JPS5384581A - Semiconductor integrated circuit - Google Patents
Semiconductor integrated circuitInfo
- Publication number
- JPS5384581A JPS5384581A JP16050276A JP16050276A JPS5384581A JP S5384581 A JPS5384581 A JP S5384581A JP 16050276 A JP16050276 A JP 16050276A JP 16050276 A JP16050276 A JP 16050276A JP S5384581 A JPS5384581 A JP S5384581A
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- semiconductor integrated
- alsi
- produce
- layer film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title 1
- 229910000789 Aluminium-silicon alloy Inorganic materials 0.000 abstract 1
- 229910052804 chromium Inorganic materials 0.000 abstract 1
- 229910052737 gold Inorganic materials 0.000 abstract 1
- 229910052709 silver Inorganic materials 0.000 abstract 1
Landscapes
- Electrodes Of Semiconductors (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Abstract
PURPOSE: To produce the junction pad with the multi-layer film of Al or AlSi, and Cr, Ag, and Au and also to prevent cost up.
COPYRIGHT: (C)1978,JPO&Japio
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16050276A JPS5384581A (en) | 1976-12-29 | 1976-12-29 | Semiconductor integrated circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16050276A JPS5384581A (en) | 1976-12-29 | 1976-12-29 | Semiconductor integrated circuit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5384581A true JPS5384581A (en) | 1978-07-26 |
Family
ID=15716316
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16050276A Pending JPS5384581A (en) | 1976-12-29 | 1976-12-29 | Semiconductor integrated circuit |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5384581A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103107107A (en) * | 2012-12-12 | 2013-05-15 | 贵州振华风光半导体有限公司 | Method of improving thick film hybrid integrated circuit homogenesis bonding system batch productbility |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5326676A (en) * | 1976-08-25 | 1978-03-11 | Nec Corp | Flat-type semiconductor air-cooling radiato r |
-
1976
- 1976-12-29 JP JP16050276A patent/JPS5384581A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5326676A (en) * | 1976-08-25 | 1978-03-11 | Nec Corp | Flat-type semiconductor air-cooling radiato r |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103107107A (en) * | 2012-12-12 | 2013-05-15 | 贵州振华风光半导体有限公司 | Method of improving thick film hybrid integrated circuit homogenesis bonding system batch productbility |
| CN103107107B (en) * | 2012-12-12 | 2015-08-12 | 贵州振华风光半导体有限公司 | Improve the method for thick film hybrid integrated circuit homogeneity bonding system production |
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