JPS5344172A - Semiconductor integrated circuit - Google Patents

Semiconductor integrated circuit

Info

Publication number
JPS5344172A
JPS5344172A JP11912776A JP11912776A JPS5344172A JP S5344172 A JPS5344172 A JP S5344172A JP 11912776 A JP11912776 A JP 11912776A JP 11912776 A JP11912776 A JP 11912776A JP S5344172 A JPS5344172 A JP S5344172A
Authority
JP
Japan
Prior art keywords
integrated circuit
semiconductor integrated
plating
surroundings
shorten
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11912776A
Other languages
Japanese (ja)
Inventor
Takeo Yamada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Suwa Seikosha KK
Original Assignee
Seiko Epson Corp
Suwa Seikosha KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp, Suwa Seikosha KK filed Critical Seiko Epson Corp
Priority to JP11912776A priority Critical patent/JPS5344172A/en
Publication of JPS5344172A publication Critical patent/JPS5344172A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods

Landscapes

  • Electrodes Of Semiconductors (AREA)

Abstract

PURPOSE: To shorten plating time and reduce plating cost by constituting bump electrode parts with a thick copper plating layer and their surroundings with gold plating.
COPYRIGHT: (C)1978,JPO&Japio
JP11912776A 1976-10-04 1976-10-04 Semiconductor integrated circuit Pending JPS5344172A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11912776A JPS5344172A (en) 1976-10-04 1976-10-04 Semiconductor integrated circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11912776A JPS5344172A (en) 1976-10-04 1976-10-04 Semiconductor integrated circuit

Publications (1)

Publication Number Publication Date
JPS5344172A true JPS5344172A (en) 1978-04-20

Family

ID=14753600

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11912776A Pending JPS5344172A (en) 1976-10-04 1976-10-04 Semiconductor integrated circuit

Country Status (1)

Country Link
JP (1) JPS5344172A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1992020097A1 (en) * 1991-04-26 1992-11-12 Citizen Watch Co., Ltd. Semiconductor device and manufacturing method therefor

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4940383A (en) * 1972-08-24 1974-04-15
JPS5035659U (en) * 1973-06-29 1975-04-15

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4940383A (en) * 1972-08-24 1974-04-15
JPS5035659U (en) * 1973-06-29 1975-04-15

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1992020097A1 (en) * 1991-04-26 1992-11-12 Citizen Watch Co., Ltd. Semiconductor device and manufacturing method therefor
US5433822A (en) * 1991-04-26 1995-07-18 Citizen Watch Co., Ltd. Method of manufacturing semiconductor device with copper core bumps

Similar Documents

Publication Publication Date Title
JPS528785A (en) Semiconductor device electrode structure
JPS5344172A (en) Semiconductor integrated circuit
JPS5373969A (en) Lead frame for semicinductor
JPS52149973A (en) External lead of electronic parts
JPS51151069A (en) Electrode forming method of a semiconductor element
JPS5368163A (en) Production of flip chip
JPS5348671A (en) Electrode structure of semiconductor element
JPS5283166A (en) Semiconductor device and its production
JPS5310266A (en) Production of soldred semiconductor wafers
JPS5356969A (en) Production of tape for tape carrier
JPS5318962A (en) Semiconductor package
JPS5377172A (en) Production of semiconductor device
JPS5354469A (en) Semiconductor integrated circuit
JPS5360170A (en) Input/output pads of ic chip
JPS535571A (en) Circuit block and its manufacture
JPS5362471A (en) Semiconductor device
JPS5216978A (en) Semiconductor
JPS5295171A (en) Electrode for semi-conductor
JPS5333057A (en) Bump type semiconductor device
JPS5379462A (en) Manufacture of semiconductor integrated circuit
JPS5295175A (en) Pellet bonding
JPS5349972A (en) Manufacture of semiconductor device
JPS5324268A (en) Pro duction of semiconductor device and bonding wire for the same
JPS5325394A (en) Se miconductor device
JPS5435690A (en) Manufacture of semiconductor device of multilayer wiring type