JPS5373969A - Lead frame for semicinductor - Google Patents
Lead frame for semicinductorInfo
- Publication number
- JPS5373969A JPS5373969A JP15020876A JP15020876A JPS5373969A JP S5373969 A JPS5373969 A JP S5373969A JP 15020876 A JP15020876 A JP 15020876A JP 15020876 A JP15020876 A JP 15020876A JP S5373969 A JPS5373969 A JP S5373969A
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- semicinductor
- glitter
- plating layer
- pellet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Abstract
PURPOSE: To prevent the pellet to peel off, by laminating the glitter Ni plating layer and non-glitter Ni plating layer to the lead frame.
COPYRIGHT: (C)1978,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15020876A JPS5373969A (en) | 1976-12-14 | 1976-12-14 | Lead frame for semicinductor |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15020876A JPS5373969A (en) | 1976-12-14 | 1976-12-14 | Lead frame for semicinductor |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5373969A true JPS5373969A (en) | 1978-06-30 |
Family
ID=15491880
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP15020876A Pending JPS5373969A (en) | 1976-12-14 | 1976-12-14 | Lead frame for semicinductor |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5373969A (en) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57145352A (en) * | 1981-03-04 | 1982-09-08 | Hitachi Cable Ltd | Lead frame for semiconductor |
JPS57164552A (en) * | 1981-04-01 | 1982-10-09 | Hitachi Cable Ltd | Lead-frame for semiconductor device |
JPS5818947A (en) * | 1981-07-27 | 1983-02-03 | Toshiba Corp | Lead frame |
JPS58106853A (en) * | 1981-12-18 | 1983-06-25 | Hitachi Ltd | Lead frame |
JPS63105353U (en) * | 1986-08-07 | 1988-07-08 | ||
JPS6412563A (en) * | 1987-07-07 | 1989-01-17 | Sumitomo Metal Mining Co | Nickel plating of lead frame |
-
1976
- 1976-12-14 JP JP15020876A patent/JPS5373969A/en active Pending
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57145352A (en) * | 1981-03-04 | 1982-09-08 | Hitachi Cable Ltd | Lead frame for semiconductor |
JPS6244817B2 (en) * | 1981-03-04 | 1987-09-22 | Hitachi Cable | |
JPS57164552A (en) * | 1981-04-01 | 1982-10-09 | Hitachi Cable Ltd | Lead-frame for semiconductor device |
JPS6312385B2 (en) * | 1981-04-01 | 1988-03-18 | Hitachi Cable | |
JPS5818947A (en) * | 1981-07-27 | 1983-02-03 | Toshiba Corp | Lead frame |
JPS58106853A (en) * | 1981-12-18 | 1983-06-25 | Hitachi Ltd | Lead frame |
JPS6366427B2 (en) * | 1981-12-18 | 1988-12-20 | Hitachi Ltd | |
JPS63105353U (en) * | 1986-08-07 | 1988-07-08 | ||
JPS6412563A (en) * | 1987-07-07 | 1989-01-17 | Sumitomo Metal Mining Co | Nickel plating of lead frame |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPS5329767A (en) | Control circuit | |
JPS5373969A (en) | Lead frame for semicinductor | |
JPS5224521A (en) | Data co-photographing system | |
JPS5366170A (en) | Lead frame with prodjection | |
JPS5249991A (en) | Sputtering method | |
JPS522380A (en) | Automatic-insertion-of-semiconductor-unit-into- measiromg-socket-and-p ull-out-device | |
JPS5334430A (en) | Memory unit | |
JPS52113261A (en) | Electronic digital clock | |
JPS5213365A (en) | Electronic watch constituting a battery in the band | |
JPS5233143A (en) | Compressive molten bath method by industive heat way | |
JPS5359978A (en) | Method of nipping parts | |
JPS51134488A (en) | Microtome | |
JPS5242770A (en) | Digital electronic watch | |
JPS547865A (en) | Semiconductor device | |
JPS5253661A (en) | Lead frame construction | |
JPS51126062A (en) | Tap short bonding method on wire bonding | |
JPS52151522A (en) | Noise preventing magnetic tablet | |
JPS529472A (en) | Electronic digital stop watch | |
JPS5432991A (en) | Manufacture of semiconductor | |
JPS537672A (en) | 4-aminomethyl-5,6,7-trihydroxyisocoumarin | |
JPS51148008A (en) | Process for preparing therapeutic agents for leukemia | |
JPS5295175A (en) | Pellet bonding | |
JPS5283103A (en) | Additional unit for direct international automatic dialing telephone s et | |
JPS5283704A (en) | 2, 6, 11, 15-tetramethylhexadecane-6, 11-diol | |
JPS51115197A (en) | Adhesive tape cutter |