22, and is dissipated in the air from the surface of the radiating fins 22. Because the fins 22 are fixed being pinched between the IC21 and a substrate, etc., an adhesive can be made as needless.
JP346781A 1981-01-12 1981-01-12 Cooler for dual-in-line package type integrated circuit element Pending JPS57117263A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP346781A JPS57117263A (en) 1981-01-12 1981-01-12 Cooler for dual-in-line package type integrated circuit element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP346781A JPS57117263A (en) 1981-01-12 1981-01-12 Cooler for dual-in-line package type integrated circuit element

Publications (1)

Publication Number Publication Date
JPS57117263A true JPS57117263A (en) 1982-07-21

Family

ID=11558125

Family Applications (1)

Application Number Title Priority Date Filing Date
JP346781A Pending JPS57117263A (en) 1981-01-12 1981-01-12 Cooler for dual-in-line package type integrated circuit element

Country Status (1)

Country Link
JP (1) JPS57117263A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0926733A1 (en) * 1997-12-16 1999-06-30 STMicroelectronics S.r.l. Card assembly of power device in plastic package with external heat sink soldered to the internal heat sink
CN102117784A (en) * 2009-12-31 2011-07-06 思达科技股份有限公司 Heat sink and integrated circuit assembly

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0926733A1 (en) * 1997-12-16 1999-06-30 STMicroelectronics S.r.l. Card assembly of power device in plastic package with external heat sink soldered to the internal heat sink
CN102117784A (en) * 2009-12-31 2011-07-06 思达科技股份有限公司 Heat sink and integrated circuit assembly

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