JPH0448740A - Tab semiconductor device - Google Patents
Tab semiconductor deviceInfo
- Publication number
- JPH0448740A JPH0448740A JP2157953A JP15795390A JPH0448740A JP H0448740 A JPH0448740 A JP H0448740A JP 2157953 A JP2157953 A JP 2157953A JP 15795390 A JP15795390 A JP 15795390A JP H0448740 A JPH0448740 A JP H0448740A
- Authority
- JP
- Japan
- Prior art keywords
- tab
- adhesive
- heat sink
- heat
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 6
- 239000000853 adhesive Substances 0.000 abstract description 10
- 230000001070 adhesive effect Effects 0.000 abstract description 10
- 238000005476 soldering Methods 0.000 abstract description 2
- 230000008646 thermal stress Effects 0.000 abstract description 2
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明はＩＣの実装構造に関するものであり、特にＴ
Ａ Ｂ （Ｔａｐｅ Ａｕｔｏｍａｔｅｄ Ｂｏｎｄｉ
ｎｇ） −Ｉ Ｃ（半導体集積回路装置）すなわちフィ
ルムキャリア半導体素子を配線基板に実装する実装構造
に関するものであａ
従来の技術
従来のＴＡＢ−Ｉ Ｃの実装構造としては 例えば 特
開平、１−５９８４１号公報に示されているものがあも
第２図はこの従来のＴＡＢ−ＩＣの実装構造の縦断面
図を示すものであり、ＴＡＢ−ＩＣ９はヒートシンクｌ
Ｏに接続され 治具１１に・より支えられていモ１２は
基ｉ １３，１４はネジ、１５はフィルムキャリアリ
ードであも
発明が解決しようとする課題
しかしながら前記のような構造で（よ 治具１１は単に
ＴＡＢ−ＩＣ９を支えるだけの形状でしかないので、Ｔ
ＡＢ−ＩＣ９が発生する熱が治具１１に伝わってＬ 治
具１１から外気へ熱を効率良く放出することができない
という欠点があり、結ＭＴＡＢ−ＩＣ９の発生する熱の
大半はＴＡＢ−ＩＣ９の上部に取付けられたヒートシン
ク１０より放出する必要があり、 ヒートシンク１０は
大きくなってしまうという欠点があり九 本発明はかか
る点に鑑、ｋ ＴＡＢ−ＩＣの発生する熱を効率良く
外気に放出することにより、ヒートシンクを小さくしひ
いては実装密度を高くすることを目的とすム課題を解決
するための手段
本発明Ｃ↓ 配線基板に実装されるＴＡＢ−ＩＣの１献
および、下面にヒートシンクを接続したことを特徴と
するＴＡＢ−Ｉ Ｃの実装構造であム作用
本発明は前記した構造であるた＆ ＴＡＢ−ＩＣの発
生する熱はＴＡＢ−Ｉ Ｃの上に接続されたヒートシン
クに伝わり外気に効率良く放出すると同時に ＴＡＢ−
ＩＣの下にあるヒートシンクにも伝わり、外気に効率良
く放出されも
実施例
第１図は本発明の一実施例の縦断面図であムＴＡＢ−Ｉ
Ｃ１はヒートシンク形状をしたブロック２に熱伝導性
の良好な接着剤３ （例えば Ａｇ入りのエポキシ樹脂
半田等）で接着されム 熱応力等の力を吸収できるよ
うにＬ字に折り曲げられたＴＡＢ−ＩＣ１のリード４は
配線基板５の接続バッド６に半田付は等で接続されも
そして、熱伝導性の良好な絶縁性の接着剤８ （例えば
ＢＮ入りシリコーン樹脂等）により、ＴＡＢ−ＩＣＩの
回路面にヒートシンク７を接着すると共ｉ、：、ＴＡＢ
−ＩＣＩおよびＴＡＢ−ＩＣＩとり−ド４との接続部を
保護する。以上説明したようにこの実施例によれ＋ｉ
ＴＡＢ−ＩＣＩの発生する熱は接着剤８を通し上部のヒ
ートシンク７に伝わり外気に効率良く放出されると同時
シミ 接着剤３を通し下部のブロック２に伝わム ブロ
ック２はヒートシンク形状をしているた数 ブロック２
に伝わった熱は効率良く外気に放出されも つまり、Ｔ
ＡＢ−ＩＣＩの発生する熱は上下から効率良く放出する
ことができ、 ヒートシンク７は小さくすることかてぎ
ム その結果 専有面積を小さくでき、実装密度を高く
することができａ な耘 以上の実施例ではＴＡＢ−Ｉ
Ｃの回路面は上向きである力交下向きでも良く、その
場合、接着剤３は絶縁性になり、接着剤８は絶縁性であ
る必要はなくな本発明の詳細
な説明したように本発明によれ１ｉＴＡＢ−ＩＣの放熱
効率を上（ず、実装密度を高くすることができ、その実
用効果は太き（１[Detailed Description of the Invention] Industrial Application Field The present invention relates to an IC mounting structure, and in particular to a T.
A B (Tape Automated Bondi
ng) - IC (semiconductor integrated circuit device), that is, a mounting structure in which a film carrier semiconductor element is mounted on a wiring boarda.Conventional technologyAs for the conventional TAB-IC mounting structure, for example, Japanese Patent Application Laid-Open No. 1-59841 Figure 2 shows a longitudinal cross-sectional view of the mounting structure of this conventional TAB-IC.
12 is a base, 13 and 14 are screws, and 15 is a film carrier lead.However, with the structure as described above, 11 is just a shape that only supports TAB-IC9, so T
The heat generated by AB-IC9 is transferred to the jig 11, and the heat cannot be efficiently released from the jig 11 to the outside air. It is necessary to release the heat from the heat sink 10 attached to the upper part, and the heat sink 10 has the disadvantage of becoming large.In view of this point, the present invention aims to efficiently release the heat generated by the TAB-IC to the outside air. The present invention C↓ 1. TAB-IC mounted on a wiring board and a heat sink connected to the bottom surface. The present invention is a TAB-IC mounting structure characterized by At the same time as releasing TAB-
The heat is transmitted to the heat sink under the IC, and is efficiently released to the outside air.
C1 is bonded to a heat sink-shaped block 2 with an adhesive 3 having good thermal conductivity (for example, epoxy resin solder containing Ag), and is bent into an L shape to absorb forces such as thermal stress. The lead 4 of IC1 can be connected to the connection pad 6 of the wiring board 5 by soldering, etc.
Then, the heat sink 7 is bonded to the circuit surface of the TAB-ICI using an insulating adhesive 8 with good thermal conductivity (for example, BN-containing silicone resin, etc.).
- protect the connection with ICI and TAB-ICI port 4; As explained above, according to this embodiment +i
The heat generated by the TAB-ICI is transmitted to the upper heat sink 7 through the adhesive 8, and is efficiently released to the outside air.The heat generated by the TAB-ICI is transmitted to the lower block 2 through the adhesive 3.The block 2 has a heat sink shape. Block 2
The heat transferred to T can be efficiently released to the outside air.
The heat generated by AB-ICI can be efficiently dissipated from the top and bottom, and the heat sink 7 can be made small.As a result, the occupied area can be reduced and the packaging density can be increased. In the example TAB-I
The circuit surface of C may face upward, but the power exchange may face downward. In that case, the adhesive 3 becomes insulating, and the adhesive 8 does not need to be insulating, and as described in the detailed description of the invention, the present invention can be applied. The heat dissipation efficiency of 1iTAB-IC can be increased (1), and the mounting density can be increased, and its practical effects are significant (1).
第１図は本発明の一実施例におけるＴＡＢ−ＩＣの実装
構造の縦断面＠ 第２図は同従来構造の縦断面図であム
ト・・・ＴＡＢ−ＩＣ，２・・・・ブロッ久 ３，８・
・・・接着Ｒ４−・・リード、 ７・・・・ヒートシン
ク。
代理人の氏名 弁理士 粟野重孝 はか１名葺１図
第２図
／／力冥Figure 1 is a vertical cross-section of a TAB-IC mounting structure according to an embodiment of the present invention; Figure 2 is a vertical cross-section of the same conventional structure. ,8・
...Adhesion R4-...Lead, 7...Heat sink. Name of agent: Patent attorney Shigetaka Awano, 1 person, 1 figure, 2 figures
Claims (1)
下面にヒートシンクを設置したことを特徴とするＴＡＢ
半導体装置。A TAB characterized in that a heat sink is installed on the upper and lower surfaces of a TAB semiconductor element mounted on a wiring board.
Semiconductor equipment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2157953A JP2745786B2 (en) | 1990-06-15 | 1990-06-15 | TAB semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2157953A JP2745786B2 (en) | 1990-06-15 | 1990-06-15 | TAB semiconductor device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0448740A true JPH0448740A (en) | 1992-02-18 |
| JP2745786B2 JP2745786B2 (en) | 1998-04-28 |
Family
ID=15661072
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2157953A Expired - Fee Related JP2745786B2 (en) | 1990-06-15 | 1990-06-15 | TAB semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2745786B2 (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5672547A (en) * | 1996-01-31 | 1997-09-30 | Industrial Technology Research Institute | Method for bonding a heat sink to a die paddle |
| US5825625A (en) * | 1996-05-20 | 1998-10-20 | Hewlett-Packard Company | Heat conductive substrate mounted in PC board for transferring heat from IC to heat sink |
| US5960535A (en) * | 1997-10-28 | 1999-10-05 | Hewlett-Packard Company | Heat conductive substrate press-mounted in PC board hole for transferring heat from IC to heat sink |
| WO2004105142A1 (en) * | 2003-05-26 | 2004-12-02 | Matsushita Electric Works, Ltd. | Light-emitting device |
| CN100391017C (en) * | 2003-05-26 | 2008-05-28 | 松下电工株式会社 | Light-emitting device |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61247040A (en) * | 1985-04-24 | 1986-11-04 | Mitsubishi Electric Corp | Manufacture of semiconductor device |
| JPH01270335A (en) * | 1988-04-22 | 1989-10-27 | Hitachi Ltd | Semiconductor device |
-
1990
- 1990-06-15 JP JP2157953A patent/JP2745786B2/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61247040A (en) * | 1985-04-24 | 1986-11-04 | Mitsubishi Electric Corp | Manufacture of semiconductor device |
| JPH01270335A (en) * | 1988-04-22 | 1989-10-27 | Hitachi Ltd | Semiconductor device |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5672547A (en) * | 1996-01-31 | 1997-09-30 | Industrial Technology Research Institute | Method for bonding a heat sink to a die paddle |
| US5783860A (en) * | 1996-01-31 | 1998-07-21 | Industrial Technology Research Institute | Heat sink bonded to a die paddle having at least one aperture |
| US5825625A (en) * | 1996-05-20 | 1998-10-20 | Hewlett-Packard Company | Heat conductive substrate mounted in PC board for transferring heat from IC to heat sink |
| US5960535A (en) * | 1997-10-28 | 1999-10-05 | Hewlett-Packard Company | Heat conductive substrate press-mounted in PC board hole for transferring heat from IC to heat sink |
| US6018193A (en) * | 1997-10-28 | 2000-01-25 | Hewlett-Packard Company | Heat conductive substrate press-mounted in PC board hole for transferring heat from IC to heat sink |
| WO2004105142A1 (en) * | 2003-05-26 | 2004-12-02 | Matsushita Electric Works, Ltd. | Light-emitting device |
| CN100391017C (en) * | 2003-05-26 | 2008-05-28 | 松下电工株式会社 | Light-emitting device |
| US7495322B2 (en) | 2003-05-26 | 2009-02-24 | Panasonic Electric Works Co., Ltd. | Light-emitting device |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2745786B2 (en) | 1998-04-28 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US6841423B2 (en) | Methods for formation of recessed encapsulated microelectronic devices | |
| JPH07106477A (en) | Heat sink assembly with heat conduction board | |
| JPS6376444A (en) | Chip carrier | |
| US5218215A (en) | Semiconductor device package having a thermal dissipation means that allows for lateral movement of the lead frame with respect to the housing without breakage of the thermal dissipation path | |
| JPH02276264A (en) | Ceramic package provided with heat sink | |
| JPH0448740A (en) | Tab semiconductor device | |
| US6784536B1 (en) | Symmetric stack up structure for organic BGA chip carriers | |
| JPS59219942A (en) | Chip carrier | |
| JPS6063952A (en) | Mounting method for resin-sealed type semiconductor device | |
| JP2961976B2 (en) | Semiconductor package with heat sink | |
| JPH07235633A (en) | Multi-chip module | |
| KR950006441Y1 (en) | High heat semiconductor package | |
| JPH0878616A (en) | Multi-chip module | |
| JPS58218148A (en) | Cooling device for electronic part | |
| JPS63289847A (en) | Heat dissipation structure of lsi package | |
| JPH034039Y2 (en) | ||
| JPH04124860A (en) | Semiconductor package | |
| JPH043505Y2 (en) | ||
| JPH03104142A (en) | Resin sealed type semiconductor device | |
| JPS62117351A (en) | Plastic-package type semiconductor device | |
| JPH0412555A (en) | Semiconductor device | |
| JPS6076149A (en) | Chip carrier | |
| JPH0831986A (en) | Semiconductor device having heatsink | |
| JPS6063953A (en) | Resin-sealed semiconductor device | |
| TWI258164B (en) | Semiconductor package with heat-dissipating structure |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20080213 Year of fee payment: 10 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20090213 Year of fee payment: 11 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20090213 Year of fee payment: 11 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20100213 Year of fee payment: 12 |
|
| LAPS | Cancellation because of no payment of annual fees |