Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Suwa Seikosha KK
Original Assignee
Seiko Epson Corp
Suwa Seikosha KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp, Suwa Seikosha KKfiledCriticalSeiko Epson Corp
Priority to JP15861376ApriorityCriticalpatent/JPS5383464A/en
Publication of JPS5383464ApublicationCriticalpatent/JPS5383464A/en
PURPOSE: To perform bonding positively and prevent oozing of bonding agents by providing a stepping to the surface where a chip housing case holds lead plates in place, in a pcckage of an IC chip.