JPS5389654A - Cutting method of semiconductor device - Google Patents

Cutting method of semiconductor device

Info

Publication number
JPS5389654A
JPS5389654A JP390277A JP390277A JPS5389654A JP S5389654 A JPS5389654 A JP S5389654A JP 390277 A JP390277 A JP 390277A JP 390277 A JP390277 A JP 390277A JP S5389654 A JPS5389654 A JP S5389654A
Authority
JP
Japan
Prior art keywords
semiconductor device
cutting method
bonding
yield
improvement
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP390277A
Other languages
Japanese (ja)
Inventor
Shigeru Takahashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP390277A priority Critical patent/JPS5389654A/en
Publication of JPS5389654A publication Critical patent/JPS5389654A/en
Pending legal-status Critical Current

Links

Landscapes

  • Element Separation (AREA)
  • Dicing (AREA)

Abstract

PURPOSE: To achieve the improvement in yield and the reduction in cost by bonding and fixing a substrate support having bumps higher than solder balls and a semiconductor substrate, thereafter cutting the same.
COPYRIGHT: (C)1978,JPO&Japio
JP390277A 1977-01-19 1977-01-19 Cutting method of semiconductor device Pending JPS5389654A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP390277A JPS5389654A (en) 1977-01-19 1977-01-19 Cutting method of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP390277A JPS5389654A (en) 1977-01-19 1977-01-19 Cutting method of semiconductor device

Publications (1)

Publication Number Publication Date
JPS5389654A true JPS5389654A (en) 1978-08-07

Family

ID=11570113

Family Applications (1)

Application Number Title Priority Date Filing Date
JP390277A Pending JPS5389654A (en) 1977-01-19 1977-01-19 Cutting method of semiconductor device

Country Status (1)

Country Link
JP (1) JPS5389654A (en)

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