JPS5389654A - Cutting method of semiconductor device - Google Patents
Cutting method of semiconductor deviceInfo
- Publication number
- JPS5389654A JPS5389654A JP390277A JP390277A JPS5389654A JP S5389654 A JPS5389654 A JP S5389654A JP 390277 A JP390277 A JP 390277A JP 390277 A JP390277 A JP 390277A JP S5389654 A JPS5389654 A JP S5389654A
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- cutting method
- bonding
- yield
- improvement
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Element Separation (AREA)
- Dicing (AREA)
Abstract
PURPOSE: To achieve the improvement in yield and the reduction in cost by bonding and fixing a substrate support having bumps higher than solder balls and a semiconductor substrate, thereafter cutting the same.
COPYRIGHT: (C)1978,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP390277A JPS5389654A (en) | 1977-01-19 | 1977-01-19 | Cutting method of semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP390277A JPS5389654A (en) | 1977-01-19 | 1977-01-19 | Cutting method of semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5389654A true JPS5389654A (en) | 1978-08-07 |
Family
ID=11570113
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP390277A Pending JPS5389654A (en) | 1977-01-19 | 1977-01-19 | Cutting method of semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5389654A (en) |
-
1977
- 1977-01-19 JP JP390277A patent/JPS5389654A/en active Pending
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