JPS6412563A - Nickel plating of lead frame - Google Patents

Nickel plating of lead frame

Info

Publication number
JPS6412563A
JPS6412563A JP16778387A JP16778387A JPS6412563A JP S6412563 A JPS6412563 A JP S6412563A JP 16778387 A JP16778387 A JP 16778387A JP 16778387 A JP16778387 A JP 16778387A JP S6412563 A JPS6412563 A JP S6412563A
Authority
JP
Japan
Prior art keywords
lead frame
nickel plating
nickel
island
warpage
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP16778387A
Other languages
Japanese (ja)
Inventor
Shigeo Hasegawa
Minoru Tawara
Muneyuki Hasemi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Metal Mining Co Ltd
Original Assignee
Sumitomo Metal Mining Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Metal Mining Co Ltd filed Critical Sumitomo Metal Mining Co Ltd
Priority to JP16778387A priority Critical patent/JPS6412563A/en
Publication of JPS6412563A publication Critical patent/JPS6412563A/en
Pending legal-status Critical Current

Links

Landscapes

  • Electroplating Methods And Accessories (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE:To make stresses generated on both sides be canceled with each other so that warpage or lifting is prevented from generating in an island by a method wherein a nickel plating is performed also on one surface of a lead frame island as thick as the other nickel plated face. CONSTITUTION:When one face of an IC lead frame is subjected to nickel plat ing, the sulfamic acid nickel plating bath is used, where nickel, chlorine, and boric acid are controlled in concentration as required, and nickel plating is performed onto both faces of the island section of required thickness of the lead frame as thick as required. Then, the stresses induced in both the faces are canceled with each other, so that the island section is protected against lifting or warpage and nickel plating of the lead frame is made to be excellent in quality.
JP16778387A 1987-07-07 1987-07-07 Nickel plating of lead frame Pending JPS6412563A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16778387A JPS6412563A (en) 1987-07-07 1987-07-07 Nickel plating of lead frame

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16778387A JPS6412563A (en) 1987-07-07 1987-07-07 Nickel plating of lead frame

Publications (1)

Publication Number Publication Date
JPS6412563A true JPS6412563A (en) 1989-01-17

Family

ID=15856028

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16778387A Pending JPS6412563A (en) 1987-07-07 1987-07-07 Nickel plating of lead frame

Country Status (1)

Country Link
JP (1) JPS6412563A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0811706A1 (en) * 1996-06-06 1997-12-10 Lucent Technologies Inc. Conformable nickel coating and process for coating an article with a conformable nickel coating
KR20100036169A (en) * 2008-09-29 2010-04-07 스미토모 긴조쿠 고잔 가부시키가이샤 Lead frame and method of manufacturing the same
JP2011044748A (en) * 2010-11-29 2011-03-03 Sumitomo Metal Mining Co Ltd Method of manufacturing leadframe

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5373969A (en) * 1976-12-14 1978-06-30 Toshiba Corp Lead frame for semicinductor
JPS53141577A (en) * 1977-05-17 1978-12-09 Mitsubishi Electric Corp Lead frame for integrated circuit
JPS5792854A (en) * 1980-11-29 1982-06-09 Toshiba Corp Plastic molded type semiconductor device
JPS5835950A (en) * 1981-08-28 1983-03-02 Hitachi Ltd Semiconductor device

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5373969A (en) * 1976-12-14 1978-06-30 Toshiba Corp Lead frame for semicinductor
JPS53141577A (en) * 1977-05-17 1978-12-09 Mitsubishi Electric Corp Lead frame for integrated circuit
JPS5792854A (en) * 1980-11-29 1982-06-09 Toshiba Corp Plastic molded type semiconductor device
JPS5835950A (en) * 1981-08-28 1983-03-02 Hitachi Ltd Semiconductor device

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0811706A1 (en) * 1996-06-06 1997-12-10 Lucent Technologies Inc. Conformable nickel coating and process for coating an article with a conformable nickel coating
KR20100036169A (en) * 2008-09-29 2010-04-07 스미토모 긴조쿠 고잔 가부시키가이샤 Lead frame and method of manufacturing the same
JP2010080889A (en) * 2008-09-29 2010-04-08 Sumitomo Metal Mining Co Ltd Lead frame and method of manufacturing the same
JP2011044748A (en) * 2010-11-29 2011-03-03 Sumitomo Metal Mining Co Ltd Method of manufacturing leadframe

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