JPS53119675A - Mounting structure of lsi - Google Patents

Mounting structure of lsi

Info

Publication number
JPS53119675A
JPS53119675A JP3512177A JP3512177A JPS53119675A JP S53119675 A JPS53119675 A JP S53119675A JP 3512177 A JP3512177 A JP 3512177A JP 3512177 A JP3512177 A JP 3512177A JP S53119675 A JPS53119675 A JP S53119675A
Authority
JP
Japan
Prior art keywords
lsi
wiring substrate
mounting structure
package
lsis
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3512177A
Other languages
Japanese (ja)
Inventor
Mikio Nishihara
Hiroki Hirata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP3512177A priority Critical patent/JPS53119675A/en
Publication of JPS53119675A publication Critical patent/JPS53119675A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16195—Flat cap [not enclosing an internal cavity]

Abstract

PURPOSE: To improve cooling of LSIs by providing bumps for terminals to an insulator package having a built-in LSI chip, pressing these to the lands of a wiring substrate and thermally connecting the heat sink metal on the package side and the liquid cooling metal plate on the back of the wiring substrate by pressure contacting bolts.
COPYRIGHT: (C)1978,JPO&Japio
JP3512177A 1977-03-28 1977-03-28 Mounting structure of lsi Pending JPS53119675A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3512177A JPS53119675A (en) 1977-03-28 1977-03-28 Mounting structure of lsi

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3512177A JPS53119675A (en) 1977-03-28 1977-03-28 Mounting structure of lsi

Publications (1)

Publication Number Publication Date
JPS53119675A true JPS53119675A (en) 1978-10-19

Family

ID=12433088

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3512177A Pending JPS53119675A (en) 1977-03-28 1977-03-28 Mounting structure of lsi

Country Status (1)

Country Link
JP (1) JPS53119675A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5550019U (en) * 1978-09-27 1980-04-01
JPS5635447A (en) * 1979-08-17 1981-04-08 Amdahl Corp Leadless integrated circuit package and method therefor
JPS5923548A (en) * 1982-07-30 1984-02-07 Fujitsu Ltd Semiconductor device
JPS6027433U (en) * 1983-07-29 1985-02-25 松下電工株式会社 Electronic component mounting structure
JPS61202079U (en) * 1985-06-10 1986-12-18
JPS63146455A (en) * 1987-11-20 1988-06-18 Hitachi Ltd Semiconductor device and circuit device thereof

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5550019U (en) * 1978-09-27 1980-04-01
JPS5732980Y2 (en) * 1978-09-27 1982-07-21
JPS5635447A (en) * 1979-08-17 1981-04-08 Amdahl Corp Leadless integrated circuit package and method therefor
JPS5923548A (en) * 1982-07-30 1984-02-07 Fujitsu Ltd Semiconductor device
JPH0223031B2 (en) * 1982-07-30 1990-05-22 Fujitsu Ltd
JPS6027433U (en) * 1983-07-29 1985-02-25 松下電工株式会社 Electronic component mounting structure
JPS61202079U (en) * 1985-06-10 1986-12-18
JPS63146455A (en) * 1987-11-20 1988-06-18 Hitachi Ltd Semiconductor device and circuit device thereof
JPH0234180B2 (en) * 1987-11-20 1990-08-01 Hitachi Ltd

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