JPS5588391U - - Google Patents

Info

Publication number
JPS5588391U
JPS5588391U JP17064378U JP17064378U JPS5588391U JP S5588391 U JPS5588391 U JP S5588391U JP 17064378 U JP17064378 U JP 17064378U JP 17064378 U JP17064378 U JP 17064378U JP S5588391 U JPS5588391 U JP S5588391U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP17064378U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP17064378U priority Critical patent/JPS5588391U/ja
Publication of JPS5588391U publication Critical patent/JPS5588391U/ja
Pending legal-status Critical Current

Links

JP17064378U 1978-12-11 1978-12-11 Pending JPS5588391U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17064378U JPS5588391U (en) 1978-12-11 1978-12-11

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17064378U JPS5588391U (en) 1978-12-11 1978-12-11

Publications (1)

Publication Number Publication Date
JPS5588391U true JPS5588391U (en) 1980-06-18

Family

ID=29173827

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17064378U Pending JPS5588391U (en) 1978-12-11 1978-12-11

Country Status (1)

Country Link
JP (1) JPS5588391U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011031022A3 (en) * 2009-09-11 2011-07-07 한국항공대학교 산학협력단 Welding wire

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2744418A1 (en) * 1976-10-04 1978-04-06 Hitachi Cable Heat resisting lead base solder esp. for semiconductor devices - with outer layers of pure tin to improve wettability

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2744418A1 (en) * 1976-10-04 1978-04-06 Hitachi Cable Heat resisting lead base solder esp. for semiconductor devices - with outer layers of pure tin to improve wettability

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011031022A3 (en) * 2009-09-11 2011-07-07 한국항공대학교 산학협력단 Welding wire

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