JPH0412555A - Semiconductor device - Google Patents

Abstract

PURPOSE:To make it possible to efficiently dissipate the generated heat by mounting a semiconductor element on a recessed portion or a projected portion to decide a position of a heat sink, and then by packaging it with resin. CONSTITUTION:A heat sink 1 is formed by a copper plate or an aluminum plate which has high heat conduction. A mounting hole 3 is perforated through the fin of the heat sink, and a recessed portion 4 of the heat-dissipating to decide the position in the central part of the heat sink. A packaged semiconductor element 6 is mounted on the recessed portion 4 of the heat sink by soldering or other methods, and is coated by a package 7 consisting of epoxy resin. In this way, the heat to be generated in a device for semiconductor can be efficiently dissipated.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a high-power semiconductor device used in various electronic devices.

Conventional technology Conventionally, as a method for increasing the power consumption of semiconductor devices, there has been a method of increasing the size of the package itself to improve heat dissipation from the IC chip. There are methods to improve heat dissipation and methods to solder it to the circuit board.

Problems to be Solved by the Invention However, with the above configuration, there are problems that heat is accumulated within the semiconductor device, the size of the heat dissipation fin is limited depending on the volume of the electronic device that uses the semiconductor device, and the circuit board. The problem was that the heat dissipation effect differed depending on the size.

The present invention solves the above-mentioned problems, and an object of the present invention is to provide a semiconductor device that can efficiently dissipate heat generated within the semiconductor device.

Means for Solving the Problems To achieve this object, the semiconductor device of the present invention has a structure in which a heat sink having a concave or convex surface for positioning is connected to a semiconductor element and packaged with resin.

Function: This structure improves the flow of the solder that bonds the semiconductor element and the heat sink, and at the same time allows the mounting of the semiconductor device to be accurately defined.

EXAMPLE An example of the present invention will be described below with reference to the drawings.

As shown in Fig. 1, the heat dissipation plate 1 is made of a copper plate or aluminum with good thermal conductivity, and its heat dissipation fins are provided with holes 3 for mounting, and a concave surface 4 for positioning is formed in the central part. has been done. As shown in FIGS. 2 and 3, a packaged semiconductor element 6 is attached to the concave surface 4 of the heat sink 1 by soldering or the like, and covered with a package 7 made of epoxy resin.

FIG. 4 shows the measured values of the thermal resistance of the semiconductor device configured as described above, in comparison with a conventional example.

As is clear from this, the thermal resistance of this embodiment is lower than that of the conventional example, and its variation is also small.

As described above, according to this embodiment, the semiconductor element is soldered to a heat sink with a concave surface and packaged with resin, so that the thermal resistance is greatly reduced and the generated heat can be efficiently dissipated. , high power can be achieved. Since the mounting position on the heat sink can be precisely defined, variations in the characteristics and external dimensions of the semiconductor device can be reduced. Furthermore, when attaching heat dissipating fins to semiconductor devices, by using the holes to attach heat dissipating fins made of aluminum plates or the like, it is possible to increase the power consumption of the layer. Furthermore, since the configuration is such that a heat sink is added to a prepackaged semiconductor element, expensive equipment and expensive materials are not required in the manufacturing process, and overall costs can be reduced.

In the embodiment, a heat sink 1 having stepped concave surfaces 4 was used, but a heat sink 2 having a convex surface 5 as shown in FIG. 5 may also be used.

Effects of the Invention As is clear from the above explanation, the present invention has a structure in which a semiconductor element is attached to a concave or convex surface for positioning a heat sink, and is further packaged with resin, so that the generated heat can be efficiently dissipated. By effectively dissipating the energy, it is possible to realize a high-power semiconductor device.

[Brief explanation of the drawing]

FIG. 1(a) is a front view of a heat sink in an embodiment of the semiconductor device of the present invention, FIG. 1(b) is a side view thereof, and FIG. 1(e)
is its bottom view. FIG. 2(a) is a front view of an example of a semiconductor element in an embodiment of the semiconductor device of the present invention, and FIG. 2(b) is a side view thereof. FIG. 3(a) is a front view of another example of the same semiconductor element, and FIG. 3(b) is a sectional view taken along line A-A''. FIG. A distribution diagram of measured values of thermal resistance of the device, FIG. 5(a) is a front view of a heat sink in another embodiment of the semiconductor device of the present invention,
The figure (b) is the side view, and the figure (C) is the bottom view. 1.2... Heat sink, 4... Concave surface, 5...
... Convex surface, 6 ... Semiconductor element, 7 ...
···package. Name of agent: Patent attorney Shigetaka Awano and one other person Figure 1 Figure 2 Figure 2 Figure 1

Claims (1)

[Claims] A semiconductor device in which a heat sink with a concave or convex surface for positioning is connected to a pre-packaged semiconductor element and packaged with resin.