JPS5740966A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS5740966A
JPS5740966A JP55115993A JP11599380A JPS5740966A JP S5740966 A JPS5740966 A JP S5740966A JP 55115993 A JP55115993 A JP 55115993A JP 11599380 A JP11599380 A JP 11599380A JP S5740966 A JPS5740966 A JP S5740966A
Authority
JP
Japan
Prior art keywords
heat
heat sink
mounting
resistor
copper substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP55115993A
Other languages
Japanese (ja)
Inventor
Koichi Inoue
Yasutoshi Kurihara
Mitsuo Taguchi
Komei Yatsuno
Kenji Suzuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP55115993A priority Critical patent/JPS5740966A/en
Publication of JPS5740966A publication Critical patent/JPS5740966A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

PURPOSE:To obtain a small hybrid module having good heat radiation property, by mounting a heat sink on an insulator, mounting circuit elements of larger heat release value on said heat sink, and mounting circuit elements of smaller heat release value on the rest of said heat sink. CONSTITUTION:A gate turn-off thyristor (GTO)9 as a main heat dissipator is mounted in the center of a heat sink 16. A polyimide film 15a is arranged between the heat sink 16 and a copper substrate 14. As a snubbing resistor 12 dissipates much heat next to the CTO9, mounting it on the heat sink 16 prevents heat produced at the GTO9 from diffusing sufficiently as far as the periphery of the heat sink 16. Hence, said resistor 12 is bonded to the copper substrate 14 directly. As a result, the effect of the heat sink 16 can be performed sufficiently by mounting the resistor 12 of relatively large heat release value directly on the copper substrate 14.
JP55115993A 1980-08-25 1980-08-25 Semiconductor device Pending JPS5740966A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP55115993A JPS5740966A (en) 1980-08-25 1980-08-25 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP55115993A JPS5740966A (en) 1980-08-25 1980-08-25 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS5740966A true JPS5740966A (en) 1982-03-06

Family

ID=14676193

Family Applications (1)

Application Number Title Priority Date Filing Date
JP55115993A Pending JPS5740966A (en) 1980-08-25 1980-08-25 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS5740966A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5939059A (en) * 1982-08-27 1984-03-03 Hitachi Ltd Semiconductor device
JPS5968958A (en) * 1982-10-12 1984-04-19 Mitsubishi Electric Corp Gate turn-off thyristor assembled body
JPS5984458A (en) * 1982-11-04 1984-05-16 Mitsubishi Electric Corp Gate turn off thyristor assembled body
JPH01115255U (en) * 1988-01-27 1989-08-03
EP0579293A1 (en) * 1989-07-14 1994-01-19 Motorola, Inc. Hybrid amplifier
JP2012129309A (en) * 2010-12-14 2012-07-05 Denso Corp Switching module

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5939059A (en) * 1982-08-27 1984-03-03 Hitachi Ltd Semiconductor device
JPS5968958A (en) * 1982-10-12 1984-04-19 Mitsubishi Electric Corp Gate turn-off thyristor assembled body
JPS5984458A (en) * 1982-11-04 1984-05-16 Mitsubishi Electric Corp Gate turn off thyristor assembled body
JPH01115255U (en) * 1988-01-27 1989-08-03
EP0579293A1 (en) * 1989-07-14 1994-01-19 Motorola, Inc. Hybrid amplifier
JP2012129309A (en) * 2010-12-14 2012-07-05 Denso Corp Switching module

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