JPS548976A - Lsi package - Google Patents

Lsi package

Info

Publication number
JPS548976A
JPS548976A JP7463777A JP7463777A JPS548976A JP S548976 A JPS548976 A JP S548976A JP 7463777 A JP7463777 A JP 7463777A JP 7463777 A JP7463777 A JP 7463777A JP S548976 A JPS548976 A JP S548976A
Authority
JP
Grant status
Application
Patent type
Prior art keywords
lsi package
lsi
package
fabricate
japio
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7463777A
Inventor
Akihiro Dotani
Mitsuru Nitta
Toshi Sano
Original Assignee
Nec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date

Links

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484Connecting portions
    • H01L2224/4847Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732Location after the connecting process
    • H01L2224/73251Location after the connecting process on different surfaces
    • H01L2224/73265Layer and wire connectors

Abstract

PURPOSE: To fabricate a package which enables high density wiring and high-efficient heat radiation, by connecting a LSI to a ceramic substrate on which a multi-layer circuit has been formed.
COPYRIGHT: (C)1979,JPO&Japio
JP7463777A 1977-06-22 1977-06-22 Lsi package Pending JPS548976A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7463777A JPS548976A (en) 1977-06-22 1977-06-22 Lsi package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7463777A JPS548976A (en) 1977-06-22 1977-06-22 Lsi package

Publications (1)

Publication Number Publication Date
JPS548976A true true JPS548976A (en) 1979-01-23

Family

ID=13552912

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7463777A Pending JPS548976A (en) 1977-06-22 1977-06-22 Lsi package

Country Status (1)

Country Link
JP (1) JPS548976A (en)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57126154A (en) * 1981-01-30 1982-08-05 Nec Corp Lsi package
JPS59172387U (en) * 1983-04-30 1984-11-17
US4531145A (en) * 1980-08-04 1985-07-23 Fine Particle Technology Corporation Method of fabricating complex micro-circuit boards and substrates and substrate
US4578697A (en) * 1981-06-15 1986-03-25 Fujitsu Limited Semiconductor device encapsulating a multi-chip array
WO1989010014A1 (en) * 1988-04-06 1989-10-19 Amhet Manufacturing Company, Inc. An electronic chip connection assembly and method
US4878846A (en) * 1988-04-06 1989-11-07 Schroeder Jon M Electronic circuit chip connection assembly and method
US5444297A (en) * 1992-06-17 1995-08-22 Mitsubishi Denki Kabushiki Kaisha Noise resistant semiconductor power module
US5477085A (en) * 1993-11-26 1995-12-19 Nec Corporation Bonding structure of dielectric substrates for impedance matching circuits on a packaging substrate involved in microwave integrated circuits

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4832475A (en) * 1971-08-27 1973-04-28
JPS50152668A (en) * 1974-04-30 1975-12-08
JPS5231672A (en) * 1975-09-05 1977-03-10 Hitachi Ltd Ceramic package

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4832475A (en) * 1971-08-27 1973-04-28
JPS50152668A (en) * 1974-04-30 1975-12-08
JPS5231672A (en) * 1975-09-05 1977-03-10 Hitachi Ltd Ceramic package

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4531145A (en) * 1980-08-04 1985-07-23 Fine Particle Technology Corporation Method of fabricating complex micro-circuit boards and substrates and substrate
JPS57126154A (en) * 1981-01-30 1982-08-05 Nec Corp Lsi package
JPS6250981B2 (en) * 1981-01-30 1987-10-28 Nippon Electric Co
US4578697A (en) * 1981-06-15 1986-03-25 Fujitsu Limited Semiconductor device encapsulating a multi-chip array
JPS59172387U (en) * 1983-04-30 1984-11-17
WO1989010014A1 (en) * 1988-04-06 1989-10-19 Amhet Manufacturing Company, Inc. An electronic chip connection assembly and method
US4878846A (en) * 1988-04-06 1989-11-07 Schroeder Jon M Electronic circuit chip connection assembly and method
US5444297A (en) * 1992-06-17 1995-08-22 Mitsubishi Denki Kabushiki Kaisha Noise resistant semiconductor power module
US5477085A (en) * 1993-11-26 1995-12-19 Nec Corporation Bonding structure of dielectric substrates for impedance matching circuits on a packaging substrate involved in microwave integrated circuits

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