JPS5354471A - Bonding tool for gang bonding - Google Patents

Bonding tool for gang bonding

Info

Publication number
JPS5354471A
JPS5354471A JP12978576A JP12978576A JPS5354471A JP S5354471 A JPS5354471 A JP S5354471A JP 12978576 A JP12978576 A JP 12978576A JP 12978576 A JP12978576 A JP 12978576A JP S5354471 A JPS5354471 A JP S5354471A
Authority
JP
Japan
Prior art keywords
bonding
gang
tool
bonding tool
beforhand
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12978576A
Other languages
Japanese (ja)
Inventor
Wakao Miyazawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Suwa Seikosha KK
Original Assignee
Seiko Epson Corp
Suwa Seikosha KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp, Suwa Seikosha KK filed Critical Seiko Epson Corp
Priority to JP12978576A priority Critical patent/JPS5354471A/en
Publication of JPS5354471A publication Critical patent/JPS5354471A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto

Landscapes

  • Wire Bonding (AREA)

Abstract

PURPOSE: To achieve the improvement in binding characteristics and increase yield by beforhand providing protrusion parts such as of rectangular prisms or columns on the bonding surface of a bonding tool opposing to the bump electrode of an IC.
COPYRIGHT: (C)1978,JPO&Japio
JP12978576A 1976-10-28 1976-10-28 Bonding tool for gang bonding Pending JPS5354471A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12978576A JPS5354471A (en) 1976-10-28 1976-10-28 Bonding tool for gang bonding

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12978576A JPS5354471A (en) 1976-10-28 1976-10-28 Bonding tool for gang bonding

Publications (1)

Publication Number Publication Date
JPS5354471A true JPS5354471A (en) 1978-05-17

Family

ID=15018156

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12978576A Pending JPS5354471A (en) 1976-10-28 1976-10-28 Bonding tool for gang bonding

Country Status (1)

Country Link
JP (1) JPS5354471A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07116091A (en) * 1993-10-28 1995-05-09 Sanyo Electric Co Ltd Nozzle unit for vacuum cleaner
JP2002313843A (en) * 2001-04-18 2002-10-25 Sharp Corp Connection device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07116091A (en) * 1993-10-28 1995-05-09 Sanyo Electric Co Ltd Nozzle unit for vacuum cleaner
JP2002313843A (en) * 2001-04-18 2002-10-25 Sharp Corp Connection device

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