JPS5317070A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS5317070A
JPS5317070A JP9110876A JP9110876A JPS5317070A JP S5317070 A JPS5317070 A JP S5317070A JP 9110876 A JP9110876 A JP 9110876A JP 9110876 A JP9110876 A JP 9110876A JP S5317070 A JPS5317070 A JP S5317070A
Authority
JP
Japan
Prior art keywords
semiconductor device
film
obviate
bumps
hardness
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9110876A
Other languages
Japanese (ja)
Inventor
Masaru Nakamura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP9110876A priority Critical patent/JPS5317070A/en
Publication of JPS5317070A publication Critical patent/JPS5317070A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto

Landscapes

  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)

Abstract

PURPOSE: To increase the hardness of an Al film and obviate the abnormal crushing of bumps and the rigidity deficiency of beam lead terminals at bonding by mixing other metal elements into the Al film.
COPYRIGHT: (C)1978,JPO&Japio
JP9110876A 1976-07-30 1976-07-30 Semiconductor device Pending JPS5317070A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9110876A JPS5317070A (en) 1976-07-30 1976-07-30 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9110876A JPS5317070A (en) 1976-07-30 1976-07-30 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS5317070A true JPS5317070A (en) 1978-02-16

Family

ID=14017319

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9110876A Pending JPS5317070A (en) 1976-07-30 1976-07-30 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS5317070A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55103740A (en) * 1979-01-31 1980-08-08 Nec Corp Semiconductor device
JPS56104463A (en) * 1980-01-23 1981-08-20 Hitachi Ltd Semiconductor device
JPS6345826A (en) * 1986-08-11 1988-02-26 インターナショナル・ビジネス・マシーンズ・コーポレーシヨン Connection structure of semiconductor integrated circuit device

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55103740A (en) * 1979-01-31 1980-08-08 Nec Corp Semiconductor device
JPS56104463A (en) * 1980-01-23 1981-08-20 Hitachi Ltd Semiconductor device
JPS6255705B2 (en) * 1980-01-23 1987-11-20 Hitachi Seisakusho Kk
JPS6345826A (en) * 1986-08-11 1988-02-26 インターナショナル・ビジネス・マシーンズ・コーポレーシヨン Connection structure of semiconductor integrated circuit device

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