JPS548976A - Lsi package - Google Patents

Lsi package

Info

Publication number
JPS548976A
JPS548976A JP7463777A JP7463777A JPS548976A JP S548976 A JPS548976 A JP S548976A JP 7463777 A JP7463777 A JP 7463777A JP 7463777 A JP7463777 A JP 7463777A JP S548976 A JPS548976 A JP S548976A
Authority
JP
Japan
Prior art keywords
lsi package
lsi
package
fabricate
heat radiation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7463777A
Other languages
Japanese (ja)
Inventor
Akihiro Dotani
Mitsuru Nitta
Toshi Sano
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP7463777A priority Critical patent/JPS548976A/en
Publication of JPS548976A publication Critical patent/JPS548976A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

PURPOSE: To fabricate a package which enables high density wiring and high-efficient heat radiation, by connecting a LSI to a ceramic substrate on which a multi-layer circuit has been formed.
COPYRIGHT: (C)1979,JPO&Japio
JP7463777A 1977-06-22 1977-06-22 Lsi package Pending JPS548976A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7463777A JPS548976A (en) 1977-06-22 1977-06-22 Lsi package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7463777A JPS548976A (en) 1977-06-22 1977-06-22 Lsi package

Publications (1)

Publication Number Publication Date
JPS548976A true JPS548976A (en) 1979-01-23

Family

ID=13552912

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7463777A Pending JPS548976A (en) 1977-06-22 1977-06-22 Lsi package

Country Status (1)

Country Link
JP (1) JPS548976A (en)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57126154A (en) * 1981-01-30 1982-08-05 Nec Corp Lsi package
JPS59172387U (en) * 1983-04-30 1984-11-17 株式会社島津製作所 radiation detector
US4531145A (en) * 1980-08-04 1985-07-23 Fine Particle Technology Corporation Method of fabricating complex micro-circuit boards and substrates and substrate
US4578697A (en) * 1981-06-15 1986-03-25 Fujitsu Limited Semiconductor device encapsulating a multi-chip array
WO1989010014A1 (en) * 1988-04-06 1989-10-19 Amhet Manufacturing Company, Inc. An electronic chip connection assembly and method
US4878846A (en) * 1988-04-06 1989-11-07 Schroeder Jon M Electronic circuit chip connection assembly and method
US5444297A (en) * 1992-06-17 1995-08-22 Mitsubishi Denki Kabushiki Kaisha Noise resistant semiconductor power module
US5477085A (en) * 1993-11-26 1995-12-19 Nec Corporation Bonding structure of dielectric substrates for impedance matching circuits on a packaging substrate involved in microwave integrated circuits

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4832475A (en) * 1971-08-27 1973-04-28
JPS50152668A (en) * 1974-04-30 1975-12-08
JPS5231672A (en) * 1975-09-05 1977-03-10 Hitachi Ltd Ceramic package

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4832475A (en) * 1971-08-27 1973-04-28
JPS50152668A (en) * 1974-04-30 1975-12-08
JPS5231672A (en) * 1975-09-05 1977-03-10 Hitachi Ltd Ceramic package

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4531145A (en) * 1980-08-04 1985-07-23 Fine Particle Technology Corporation Method of fabricating complex micro-circuit boards and substrates and substrate
JPS57126154A (en) * 1981-01-30 1982-08-05 Nec Corp Lsi package
JPS6250981B2 (en) * 1981-01-30 1987-10-28 Nippon Electric Co
US4578697A (en) * 1981-06-15 1986-03-25 Fujitsu Limited Semiconductor device encapsulating a multi-chip array
JPS59172387U (en) * 1983-04-30 1984-11-17 株式会社島津製作所 radiation detector
WO1989010014A1 (en) * 1988-04-06 1989-10-19 Amhet Manufacturing Company, Inc. An electronic chip connection assembly and method
US4878846A (en) * 1988-04-06 1989-11-07 Schroeder Jon M Electronic circuit chip connection assembly and method
US5444297A (en) * 1992-06-17 1995-08-22 Mitsubishi Denki Kabushiki Kaisha Noise resistant semiconductor power module
US5477085A (en) * 1993-11-26 1995-12-19 Nec Corporation Bonding structure of dielectric substrates for impedance matching circuits on a packaging substrate involved in microwave integrated circuits

Similar Documents

Publication Publication Date Title
JPS5237721A (en) Semiconductor integrated circuit
JPS548976A (en) Lsi package
JPS5391680A (en) Semiconductor device
JPS522173A (en) Semiconductor integrated circuit
JPS5326689A (en) Semiconductor integrated circuit unit
JPS5314561A (en) Packaging device of semiconductor device
JPS52156559A (en) Small electronic device packaging package
JPS53126276A (en) Heat dissipation construction of multichip mounting substrate
JPS5332678A (en) Lsi mounting package
JPS5419658A (en) Semiconductor device
JPS5263672A (en) Production of semiconductor device
JPS51147286A (en) Manufacturing process of semiconductor
JPS5318962A (en) Semiconductor package
JPS51142977A (en) Mounting method of semiconductor elements
JPS5441666A (en) Semiconductor integrated circuit element
JPS51123086A (en) Semicanductor device and its production process
JPS51139778A (en) Electronic circuit apparatus
JPS52103983A (en) Semiconductor integrated circuit
JPS51113580A (en) Memory unit of large-scale semi- conductor integrated circuit
JPS51142978A (en) Mounting method of circuit elements
JPS5275279A (en) Packaging structure for semiconductor devices
JPS52114271A (en) Semiconductor pellet mounting structure for substrate
JPS51150237A (en) Pachage
JPS5419375A (en) Semiconductor device
JPS5379462A (en) Manufacture of semiconductor integrated circuit