JPS5386572A - Semiconductor integrated circuit - Google Patents

Semiconductor integrated circuit

Info

Publication number
JPS5386572A
JPS5386572A JP127677A JP127677A JPS5386572A JP S5386572 A JPS5386572 A JP S5386572A JP 127677 A JP127677 A JP 127677A JP 127677 A JP127677 A JP 127677A JP S5386572 A JPS5386572 A JP S5386572A
Authority
JP
Japan
Prior art keywords
integrated circuit
semiconductor integrated
solder
thin
film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP127677A
Other languages
Japanese (ja)
Inventor
Koichi Oguchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Suwa Seikosha KK
Original Assignee
Seiko Epson Corp
Suwa Seikosha KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp, Suwa Seikosha KK filed Critical Seiko Epson Corp
Priority to JP127677A priority Critical patent/JPS5386572A/en
Publication of JPS5386572A publication Critical patent/JPS5386572A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation

Landscapes

  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)

Abstract

PURPOSE: To obtain a face-down IC at low cost and a high yield by forming a solder thin-film layer on the aluminum thin-film of bonding pads and using low melting point alloy basically composed of Pb, Sn, etc. as solder.
COPYRIGHT: (C)1978,JPO&Japio
JP127677A 1977-01-10 1977-01-10 Semiconductor integrated circuit Pending JPS5386572A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP127677A JPS5386572A (en) 1977-01-10 1977-01-10 Semiconductor integrated circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP127677A JPS5386572A (en) 1977-01-10 1977-01-10 Semiconductor integrated circuit

Publications (1)

Publication Number Publication Date
JPS5386572A true JPS5386572A (en) 1978-07-31

Family

ID=11496928

Family Applications (1)

Application Number Title Priority Date Filing Date
JP127677A Pending JPS5386572A (en) 1977-01-10 1977-01-10 Semiconductor integrated circuit

Country Status (1)

Country Link
JP (1) JPS5386572A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5514912A (en) * 1987-01-30 1996-05-07 Tanaka Denshi Kogyo Kabushiki Kaisha Method for connecting semiconductor material and semiconductor device used in connecting method

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5111565A (en) * 1974-07-19 1976-01-29 Mitsubishi Electric Corp Handotaisochino tasodenkyokukozo

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5111565A (en) * 1974-07-19 1976-01-29 Mitsubishi Electric Corp Handotaisochino tasodenkyokukozo

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5514912A (en) * 1987-01-30 1996-05-07 Tanaka Denshi Kogyo Kabushiki Kaisha Method for connecting semiconductor material and semiconductor device used in connecting method
US5514334A (en) * 1987-01-30 1996-05-07 Tanaka Denshi Kogyo Kabushiki Kaisha Fine lead alloy wire for forming bump electrodes

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