JPS5344176A - Clad solder for semiconductor device - Google Patents

Clad solder for semiconductor device

Info

Publication number
JPS5344176A
JPS5344176A JP11911276A JP11911276A JPS5344176A JP S5344176 A JPS5344176 A JP S5344176A JP 11911276 A JP11911276 A JP 11911276A JP 11911276 A JP11911276 A JP 11911276A JP S5344176 A JPS5344176 A JP S5344176A
Authority
JP
Japan
Prior art keywords
semiconductor device
clad solder
base alloy
clad
solder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11911276A
Other languages
Japanese (ja)
Inventor
Kenkichi Yamaji
Deiitoritsuhi.Eerushiyureegeru
Kenji Yamaguchi
Sadahiko Sanki
Kenji Konishi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Cable Ltd
Original Assignee
Hitachi Cable Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Cable Ltd filed Critical Hitachi Cable Ltd
Priority to JP11911276A priority Critical patent/JPS5344176A/en
Priority to DE19772744418 priority patent/DE2744418A1/en
Publication of JPS5344176A publication Critical patent/JPS5344176A/en
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0233—Sheets, foils
    • B23K35/0238—Sheets, foils layered

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Die Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

PURPOSE: To obviate degrading of elements and improve bondability even when heating time is extremely long by forming a tripple layer structure wherein the layers on both sides are Sn or Pb-Sn base alloy and the intermediate layer is Pb-Sn base alloy of a low Sn concentration.
COPYRIGHT: (C)1978,JPO&Japio
JP11911276A 1976-10-04 1976-10-04 Clad solder for semiconductor device Pending JPS5344176A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP11911276A JPS5344176A (en) 1976-10-04 1976-10-04 Clad solder for semiconductor device
DE19772744418 DE2744418A1 (en) 1976-10-04 1977-10-03 Heat resisting lead base solder esp. for semiconductor devices - with outer layers of pure tin to improve wettability

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11911276A JPS5344176A (en) 1976-10-04 1976-10-04 Clad solder for semiconductor device

Publications (1)

Publication Number Publication Date
JPS5344176A true JPS5344176A (en) 1978-04-20

Family

ID=14753205

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11911276A Pending JPS5344176A (en) 1976-10-04 1976-10-04 Clad solder for semiconductor device

Country Status (2)

Country Link
JP (1) JPS5344176A (en)
DE (1) DE2744418A1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0330440A (en) * 1989-06-28 1991-02-08 Hitachi Ltd Semiconductor device
US5143865A (en) * 1988-09-02 1992-09-01 Kabushiki Kaisha Toshiba Metal bump type semiconductor device and method for manufacturing the same

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5588391U (en) * 1978-12-11 1980-06-18
DE3446780A1 (en) * 1984-12-21 1986-07-03 Brown, Boveri & Cie Ag, 6800 Mannheim METHOD AND JOINING MATERIAL FOR METALLICALLY CONNECTING COMPONENTS

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5143865A (en) * 1988-09-02 1992-09-01 Kabushiki Kaisha Toshiba Metal bump type semiconductor device and method for manufacturing the same
JPH0330440A (en) * 1989-06-28 1991-02-08 Hitachi Ltd Semiconductor device

Also Published As

Publication number Publication date
DE2744418A1 (en) 1978-04-06

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