JPS6459895A - Electronic part mounting device - Google Patents

Electronic part mounting device

Info

Publication number
JPS6459895A
JPS6459895A JP21614687A JP21614687A JPS6459895A JP S6459895 A JPS6459895 A JP S6459895A JP 21614687 A JP21614687 A JP 21614687A JP 21614687 A JP21614687 A JP 21614687A JP S6459895 A JPS6459895 A JP S6459895A
Authority
JP
Japan
Prior art keywords
system interface
heat
metal plate
circuit board
thermal system
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP21614687A
Other languages
Japanese (ja)
Other versions
JPH0650796B2 (en
Inventor
Takeshi Taketomi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP21614687A priority Critical patent/JPH0650796B2/en
Publication of JPS6459895A publication Critical patent/JPS6459895A/en
Publication of JPH0650796B2 publication Critical patent/JPH0650796B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

PURPOSE:To enable electronic circuit module to be made in a completely sealed construction by dissipating heat generated by electronic parts which are packaged on printed-circuit board through heat substrate consisting of an improved heat conductor. CONSTITUTION:An electronic circuit module 1 has a heat substrate 7 and printing-circuit board 5 consisting of improved conductors which are provided in parallel and facing each other. Although a metal plate incorporating a heat pipe is used as the heat substrate 7, an aluminum plate etc., may also be used. Electronic circuit packages 4, 4,... as electronic parts are inserted into guides 11, 11,... which are provided on this metal plate 7. Also, a thermal system interface part 7a and electrical system interface part 5a are formed on the metal plate 7 and printed-circuit board 5 at the left side protruding from the case, respectively. These thermal system interface parts 7a are connected to thermal system interface packages including fin and liquid cooling body, respectively.
JP21614687A 1987-08-29 1987-08-29 Electronic component mounting device Expired - Lifetime JPH0650796B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP21614687A JPH0650796B2 (en) 1987-08-29 1987-08-29 Electronic component mounting device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP21614687A JPH0650796B2 (en) 1987-08-29 1987-08-29 Electronic component mounting device

Publications (2)

Publication Number Publication Date
JPS6459895A true JPS6459895A (en) 1989-03-07
JPH0650796B2 JPH0650796B2 (en) 1994-06-29

Family

ID=16683999

Family Applications (1)

Application Number Title Priority Date Filing Date
JP21614687A Expired - Lifetime JPH0650796B2 (en) 1987-08-29 1987-08-29 Electronic component mounting device

Country Status (1)

Country Link
JP (1) JPH0650796B2 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0664829U (en) * 1993-02-18 1994-09-13 株式会社ユーシン精機 Hot nozzle for runnerless injection molding
JP2005260252A (en) * 2005-03-30 2005-09-22 Fujitsu Ltd Electronic device equipped with spacer having function of protecting electronic component
CN100358135C (en) * 2004-02-27 2007-12-26 鸿富锦精密工业（深圳）有限公司 Heat elimination module and preparation method

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0664829U (en) * 1993-02-18 1994-09-13 株式会社ユーシン精機 Hot nozzle for runnerless injection molding
CN100358135C (en) * 2004-02-27 2007-12-26 鸿富锦精密工业（深圳）有限公司 Heat elimination module and preparation method
JP2005260252A (en) * 2005-03-30 2005-09-22 Fujitsu Ltd Electronic device equipped with spacer having function of protecting electronic component

Also Published As

Publication number Publication date
JPH0650796B2 (en) 1994-06-29

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