CN100391017C - Light-emitting device - Google Patents

Light-emitting device Download PDF

Info

Publication number
CN100391017C
CN100391017C CNB2004800147284A CN200480014728A CN100391017C CN 100391017 C CN100391017 C CN 100391017C CN B2004800147284 A CNB2004800147284 A CN B2004800147284A CN 200480014728 A CN200480014728 A CN 200480014728A CN 100391017 C CN100391017 C CN 100391017C
Authority
CN
China
Prior art keywords
light emitting
emitting device
plate
base
mounting
Prior art date
Application number
CNB2004800147284A
Other languages
Chinese (zh)
Other versions
CN1795567A (en
Inventor
内野野良幸
岩堀裕
木村秀吉
杉本胜
桥本拓磨
哲 森
横谷良二
武藤正英
石崎真也
西冈浩二
铃木俊之
Original Assignee
松下电工株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to JP148050/2003 priority Critical
Priority to JP2003148050 priority
Priority to JP298007/2003 priority
Priority to JP394451/2003 priority
Application filed by 松下电工株式会社 filed Critical 松下电工株式会社
Publication of CN1795567A publication Critical patent/CN1795567A/en
Application granted granted Critical
Publication of CN100391017C publication Critical patent/CN100391017C/en

Links

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10Bump connectors; Manufacturing methods related thereto
    • H01L2224/15Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484Connecting portions
    • H01L2224/48463Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/00011Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10Details of semiconductor or other solid state devices to be connected
    • H01L2924/11Device type
    • H01L2924/12Passive devices, e.g. 2 terminal devices
    • H01L2924/1204Optical Diode
    • H01L2924/12041LED
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191Disposition
    • H01L2924/19101Disposition of discrete passive components
    • H01L2924/19107Disposition of discrete passive components off-chip wires

Abstract

一种发光器件,其包括:底座,其包括由电绝缘材料制成的安装基底,安装在安装基底上的至少一个发光二极管晶片和形成于所述安装基底上以电连接到所述发光二极管晶片的电导线;和用于传热的第一板,其包括金属板;其中与所述第一板的金属板相对的安装基底的第一平面被热接合到所述第一板,并且所述安装基底具有凹口,所述至少一个发光二极管晶片安装在所述凹口的底部上。 A light emitting device, comprising: a base including a mounting base made of an electrically insulating material, is mounted on the mounting base at least one light emitting diode chip and the light emitting diode chip mounted on the substrate to be electrically connected to the formed electrical leads; and the first plate for transferring heat, comprising a metal plate; a first plane wherein the metal plate opposite the first plate mounting substrate is thermally bonded to the first plate, and the mounting a substrate having a recess, the at least one light emitting diode chip mounted on the bottom of the recess. 所述传热意味着热量通过所述底座和用于传热的所述第一板之间的固体材料进行传导。 The heat transfer means of heat conduction through the solid material between the base and the first plate for the heat transfer. 热连接包括两平面之间的接触或其用焊料或类似物接合。 Thermal connection between the two planes includes a contact or engagement with solder or the like.

Description

发光器件 The light emitting device

技术领域 FIELD

本发明涉及一种具有发光二极管的发光器件,尤其涉及一种具有良好传热性能的发光器件。 The present invention relates to a light emitting device having a light emitting diode, and particularly to a light emitting device having good heat transfer properties.

10背景技术 Background 10

近来,通过基于氮化镓半导体发射蓝光或紫外线的发光二极管(LED) 晶片与各种类型的荧光材料结合,发出不同于LED晶片发出的光的一种或多种颜色的光(包括白光)的发光器件已被开发。 Recently, (LED) chip with a fluorescent material types joined by a light emitting diode emitting blue or ultraviolet light gallium nitride-based semiconductor, emit one or more colors of light different from the light emitted from the LED chip (including white) of the light emitting device have been developed. 该发光器件例如具有体积小、重量轻和功耗低的优点,并且广泛地用于显示器的光源,代替小 The light-emitting device having a small size, for example, the advantage of light weight and low power consumption, and are widely used for the light source of the display, instead of the small

15灯泡的光源,液晶显示器的光源,等等。 A light source, a liquid crystal display light source bulb 15, and the like. 当这样的发光器件被用于显示器的光源、液晶板的光源或类似的光源时,每个晶片的亮度低并且不足。 When such a light emitting device is a light source for a display, a light source of a liquid crystal panel or the like of the light source, and the low luminance of each wafer insufficient. 于是提供LED管壳以使LED晶片安装和密封在安装基底上,该安装基底具有待连接到外电路的导电部分,通常所需数量的LED管壳被安装在印刷电路板上。 Thus providing the housing to the LED of the LED chip mounted on the mounting substrate and sealing, the mounting substrate having a conductive portion to be connected to an external circuit, the normally required number of LED bulb is mounted on the printed circuit board. 例如,日本专利特开2001-134558公开了一种发光器件,其中 For example, Japanese Patent Laid-Open 2001-134558 discloses a light emitting device, wherein

20在其凹口中具有发光二极管晶片的金属块被安装在金属平板上。 Metal block 20 having a light emitting diode chip in which a recess is mounted on a metal plate.

为了提供高的光强度,可以增加用于LED晶片的注入电流。 In order to provide a high light intensity can be increased injection current for the LED chip. 由于现在可用的LED晶片具有小至10X的效率,大部分输入电能被转化为热量, 因此热量随着电流的增加而增加。 Since the currently available LED wafer having a small efficiency of 10X, most of the input energy is converted into heat, so that heat increases with increasing current. 我们已经知道当温度因产生的热量而升高时诸如LED晶片的使用寿命和效率这样的特性受到损害。 We already know that when the temperature rises due to heat generated by such characteristics such as service life and efficiency of the LED chip is impaired. 由于用来安 Due to security

25 装LED管壳的印刷电路板通常由诸如聚酰亚胺或环氧树脂这样的低热传导率的树脂制造,因此产生的热量不会有效地从LED管壳被散发。 LED bulb 25 mounted in a printed circuit board is generally made of resin such as polyimide or epoxy such low thermal conductivity so that heat generated is not efficiently radiated from the LED housing.

图1显示了有效地传递在LED管壳中产生的热量的现有技术的发光器件99的一个例子(例如,日本专利特开2002-162626)。 Figure 1 shows an example (e.g., Japanese Patent Laid-Open 2002-162626) light emitting device of the prior art to effectively transfer heat generated in the LED 99 of the shell. 每个LED管壳90具有一对被称为平面安装型的外端子95,并且被安装在膜基底92上, Each LED bulb 90 has a pair of outer terminal 95 is called a surface mount type, and is mounted on the film substrate 92,

30 该膜基底是由聚酰亚胺制成的印刷电路板。 The film substrate 30 is a printed circuit board is made of polyimide. 导电图案的线路区域93形成于膜基底92的顶面上,而其背面用粘合剂接合到由金属制成的支承框架 Line region of the conductive pattern 93 is formed on the top surface of the film substrate 92, and its rear surface with an adhesive bonded to the support frame made of a metal

91上。 91. LED管壳90的电极95连接到线路93。 LED bulb 90. The electrode 95 connected to the line 93. 此外,在LED管壳90下方的区域垂直地通过膜基底92和框架91形成孔,具有高热传导率的粘性填充物94被填充到所述孔中直到LED管壳90的后面。 Further, in the region below the LED bulb 90 is formed vertically through the aperture frame 91 and film substrate 92, a viscous filler having a high thermal conductivity is filled into the hole 94 until the rear housing 90 of the LED. 由LED晶片产生5 的一部分热量经线路区域93传导到膜基底92并且进一步传导到框架91 以从那里散发。 A portion of the heat generated by the LED chip 5 via line 93 is conducted to the region of the film substrate 92 and further conducted to the frame 91 to dissipate therefrom. 此外,由LED管壳产生的大部分热量直接通过粘性填充物传导到膜基底92并且进一步传导到框架91以从那里散发。 In addition, most of the heat generated by the LED bulb 92 is directly conducted to the film substrate by adhesive and the filler is further conducted to the frame 91 to dissipate therefrom.

然而,上述的发光器件的传热结构具有以下的问题。 However, the heat transfer structure of the light-emitting device has the following problems. 主要由硅树脂制成并且具有高热传导率的粘性填充物被用来传导在LED晶片中产生的热io量,但是它具有的热传导率比诸如金属或陶瓷这样的材料更小。 Mainly made of silicon resin and having a high thermal conductivity for conducting the viscous filling is io in the amount of heat generated in the LED chip, it has a smaller thermal conductivity than a ceramic such as a metal or a material. 此外,除了将LED管壳安装到线路区域93的步骤之外,在其封装过程中至少还需要将所述填充物填充到所述孔中以用于形成传热路径的步骤。 Further, in addition to the step of mounting the LED circuit housing outside the region 93, in which the packaging process requires at least the step of filling is filled into the hole for forming a heat transfer path. 而且,填充步骤麻烦。 Further, the step of filling the trouble.

15 发明内容 15 SUMMARY OF THE INVENTION

本发明的目的是提供一种带有LED晶片的发光器件,其具有简单的结构以改善传热。 Object of the present invention is to provide a light emitting device with an LED chip, which has a simple structure to improve heat transfer.

在本发明的一个方面,提供一种发光器件,其包括:底座(submount), 其包括由电绝缘材料制成的安装基底,安装在安装基底上的至少一个发光 In one aspect of the present invention, there is provided a light emitting device, comprising: a base (submount), which comprises a mounting base made of an electrically insulating material, is mounted on the mounting base at least one light emitting

20 二极管晶片和形成于所述安装基底上以电连接到所述发光二极管晶片的电导线;和用于传热的第一板,其包括金属板;其中与所述第一板的金属板相对的安装基底的第一平面被热接合到所述第一板,并且所述安装基底具有凹口,所述至少一个发光二极管晶片安装在所述凹口的底部上。 And a diode chip 20 are formed on the substrate to mount electrical wires electrically connected to the light emitting diode chip; and the first plate for transferring heat, comprising a metal plate; wherein the metal plate opposite the first plate a first planar mounting substrate is thermally bonded to the first plate, and said mounting substrate having a recess, the at least one light emitting diode chip mounted on the bottom of the recess. 所述传热意味着热量通过所述底座和用于传热的所述第一板之间的固体材料 Said heat transfer means through said base and heat for the heat transfer between the solid material of the first plate

25进行传导。 25 conduction. 热连接包括两平面之间的接触或其用焊料或类似物接合。 Thermal connection between the two planes includes a contact or engagement with solder or the like.

优选地,用于传热的所述第一板包括所述金属板、形成于金属板上的绝缘层、和形成于所述绝缘层上的电连接图案层。 Preferably, the first heat transfer plate for a plate comprising a metal, an insulating layer formed on the metal plate and electrically connected to the pattern formed on the layer insulating layer. 所述底座的安装基底的第一平面被热接合到所述第一板的所述金属板的一部分,所述金属板的所述一部分为在与所述底座相对的一侧通过去除所述绝缘层和所述图案层 The first plane of the base portion of the mounting substrate is a metal plate of the first plate thermally bonded to, the part of the metal plate at the opposite side of the base by removing the insulating layer and the pattern layer

30而暴露的部分。 30 and the exposed portion. 所述底座的所述电导线电连接到所述第一板的所述电连接 The electrical conductor electrically connected to said base electrically connected to the first plate

图案层。 Pattern layer. 在所述晶片中产生的热量可以被传递到所述金属板。 The heat generated in the wafer can be transferred to the metal plate.

优选地,所述安装基底和所述第一板中的至少一个具有突起,该突起具有平面以热接合到所述安装基底和所述第一板中的另一个。 Preferably, the substrate and the first mounting plate having at least one projection, the projection having a planar thermally bonded to the first substrate and the other mounting plate. 因此,所述 Thus, the

安装基底可以直接被接合到所述第一板。 Mounting the substrate can be directly bonded to the first plate. 5 优选地,所述安装基底和所述第一板中的一个具有突起,而另一个具 5 Preferably, the mounting substrate and a first of said plates has a protrusion, and the other having

有凹口,从而所述突起适配在所述凹口中以在它们之间热接合。 A notch, so that the engagement projection adapted to heat therebetween in the recess.

优选地,用接合材料使所述发光二极管晶片面朝下地被安装到所述安装基底。 Preferably, the bonding material with the light emitting diode chip is mounted face-down to the mounting base.

优选地,所述安装基底包括通孔,所述通孔由热传导率高于所述安装】0 基底的材料制成的层覆盖。 Preferably, said mounting base comprises a through hole, the through-hole is higher than the thermal conductivity of the mounting layer made of a material covering the substrate 0]. 例如,所述通孔充满热传导率高于所述安装基底的材料。 For example, the through-hole filled with material of higher thermal conductivity than said mounting substrate.

优选地,所述发光器件进一步包括设在所述安装基底和用于传热的所述第一板之间的金属元件。 Preferably, the light emitting device further comprises a substrate and provided on said mounting member for a metal heat transfer between the first plate. 所述金属元件与所述底座的安装基底以及所述第一板的所述金属板的所述暴露部分热接合。 The metal base is mounted to said base member and said metal plate exposed portion of the first plate thermally bonded. 例如,所述金属元件是接合15元件,以将所述底座的安装基底接合到所述第一板的所述金属板的所述暴露部分。 For example, the engaging element is a metal element 15, the metal plate to the base of said mounting substrate is joined to the exposed portion of the first plate.

优选地,所述安装基底由陶瓷材料制造。 Preferably, the mounting substrate made from a ceramic material. 因此,可以比由树脂制造的安装基底更有效地传递热量。 Thus, the heat can be transferred more efficiently than the mounting substrate made of a resin.

在本发明的不同方面, 一种发光器件进一步包括在所述安装基底的第20 —平面上的至少一个凹槽。 In various aspects of the invention, a light emitting device further comprises a first substrate 20 is mounted in the - at least one groove in the plane. 优选地,所述至少一个凹槽中的每一个都包括一个底部和两个侧面,所述两个侧面之间的宽度沿着从所述底部向所述至少一个凹槽中的每一个的开口的方向增加。 Preferably, each of said at least one groove comprises a bottom and two sides, the at least one opening along a width between the two sides from the bottom of the recess to each of the increasing direction.

优选地,所述发光器件进一步包括在所述至少一个凹槽上形成的层, 所述层由热传导率高于所述安装基底的材料形成。 Preferably, the light emitting device further comprises at least one layer formed on the groove, the layer is formed from a thermal conductivity higher than the material of the mounting substrate. 25 优选地,用接合材料使所述发光二极管晶片面朝下地被安装到所述安 25 Preferably, the bonding material so that the LED chip is mounted face-down to the safe

装基底,并且所述至少一个凹槽形成于所述接合材料和所述安装基底的第一平面之间以热接合到所述金属板的所述暴露部分。 Loading the substrate, and at least one groove formed in the engagement between the first material and the plane of the mounting substrate to thermally bonded to the exposed portion of the metal plate.

优选地,提供了两个或以上的凹槽,并且所述凹槽的密度朝着刚好处于所述二极管晶片之下的区域增加。 Preferably, two or more grooves, and the density of the recess toward just below the area of ​​the diode in the wafer increased. 30 优选地,所述至少一个凹槽的数量等于或大于两个,并且所述凹槽具 30 Preferably, said at least a number of grooves equal to or greater than two, and said recess having

有不同的深度。 There are different depths. 所述凹槽的深度朝着刚好处于所述二极管晶片之下的区域增加。 The depth of the recess towards the region immediately below the diode in the wafer increased.

优选地,所述至少一个凹槽的数量等于或大于两个,并且所述凹槽的密度朝着刚好处于所述接合材料之下的区域增加。 Preferably, at least a number of grooves equal to or greater than two, and said density towards the recess just regions under the bonding material increases. 5 优选地,所述至少一个凹槽的数量等于或大于两个,并且所述凹槽具 5 Preferably, at least a number of grooves equal to or greater than two, and said recess having

有不同的深度。 There are different depths. 所述凹槽的深度朝着刚好处于所述接合材料之下的区域增 The depth of the recess increases toward the area immediately below in the bonding material

优选地,所述至少一个凹槽的数量等于或大于两个,并且所述凹槽具有不同的深度。 Preferably, at least a number of grooves equal to or greater than two, and the groove have different depths. 所述至少一个凹槽的数量等于或大于两个,并且所述凹槽10的密度朝着刚好处于所述发光二极管晶片中的中央发光二极管晶片之下的区域增加。 At least one of said number of grooves is equal to or greater than two, and said density towards the recess 10 immediately below the region in the wafer center of the light emitting diode LED chip increases.

优选地,所述至少一个发光二极管晶片的数量等于或大于两个,所述至少一个凹槽的数量等于或大于两个,所述凹槽具有不同的深度,并且所述凹槽在所述至少一个发光二极管晶片中的中央发光二极管晶片和所述15金属板的所述暴露部分之间的区域中的深度大于在其它区域中的深度。 Preferably, the at least one light emitting diode chip number equal to or greater than two, at least a number of grooves equal to or greater than two, said groove having different depths, and at least the groove the central light-emitting diode chip a light emitting diode wafer 15 and the metal plate portion between the region of a depth greater than in other regions is exposed.

在本发明的另一方面,除了用于传热的第一板之外,所述发光器件进一步包括用于传热的第二板,该第二板被热接合到不同于其第一平面的所述底座的第二平面。 In another aspect of the present invention, in addition to the first heat transfer plate than the light emitting device further comprises a second heat transfer plate, the second plate is thermally bonded to a first plane which is different from the the second plane of the base. 因此在所述发光二极管晶片中产生的热量可以以两种方式通过所述第一和第二板被传递。 Therefore, the heat generated in the LED chip can be transferred in two ways through the first and second plates. 所述传热意味着热量通过所述底座和20用于传热的所述第一和第二板之间的固体材料进行传导。 Means that the heat transfer by conduction of heat between the solid material and the base plate 20 for the first and second heat transfer.

优选地,用于传热的所述第二板包括另一金属板、形成于另一金属板上的绝缘层、和形成于所述绝缘层上的电连接图案层。 Preferably, the second heat transfer plate for a plate comprising another metal, another metal layer formed on the insulating plate, and electrically connected to the pattern formed in the layer on the insulating layer. 所述电连接图案层电连接到所述底座的所述导线。 The electrical connection pattern electrically connected to the conductor layer of the base. 如果所述底座的所述安装基底被直接接合到所述金属板,那么热量被更有效地传递到所述第二板。 If the base of the mounting substrate is directly bonded to the metal plate, the heat is more effectively transferred to the second plate. 25 优选地,所述第一和第二板中的一个包括至少一个板状元件以与所述 25 Preferably, the first and second plates comprises a plate-like element to at least one of the

第一和第二板中的另一个热接合。 Another heat the first and second engaging plate.

优选地,所述发光器件进一步包括设在所述第一和第二板之间的导热元件以与所述第一和第二板中的每一个热接合。 Preferably the thermally conductive member, said light emitting device further comprises disposed between the first and the second plate to engage with each of the first and second heat plate.

优选地,所述第一和第二平面中的一个具有在安装在所述安装基底上30的所述至少一个发光二极管晶片之上的开口。 Preferably, the first and second plane of a substrate mounted on the opening 30 over the at least one light emitting diode chip having the mounting.

优选地,所述安装基底包括嵌入到其中的传热材料,所述传热材料具有比所述安装基底的主体更高的热传导率。 Preferably, the mounting substrate comprises a heat transfer material embedded therein, said heat transfer material having a higher than that of the mounting substrate the thermal conductivity of the body. 例如,所述传热元件与所述第一和第二板中的至少一个接合。 For example, at least one of said heat transfer element engaging the first and second plates.

本发明的一个优点是在发光二极管晶片中产生的热量可以容易地通5过热接合从底座传递到与其热接合的第一板。 One advantage of the present invention is that the heat generated in the LED chip can be easily engaged through a first hot plate 5 is transmitted thereto from the base to the thermal bonding.

本发明的另一个优点是发光二极管晶片的温度升高可以因有效的传热而下降。 Another advantage of the invention is to increase the temperature of the LED chip can be lowered due to efficient heat transfer.

本发明的进一步的优点是在发光二极管晶片中产生的热量可以更有效地通过多个传热路径被传递,以减小发光二极管晶片的温度。 A further advantage of the invention is that the heat generated in the LED chip can be more efficiently transmitted through a plurality of heat transfer path is to reduce the temperature of the light emitting diode chip.

0 0

附图说明 BRIEF DESCRIPTION

图1是现有技术的发光器件的剖面图; FIG. 1 is a sectional view of a light emitting device of the prior art;

图2是本发明的一个实施例的发光器件的剖面图; FIG 2 is a cross-sectional view of an embodiment of a light emitting device of the embodiment of the present invention;

图3是本发明的另一实施例的发光器件的剖面图; FIG 3 is a sectional view of a light emitting device according to another embodiment of the present invention;

5 图4是本发明的又一实施例的发光器件的剖面图; FIG 54 is a sectional view of the light emitting device according to still another embodiment of the present invention;

图5A是用于本发明的又一实施例的发光器件的LED的底座的剖面图,图5B是所述发光器件的剖面图; 5A is a cross-sectional view of an LED mount light emitting device according to another embodiment of the present invention, FIG. 5B is a sectional view of the light emitting device;

图6是本发明的一个实施例的发光器件的又一实施例的剖面图; 图7是用于本发明的又一实施例的发光器件的LED的底座的剖面图; FIG 6 is a sectional view of an embodiment of a light emitting device according to still another embodiment of the present invention; FIG. 7 is a sectional view of an LED mount light emitting device according to still another embodiment of the present invention;

0 图8是本发明的又一实施例的发光器件的剖面图; 0 Figure 8 is a sectional view of a light emitting device according to still another embodiment of the present invention;

图9是本发明的一个实施例的发光器件的又一实施例的剖面图; 图IO是本发明的又一实施例的另一发光器件的剖面图; 图11是本发明的又一实施例的发光器件的剖面图; 图12是本发明的又一实施例的发光器件的剖面图; 9 is a sectional view of an embodiment of a light emitting device according to still another embodiment of the present invention; Figure IO is a cross-sectional view of another light emitting device according to another embodiment of the present invention; FIG. 11 is another embodiment of the present invention. cross-sectional view of a light emitting device; FIG. 12 is a sectional view of a light emitting device according to another embodiment of the present invention;

5 图13是本发明的又一实施例的发光器件的剖面图; FIG. 513 is a sectional view of the light emitting device according to still another embodiment of the present invention;

图14是本发明的又一实施例的发光器件的一个应用的剖面图; 图15是本发明的所述实施例的发光器件的另一应用的剖面图; 图16是用于本发明的又一实施例的发光器件的LED的底座的剖面 FIG 14 is a cross-sectional view of an application of the light emitting device according to still another embodiment of the present invention; FIG. 15 is a sectional view of another application of the light emitting device according to the embodiment of the present invention; and FIG. 16 is used in the present invention cross-sectional view of the LED light emitting device mount according to an embodiment of the

图; Figure;

0 图17是本发明的又一实施例的发光器件的剖面图;图18是本发明的又一实施例的发光器件的剖面图; 0 FIG. 17 is a sectional view of the light emitting device according to still another embodiment of the present invention; FIG. 18 is a sectional view of a light emitting device according to still another embodiment of the present invention;

图19A是用于本发明的又一实施例的发光器件的LED的底座的剖面图,图19B是用于LED的底座的底视平面图,图19C是所述发光器件的剖面图,图19D是所述发光器件的改进实施例的剖面图; 5 图20A是用于本发明的又一实施例的发光器件的LED的底座的剖面 19A is a cross-sectional view of the base of the LED used in the present invention is a further embodiment of the light emitting device of the embodiment, FIG. 19B is a bottom plan view of the base for the LED, FIG. 19C is a sectional view of the light emitting device, FIG. 19D is the improved cross-sectional view of a light emitting device embodiment; FIG. 5 is a cross-sectional view of the LED mount 20A of the light emitting device according to another embodiment of the present invention.

图,图20B是用于LED的底座的底视平面图,图20C是所述发光器件的剖面图,图20D是所述发光器件的改进实施例的剖面图; FIG, 20B is a bottom plan view of the base for the LED, FIG. 20C is a sectional view of the light emitting device, FIG. 20D is a sectional view of an improved embodiment of the light emitting device;

图21是本发明的一个实施例的发光器件的又一实施例的剖面图; 图22是本发明的又一实施例的发光器件的剖面图; 10 图23是本发明的又一实施例的发光器件的剖面图; FIG 21 is a cross-sectional view of an embodiment of a light emitting device according to still another embodiment of the present invention; FIG. 22 is a sectional view of a light emitting device according to another embodiment of the present invention; 10 FIG. 23 is another embodiment of the present invention. sectional view of a light emitting device;

图24是本发明的又一实施例的发光器件的剖面图; 图25是本发明的又一实施例的发光器件的剖面图; 图26是本发明的又一实施例的发光器件的剖面图; 图27是本发明的一个实施例的发光器件的又一实施例的剖面图; 15 图28是本发明的又一实施例的发光器件的剖面图; FIG 24 is a sectional view of the light emitting device according to still another embodiment of the present invention; FIG. 25 is a sectional view of a light emitting device according to still another embodiment of the present invention; FIG. 26 is a sectional view of a light emitting device according to still another embodiment of the present invention. ; FIG. 27 is a sectional view of still another embodiment of a light emitting device according to an embodiment of the present invention; 15 FIG. 28 is a sectional view of the light emitting device according to still another embodiment of the present invention;

图29是本发明的又一实施例的发光器件的剖面图; 图30是本发明的又一实施例的发光器件的剖面图; 图31是本发明的又一实施例的发光器件的剖面图; 图32A是用于本发明的又一实施例的发光器件的LED的底座的剖面20 图,图32B是所述底座的底视平面图; FIG 29 is a sectional view of a light emitting device according to another embodiment of the present invention; FIG. 30 is a sectional view of a light emitting device according to still another embodiment of the present invention; FIG. 31 is a sectional view of a light emitting device according to still another embodiment of the present invention. ; base of the LED 32A is a further embodiment of the present invention, the light emitting device 20 of the embodiment of a cross-sectional view of FIG. 32B is a bottom plan view of the base;

图33是用于本发明的一个实施例的发光器件的LED的底座的底视平面图; FIG 33 is a bottom plan view of a chassis of the LED light emitting device according to the present embodiment of the invention;

图34是用于本发明的又一实施例的发光器件的LED的底座的底视平面图; FIG 34 is a bottom plan view of the base of the LED light emitting device according to another embodiment of the present invention;

25 图35A是用于本发明的又一实施例的发光器件的LED的底座的剖面图;图35B是用于LED的所述底座的底视平面图; 25 FIG 35A is a cross-sectional view of an LED mount light emitting device according to still another embodiment of the present invention; FIG. 35B is a bottom plan view of the base for the LED;

图36是用于本发明的又一实施例的发光器件的LED的底座的底视平面图; FIG 36 is a bottom plan view of the LED mount light emitting device according to still another embodiment of the present invention;

图37是用于本发明的又一实施例的发光器件的LED的底座的底视平 The LED base 37 is a further embodiment of the present invention, the light emitting device is a bottom view of the embodiment of the flat

30 面图; FIG surface 30;

图38是用于本发明的又一实施例的发光器件的LED的底座的底视平面图; FIG 38 is a bottom plan view of the LED mount light emitting device according to still another embodiment of the present invention;

图39是用于本发明的又一实施例的发光器件的LED的底座的底视平面图; FIG 39 is a bottom plan view of the LED mount light emitting device according to still another embodiment of the present invention;

5 图40A是本发明的又一实施例的发光器件的剖面图,图40B是用于 FIG 5 is a sectional view of a light emitting device 40A according to another embodiment of the present invention, FIG. 40B is a

所述发光器件的LED的底座的透视图; The LED is a perspective view of the base of the light emitting device;

图41A是是本发明的又一实施例的发光器件的剖面图,图41B是用于所述发光器件的LED的底座的透视图; FIG 41A is a sectional view of a light emitting device according to still another embodiment of the present invention, FIG. 41B is a perspective view of an LED mount for the light emitting device;

图42是本发明的又一实施例的发光器件的剖面图; io 图43是用于本发明的又一实施例的发光器件的LED的底座的透视 FIG 42 is a sectional view of the light emitting device according to still another embodiment of the present invention; FIG. 43 is a base IO another LED lighting device of the present invention according to a perspective view of the embodiment of

图; Figure;

图44是用于本发明的又一实施例的发光器件的LED的底座的透视 A perspective view of the LED base 44 is a further embodiment of the present invention, the light emitting device of the embodiment of

图; Figure;

图45是本发明的又一实施例的发光器件的剖面图; FIG 45 is a sectional view of the light emitting device according to still another embodiment of the present invention;

is 图46A是用于图45中所示的发光器件的LED的底座的前视图,图 Front view of the LED of FIG. 46A is the base for the light emitting device shown in FIG. 45, FIG.

46B是其沿线E-E'的剖面图; 46B is a sectional view taken along line E-E 'of;

图47是本发明的又一实施例的发光器件的剖面图; FIG 47 is a sectional view of a light emitting device according to still another embodiment of the present invention;

图48是从右侧观察到的图47中所示的发光器件的剖面图; FIG 48 is a sectional view of the light emitting device shown in FIG viewed from the right to 47;

图49A是用于图47中所示的发光器件的LED的底座的前视图,图 FIG 49A is a front view of an LED base for the light emitting device shown in FIG. 47, FIG.

20 49B是其右侧视图; 20 49B is a right side view thereof;

图50A是用于图47中所示的发光器件的、用于传热的第一板的示图, 图50B是其右侧视图; FIG 50A is a light emitting device shown in FIG. 47, a diagram of a first heat transfer plate, FIG. 50B is a right side view thereof;

图51是本发明的又一实施例的发光器件的剖面图; FIG 51 is a sectional view of a light emitting device according to another embodiment of the present invention;

图52A是用于图51中所示的发光器件的LED的底座的前视图,图 FIG 52A is a front view of the base of the LED light emitting device shown in FIG. 51, FIG.

25 52B是其沿线F-F'的剖面图; 25 52B is a sectional view taken along line F-F 'of;

图53是本发明的又一实施例的发光器件的剖面图; 图54A是用于图53中所示的发光器件的LED的底座的前视图,图54B是其沿线G-G'的剖面图; FIG 53 is a sectional view of a light emitting device according to another embodiment of the present invention; FIG. 54A is a front view of the base of the LED light emitting device shown in FIG. 53 is used, FIG. 54B is a sectional view taken along line G-G 'of ;

图55是本发明的又一实施例的发光器件的剖面图; FIG 55 is a sectional view of the light emitting device according to still another embodiment of the present invention;

30 图56A用于图55中所示的发光器件的LED的底座的前视图,图56B Front view of the LED base 30 of FIG. 56A for the light emitting device shown in FIG. 55, FIG. 56B

是其沿线H-H'的剖面图; Which is a sectional view along line H-H 'of;

图57A是用于根据本发明的一个实施例的发光器件的LED的底座的前视图,图57B是其沿线Ir的剖面图; FIG 57A is a front view of the base of the LED light emitting device in accordance with one embodiment of the present invention, FIG. 57B is a sectional view thereof along the line of Ir;

图58A是带有用于LED的底座的所述发光器件沿图57A中的线5 的剖面图,图58B是沿图57B中的线J-J'的又一剖面图; FIG 58A is a sectional view of the light emitting device in FIG. 57A with a base for the LED of line 5, and FIG. 58B is another cross-sectional view taken along the line 57B J-J 'of;

图59A是用于本发明的又一实施例的发光器件的LED的底座的剖面图,图59B是其被安装在板上的状态下的剖面图,图59C是用于解释制造用于传热的多层型式的过程的剖面图;和 FIG 59A is a further cross-sectional view of the base according to the present invention, an LED light emitting device according to the embodiment, FIG. 59B is a sectional view in a state where the board is mounted, and FIG 59C are views for explaining manufacturing a heat sectional view of a multilayer type process; and

图60A是一种发光器件的剖面图,该发光器件具有安装在用于传热io的印刷板上用于光量控制的透镜,图60B是设置成与印刷板分离的光量控制透镜的剖面图。 FIG 60A is a cross-sectional view of a light emitting device, the light emitting device mounted on a printed board having a heat io lens for light amount control, FIG. 60B is a sectional view of the amount of light provided to the printing plate is separated from the control lenses.

具体实施方式 Detailed ways

下面参考附图解释本发明的若干实施例的发光器件,其中在全部的若 The invention is explained below with reference to the drawings of several embodiments of the light emitting device, wherein if at all

15干视图中相同的参考字符表示相同的或对应的部件。 Stem 15 views the same reference characters designate the same or corresponding parts.

图2显示了本发明的实施例的发光器件200。 2 shows a light emitting device 200 of the embodiment of the present invention. 在发光器件200中,用于LED的底座100的底部11与电路板300的金属板30热接触。 In the light emitting device 200, the metal plate 30 for heat from the LED base 11 and the bottom portion 100 of the circuit board 300 contacts. 底座100 具有安装基底10和安装在安装基底10上的发光二极管(LED)晶片5, 所述安装基底具有导线12-14和15-17。 Base 100 has a mounting base 10 and light emitting diodes mounted on the mounting substrate 10 (LED) chip 5, the mounting substrate having conductors 12-14 and 15-17. LED晶片5沿垂直于其上示出了 LED chip 5 in a direction perpendicular thereto is shown

20图2的纸张的方向发出线束。 Direction of the sheet 20 of FIG. 2 emitted harness. 电路板300具有金属板30和用于形成于电绝缘层40上的电导体的金属图案41。 Circuit board 300 and the metal plate 30 having a metal pattern for electrical conductors formed on the electrically insulating layer 40 is 41. LED晶片5具有氮化镓半导体。 Gallium nitride semiconductor wafer having LED 5. 在该实施例和以下的实施例中,LED晶片5具有氮化镓半导体,但并不局限于此。 In the embodiment of the following examples and embodiments, LED 5 has the gallium nitride semiconductor wafer, but is not limited thereto.

底座100具有安装基底10,该安装基底具有类似于杯体的凹口以用25于在其中央安装LED晶片5。 Base 100 has a mounting base 10, the mounting substrate having a recess similar to the cup 25 used in mounting the LED chip in the central 5. 它具有台阶以形成突起11,所述突起形成于其底面并且向下延伸,并且这样产生了类似字母T的剖面。 It has a step to form a protrusion 11 formed thereon and a bottom surface extending downwardly, and thus produces the cross-section like a letter T projection. 此外,它在底座100上具有导线12-14和其它导线15-17,导线12-14从所述杯体的底部附近沿图2中的向右方向朝着所述板的下台阶的底部延伸,导线15-17从所述杯体的底部附近沿图2中的向左方向朝着所述底部延伸。 Further, wires having other conductors 12-14 and 15-17 on the base 100, the wires 12-14 extending from the right direction in FIG. 2 in the vicinity of the bottom of the cup towards the bottom of the plate at step , leads 15-17 extends from the leftward direction in FIG. 2 in the vicinity of the bottom of the cup towards the bottom. 底30座100通常关于围绕类似字母T形状的轴线的旋转具有对称形状,但是其形状并不局限于此。 The bottom 100 is generally about 30 to rotate about the axis of the shape like the letter T having a symmetrical shape, but the shape is not limited thereto. 例如,它可以是矩形的。 For example, it may be rectangular.

用压模接合材料将LED晶片5接合到安装基底10上的杯体的底部, The LED chip 5 is bonded to the bottom of the cup is mounted on the substrate 10 with the die bonding material,

并且设在其顶上的两个电极(未示出)用线6连接到为在所述电导线中的布线提供的部分12、 15。 And two electrodes provided on its top (not shown) is connected to the wiring of the electrical conductor portion 12 is provided, with the wires 15 6. 5 此外,电路板300的金属板30的一部分在底座100的一侧被暴露, 5 In addition, a portion of the circuit board 30 of the metal plate 300 is exposed in the side of the base 100,

通过热接触与用于安装LED晶片5的顶面相对的突起11的底部平面,底座100被安装到所述暴露部分。 By mounting the LED in thermal contact with a top surface of the wafer opposite to the projection plane 11 of the bottom 5, the base 100 is mounted to the exposed portion. 安装基底10的底部平面与金属板30的所述暴露区域接触的部分在下文中被称为热接触部分1。 The bottom region of the contact plane of the metal plate 10 of the mounting substrate 30 in the exposed portion of the heat hereinafter referred to as a contact portion. 电导线12-14、 15-17 用焊料42接合到电路板300的图案41。 Electrical leads 12-14, 15-17 joining with solder 42 to the circuit board 300 of the pattern 41. 在该结构中,传热路径从安装基 In this configuration, the heat transfer path from the mounting base

io 底10被提供给金属板30,从而在LED晶片5中产生的热量可以容易地被引导到电路板300。 io 10 is supplied to the bottom metal plate 30, so that heat generated in the LED chip 5 can be easily guided to the circuit board 300. 此外,通过使用用于电路板300的电图案41的电连接的回流焊步骤,制造过程可以被简化,其中热接触可以同时形成于安装基底10和电路板300之间以提高传热效率。 Further, by using a pattern of the solder reflow step is electrically connecting the electrical circuit board 300 for 41, the manufacturing process can be simplified, which is in thermal contact may be formed between the circuit board 10 and the mounting substrate 300 simultaneously in order to improve heat transfer efficiency. 通过在与金属板30相对的安装基底10的平面上形成金属层,并且通过用焊料将其接合到金属板30 Forming a metal layer by a metal plate 10 on a plane of the metal plate 30 opposite the mounting substrate, and by joining it with solder 30

15 的所述暴露区域,可以进一步提高传热效率。 The exposed area 15, the heat transfer efficiency can be further improved. 这也适用于随后说明的其它实施例。 This also applies to other embodiments described later.

图3显示了本发明的另一实施例的发光器件201 。 Figure 3 shows the light emitting device of another embodiment of the present invention 201. 该发光器件201类似于第一实施例的发光器件200,区别在于底座101的安装基底10具有用于安装LED晶片5的平坦顶面。 The light emitting device 201 is similar to the light emitting device 200 according to the first embodiment, except that the base 101 of the attachment base 10 having a flat top surface for mounting the LED chip 5. 例如,当底座101在安装基底10的顶 For example, when the top chassis 101 is mounted in the base 10 of

20 板上难以具有凹口时,例如如果它由陶瓷材料制造,或者当它不需要在顶板上具有凹口时,该类型的底座可以被用于安装LED晶片5。 When the board 20 is difficult to have a recess, for example, if it consists of a ceramic material, or when it is not required to have a recess in the top plate, the type of base may be used to mount the LED chip 5.

图4显示了本发明的又一实施例的发光器件202。 Figure 4 shows a further embodiment of the present invention, the light emitting device 202 of the embodiment. 在发光器件202中, 底座102被安装在电路板302上,其中LED晶片50面朝下地被安装在安装基底10上(倒装片接合)。 In the light emitting device 202, the base 102 is mounted on the circuit board 302, in which the LED chip 50 is mounted face-down on the mounting substrate 10 (flip chip bonding). 安装基底IO具有没有突出的平坦底板,而 IO mounting base having a flat plate does not protrude, and

25 电路板302在暴露区域具有突起31。 25 circuit board 302 has a projection 31 in the exposed region. 底座102和电路板302之间的接合等等类似于上述的发光器件。 Engagement between the base 102 and the circuit board 302 and the like similar to the above light emitting device.

下面解释LED晶片50及其面朝下安装。 LED 50 will be explained and mounted facedown wafer. LED晶片50具有相继叠加在其上的透明晶体板60, n型半导体层61, p型半导体层64,以及形成于所述半导体层上的电极62、 65。 LED wafer 50 having successively superimposed thereon a transparent quartz plate 60, n-type semiconductor layer 61, p-type semiconductor layer 64, and an electrode formed on the semiconductor layer 62, 65. 此外,电绝缘层67和金属层68相继30 形成于p型半导体层64上。 Furthermore, the electrically insulating layer 67 and the metal layer 68 are formed sequentially on the 30 p-type semiconductor layer 64. 通过将透明晶体板60安置在上面而将电极62、 65安置在下面(面朝下),LED晶片50被安装在安装基底10的杯体上。 By the transparent plate 60 is disposed above the crystal and the electrodes 62, 65 disposed below (face-down), LED chip 50 is mounted on the mounting base 10 of the cup body.

在安装基底10的杯体的底部,除了电导线12、 15之外,形成假图案18。 At the bottom of the cup body mounting base 10, in addition to the electrical conductors 12, 15, the dummy pattern 18 is formed. 接合材料63、 66、 69预先被设置在底部的图案上以用于使它们与LED 5 晶片50的电极接合。 The bonding material 63, 66, 69 are previously disposed on the base pattern for the LED 5 so that they engage the wafer electrode 50. n型半导体层61与电极62和安装基底10上的图案12之间的接合材料63电连接。 Electrical engagement between the material 63 12 n-type semiconductor layer 61 and the mounting substrate 62 and the electrode pattern 10 on the connection. p型半导体层64与电极65和安装基底10 上的图案15之间的接合材料66电连接。 The p-type semiconductor layer 64 and the electrode 65 is connected to the mounting base material 66 of the electrical engagement between the pattern 15 on 10. 此外,LED晶片上的金属层68 用接合材料69与安装基底10上的假图案18连接。 Further, the metal layer on the LED chip 6869 is mounted is connected to the dummy pattern 10 on the substrate 18 by a bonding material.

接合材料63、 66、 69对于螺柱隆起由诸如金或合金这样的金属制造, io 或者对于焊料隆起由焊料制造。 The bonding material 63, 66, 69 for a stud bump made of metal or alloy such as gold, or bump IO manufactured by a solder such as for solder. 通过使用这样的接合材料,LED晶片50 和安装基底IO之间的热接合可以被提高并超过引线接合,从而可以提高传热效率。 By using such a bonding material, thermal bonding and the mounting substrate 50 between the IO LED wafer can be increased and more than wire bonding, thereby improving heat transfer efficiency. 对于每个电极62和65,接合材料可以是一个,但是通过为每个电极提供多个接合材料,可以进一步提高传热效率。 For each of the electrodes 62 and 65, the bonding material may be one, but by providing a plurality of bonding material, each electrode can be further improved heat transfer efficiency.

如果用于接合的必要区域的开口形成于在电极上和在半导体层上形15成的绝缘层上,接合材料之间縮短的可能性可以被减小,从而可以使用更多的接合材料。 If the opening area necessary for bonding is formed on the upper electrode 15 and formed into an insulating layer on the semiconductor layer, the bonding material between the possibility of shortening can be reduced, so that the bonding material can be used more. 作为另一选择,绝缘层67的一部分被金属化以形成与其它电极62和65绝缘的金属层68,除了用于其它电极62、 65的接合之外, 可以增加用于接合的所述区域的尺寸,这增强了热接触。 Alternatively, a portion of the insulating layer 67 is metallized to form the electrodes 62 from other regions of the metal layer 65 and the insulation 68, 62 in addition to the engagement, for the other electrodes than 65 may be increased for joining of size, which enhances the thermal contact.

图5A是用于本发明的又一实施例的发光器件203的LED的底座103 20的剖面图,图5B是发光器件203的剖面图。 5A is a sectional view of still another invention of the LED light emitting device 203 of the base 20 in embodiment 103, FIG. 5B is a sectional view of a light emitting device 203. 底座103具有一种结构,其中安装基底10具有通孔20,所述通孔从用于安装LED晶片50的顶部上的凹口的底部延伸到安装基底10的底板。 Base 103 has a structure in which the mounting substrate 10 has a through hole 20, extends from the bottom of the recess on top of the through-hole 50 for mounting the LED chip to the mounting substrate 10 of the base plate. 通孔20的尺寸朝着安装基底10的底部增加,并且金属层21用焊接或类似方法形成于通孔20的内表面上,这类似于图案。 Size of the through-hole 20 increases toward the bottom of the mounting base 10, and the metal layer 21 formed on the inner surface of the through hole 20 by welding or the like, which is similar to the pattern. 当底座103被安装到电路板303时,通孔20上的25金属层21用焊料43连接到电路板303的金属板30的暴露金属区域。 When the base 103 is mounted to the circuit board 303, the metal layer 25 through holes 20 on the exposed metal region 21 is connected to the circuit board 303 of the metal plate 30 with solder 43. 在该结构中,由于在LED晶片50中产生的热量通过热传导率高于传统安装基底的金属层21朝着电路板303传导。 In this configuration, since the heat generated in the LED chip 50 than the conventional metal layer by the thermal conductivity of the mounting substrate 21 toward the circuit board 303 conducting. 于是,可以进一步提高传热效率。 Thus, it is possible to further improve the heat transfer efficiency. 图6显示了本发明的又一实施例的发光器件204,所述发光器件带有含通孔20的安装基底10。 6 shows a further embodiment of the present invention, the light emitting device 204 of the embodiment, the light-emitting device comprising a substrate with a mounting hole 20 through 10. 发光器件204与图5A和5B中所示的发光器件30 203不同,原因在于底座104在其底部具有突起11。 The light emitting device 204 and the light emitting device shown in FIGS. 5A and 5B 30,203 different, because the base 104 has a projection 11 at its bottom. 电路板300的金属板30具有平坦的暴露区域。 Metal plate 300 of the circuit board 30 having a flat exposed area. 与前述实施例类似的优点也可以在该结构中实现。 It may also be implemented in the structure similar advantages as in the previous embodiment.

图7显示了本发明的又一实施例的底座105,该底座具有充满填充物23的通孔,所述填充物例如为铜、银或焊料,其具有比安装基底10更高5的热传导率。 Figure 7 shows a further embodiment of the base 105 of the present invention, the base having a through-hole 23 is filled with a filler, the filler, for example, copper, silver or solder, having a substrate mounted higher than the thermal conductivity of 5 to 10 . 因此,与图5A、 5B和6中所示的发光器件相比,可以进一步提高传热效率。 Therefore, compared with. 5A, 5B and the light emitting device shown in FIG. 6, the heat transfer efficiency can be further improved.

图8显示了本发明的又一实施例的发光器件206。 Figure 8 shows yet another embodiment of the present invention, the light emitting device 206 of the embodiment. 发光器件206的底座106类似于图4中所示的底座102的安装基底10,区别在于为字母V 形的凹口19形成于底座106的安装基底10的底部。 The light emitting device 206 of the chassis base 106 shown in FIG. 4 is similar to the mounting substrate 10 of 102, except that the letter V-shaped recess 19 formed in the bottom of the base 106 of the mounting substrate 10. 电路板302类似于图 Circuit board 302 is similar to FIG.

io 4中所示的电路板302,区别在于它具有类似字母V的电路板302的金属板30的凸出32,该凸出与凹口19对应。 io circuit board 302 shown in Figure 4, except that it has a circuit board like the letter V projecting the metal plate 302 in 3230, the projection 19 corresponding to the recess. 通过将金属板30的凸出32适配到底座106的凹口19而制造发光器件206。 By the projection 32 in the end fitting recess 106 of base 30 of the metal plate 19 of the light emitting device 206 is manufactured. 在该结构中,可以增大安装基底10和金属板30之间的接触面积。 In this configuration, the installation can be increased contact area between the substrate 10 and the metal plate 30. 于是它们之间的热接触变得可靠, 它们之间的热阻被减小,并且用于LED晶片50的传热效率被提高。 Thus thermal contact therebetween becomes reliable, thermal resistance therebetween is reduced, and the efficiency of the LED chip 50 for the heat transfer is increased. 此外, In addition,

15 可以在将底座106安装到电路板306的步骤中容易地执行底座106和电路板306的对准。 15 can easily perform alignment of the base 106 and the circuit board 306 in the step of the base 106 is mounted to the circuit board 306.

图9-12显示了根据本发明的又一实施例的四种类型的发光器件207-210,所述发光器件在底座和电路板之间的热接触的结构上具有不同的组合。 Figures 9-12 show four types of the light emitting device of Example 207-210, the light emitting device having a structure different combinations in thermal contact between the base and the circuit board according to yet another embodiment of the invention. 首先,在图9中所示的发光器件207中,图2中所示的发光器件 First, the light emitting device shown in FIG. 9, 207, the light emitting device shown in FIG. 2

20中的突起的位置被颠倒。 Position the projection 20 is turned over. 也就是说,在图2中所示的发光器件200中,电路板308的金属板30的暴露区域是平坦的,而在发光器件207中,暴露区域具有突起31,该突起与安装基底10的平坦底部接触。 That is, in the light emitting device shown in FIG. 2 200, circuit board 308 exposed area of ​​the metal plate 30 is flat, whereas in the light emitting device 207, the exposed region has a projection 31, the projection 10 of the mounting base flat contact with the bottom. 在该情况下, 与图2中所示的发光器件200中的配对物相比,LED晶片5和金属板30 之间的距离变短,因此提高了传热效率。 In this case, compared with the counterpart in the light emitting device 200 shown in FIG. 2, LED chip 5 and the distance between the metal plate 30 is shortened, thus improving the heat transfer efficiency.

25 在另一方面,在图10、 11和12中所示的发光器件208、 209和210 25 In another aspect, the light emitting device in FIG. 10, 11 and 12 shown in 208, 209 and 210

中,安装基底10的底面和金属板30的暴露区域中的一个具有突起,而另一个具有凹口,并且所示突起适配所述凹口。 , The bottom surface of the metal plate 10 is mounted and the substrate is exposed in the region of 30 with a protrusion and the other has a recess, and said recess adapted to the projection shown in FIG. 需要注意的是发光器件209 和210具有带突起和凹口的双组合的结构,其中突起和凹口进一步具有内部的凹口或突起。 Note that the light emitting devices 209 and 210 having protrusions and recesses of the band structure of the double combination, wherein the projection and the recess further having an internal recess or protrusion. 在凹口(一个或多个)适配到突起(一个或多个)的这 In the recess (s) is adapted to the projection (s) of this

30些结构中,可以更精确地在制造过程中进行底座和电路板之间的对准,同 These structures 30 can be more accurately perform alignment between the base and the circuit board during the manufacturing process, with

时保持传热效率。 While maintaining the heat transfer efficiency.

在图11所示的发光器件209中,凹口33形成于金属板30的突起31 中,并且金属板30的凹口33适配到安装基底10的突起11。 In the light emitting device 209 shown in FIG. 11, the recess 33 formed in the metal plate 31 in the projection 30 and the recess 30 of the metal plate 33 is adapted to the mounting base 10, the protrusion 11. 在该结构中, 电路板309与底座的安装基底10之间的热接触区1的热接触面积大于图5 10所示的发光器件208中的情况,因此进一步提高了传热效率。 In this configuration, the contact area of ​​the heat thermal contact area between the circuit board 10 is mounted on the base 1 and the base 309 is larger than the light emitting device 10 shown in FIG. 5 of the case 208, thus further improving heat transfer efficiency.

图12中所示的发光器件210具有类似于图10中所示的发光器件208 的结构,区别在于凹口形成于安装基底10的突起11中以适配到金属板30的突起31。 The light emitting device shown in FIG. 12 in the light emitting device 210 has a structure similar to that shown in FIG. 10 208, except that the notch projection 11 is formed on the mounting base 10 to protrusion 31 fit into the metal plate 30. 因此,类似于发光器件208,金属板30和安装基底10之间的接触面积大于发光器件208的情况,并且LED晶片5和金属板30之io间的距离更短,因此进一步提高了传热效率。 Thus, similar to the light emitting device 208, the metal plate 30 and the contact area between the mounting substrate 10 is greater than the case where the light emitting device 208, and the distance between io LED chip 5 and the metal plate 30 of the shorter, thus further improving heat transfer efficiency .

图13显示了本发明的又一实施例的发光器件211。 Figure 13 shows a further embodiment of the present invention, the light emitting device 211 of the embodiment. 在发光器件211 中,图2中所示的发光器件200中的突起11被具有更高的热传导率的金属板25替换。 In the light emitting device 211, the metal plate 11 is replaced 25 having a higher thermal conductivity of the protrusions 200 in the light emitting device shown in FIG. 2. 因此,与图2中所示的发光器件200相比,热阻被减小以提高传热效率。 Thus, as compared with the light emitting device 2200 shown in FIG., The thermal resistance is reduced to improve heat transfer efficiency. 作为另一选择,电路板300可以具有薄绝缘层(例如厚度15等于或小于大约100微米)并且一层形成有焊料、银膏等以替代金属板25。 Alternatively, the circuit board 300 may have a thin insulating layer (e.g., a thickness equal to or less than about 15 100 microns) and is formed with a layer of solder, silver paste or a metal plate 25 in place.

接着,图14和15显示了上述发光器件的应用。 Next, FIGS. 14 and 15 show the application of the above light emitting device. 图14显示了上述的一个发光器件208应用于液晶显示器的背光,交通信号的发光部分等等。 14 shows a light emitting device 208 described above is applied to a backlight, a traffic signal light emitting portion like a liquid crystal display. 为了发出期望颜色的光,用于发出预定颜色的LED晶片5被选择,并且20它与包括荧光材料的荧光元件81组合,所示荧光元件具有转换颜色的功會巨。 In order to emit light of a desired color, for emitting a predetermined color LED chip 5 is selected, and 20 which includes a fluorescent member 81 in combination with a fluorescent material, a fluorescent color conversion elements shown having a work will be huge. 具有期望颜色的光由LED晶片5和荧光元件81获得,并且它进入导向板82以朝着显示部分(未示出)被导向,并且被发射到外部空间。 81 having a desired color light is obtained by the LED chip 5 and the fluorescent element, and it enters the guide plate 82 (not shown) is directed toward the display portion, and is emitted to the external space.

此外,在图15所示的应用中,与上述的荧光元件81组合的发光器件208获得光,所述光进入具有透镜部分84的光学部件83,并且由透镜部25 分84聚合的光沿预定方向传递。 Further, in the application shown in Figure 15, the light-emitting device and the phosphor 81 to obtain the combined light element 208, the light enters the optical member 84 having a lens portion 83, and the predetermined portion of the lens 25 by the light points 84 along the polymerization transmission direction.

图16显示了用于本发明的又一实施例的发光器件的底座114。 Figure 16 shows a further seat 114 for the present invention, the light emitting device according to the embodiment. 在如图4中所示的具有面朝下的LED晶片的底座的上述实施例中,接合材料69与其它电极65电绝缘。 In the above embodiments LED chip having a base facing downward as shown in FIG. 4, the bonding material 69 is electrically insulated from other electrodes 65. 在底座114中,接合材料69连接到从p型半导体层64上的电极65延伸的部分。 In the base 114, the joining material 69 is connected to the portion extending from the electrode 64 p-type semiconductor layer 65. 在该结构中,不需要新的电极来连接30接合材料69,从而制造过程变得更简单。 In this configuration, no new electrode 30 is connected to the bonding material 69, so that the manufacturing process becomes easier.

图17和18显示了用于本发明的又一实施例的发光器件215、 216的底座115、 116。 Figures 17 and 18 show a further seat 115 for the light emitting device of the present invention, the embodiment 215, 216, 116. 这些发光器件具有不同类型的底座。 These light emitting devices having different types of chassis. 安装基底10的电导线不延伸,从而具有平行于电路板300的金属图案41的截口。 Electrical leads mounting substrate 10 does not extend, parallel to the kerf so as to have a metal pattern 300 of the circuit board 41.

在图17所示的发光器件215中,通过用焊料42将安装基底10的电5 导线13、 16连接到电路板300的金属图案41,底座115被安装到电路板300。 In the light emitting device 215 shown in Figure 17, the connection with solder 42 by mounting an electrical conductor 5 13 substrate 10, 16 to the metal patterns 41 of the circuit board 300, the base 115 is mounted to the circuit board 300. 底座115在其两侧用焊料42接合,而在图2所示的发光器件200中, 底座100在其底面用焊料42接合。 Engaging base 115 at both sides thereof with a solder 42, while in the light emitting device shown in FIG. 200, the base 100 is bonded with solder 42 on its bottom surface. 由于底座115在其底部不具有电导线, 因此制造过程变得更简单。 Since the base does not have electrical leads 115 at the bottom thereof, the manufacturing process easier. 此外,由于没有焊接层存在于底座115和电路板300之间,因此发光器件的尺寸不会因焊接层而变化。 Further, since there is no solder layer is present between the base 115 and the circuit board 300, the size of the light emitting device does not vary due to welding layer. 于是,可以精确m 地设置在该方向上的尺寸,并且热接触的可靠性变得更高。 Thus, m can be accurately sized in the direction, and the reliability of the thermal contact becomes higher.

在图17所示的发光器件215中,安装基底10的顶部具有朝着电路板300倾斜的平面,并且电导线12、 15在其上延伸。 In the light emitting device 215 shown in Figure 17, the mounting base 10 has a top planar inclined toward the circuit board 300, and electrical conductors 12, 15 extend thereon. 与图17中所示的底座类似,没有焊接层存在于底座115和电路板300之间,从而制造过程变得更简单。 It is similar to the base shown in FIG. 17, the solder layer is not present between the base 115 and the circuit board 300, so that the manufacturing process becomes easier. 此外,由于底座的顶部不平坦并且其肩部变得更低,因此可以减15小用于安装基底的材料用量,并且发光器件的尺寸不会因焊接层而变化。 Further, since the top of the base and which is non-planar shoulder portion becomes lower, it is possible to reduce the amount of materials used for mounting substrate 15 small, and the size of the light emitting device does not vary due to welding layer. 接着解释上述实施例的修改。 Next explained is the modification of the above embodiment. 在图5和6所示的发光器件203和204 中,底座和金属板的暴露区域之间的热接触区1用焊料连接,而在其它发光器件中底座在热接触区1处与金属板的暴露区域接触而在它们之间没有中间元件。 1 in thermal contact with the solder connection between the region 5 and the light emitting device shown in FIG. 6, the exposed areas 203 and the base 204 and the metal plate, while the other light emitting devices in the base 1 at the zone in thermal contact with the metal plate the exposed region of the contact with no intervening elements therebetween. 在其它发光器件中,金属层可以形成于安装基底的底部,并20 且底座可以用焊料连接到金属板的暴露区域。 In other light emitting device, the metal layer may be formed on a bottom of the mounting base, and the base 20 and can be connected with solder to the exposed region of the metal plate. 于是可以进一步增加传热效率。 So we can further increase the heat transfer efficiency. 在制造过程中,在用于图案的电连接的回流步骤中可以同时在热接触处形成焊接层。 In the manufacturing process, can be simultaneously formed in the solder layer in thermal contact at the reflow step used to pattern the electrically connected.

当在热接触区1形成焊接层时,优选的是,所述热接触区的位置低于电路板的图案41的高度。 When the solder layer is formed in contact with the hot zone 1, it is preferable that the position of the thermal contact region lower than the height of the pattern of the circuit board 41. 例如,在图2所示的发光器件200中,当热接25 触区被焊接时,可以防止图案14和17由焊料短路。 For example, in a light emitting device 200 shown, when the contact region 25 is connected to the thermal welding can be prevented by the solder patterns 14 and 17 short-circuited. 在图10和12所示的发光器件208和210中,在最外部的接触部分仍然低于电路板309、 310 的绝缘层,因此可以确保防止在热接触处的短路。 In the light emitting device 10 and 12 shown in 208 and 210, the contact portion is still below the outermost insulating layer of the circuit board 309, 310, it is possible to surely prevent a short circuit at the thermal contact.

接着解释一系列发光器件,其在与电路板的金属板30接触的底座的安装基底10的平面处具有一个或多个凹槽。 Next explained is a series of light-emitting device, the plane of the mounting substrate 10 in the base plate 30 in contact with the metal circuit board having one or more grooves. 如上所述在背景技术中,能30 量的一部分作为从LED晶片的p和n层发出的光被输出,但是其大部分 As described above in the background art, the amount of energy 30 is output as a part of the light emitted from the p and n layer of the LED chip, but most of

被转化为热量。 It is converted into heat. 在LED晶片中产生的一部分热量以对流和热辐射的形式被传递到外部,但是其大部分通过接合材料或类似材料传导到安装基底, 并且进一步通过在其底部的焊料到达电路板,并且从电路板的表面散发。 Portion of the heat generated in the LED wafer is transferred in the form of thermal radiation and convection to the outside, but most of the conductive substrate by mounting a bonding material or the like, and further through the bottom solder reaches the circuit board and from the circuit distributing plate surface.

在上述的传导路径中,在具有低热传导率(0.3-10 W/mK)的安装基5底中热阻最大。 In the conduction path in the maximum resistance in the bottom mounting base 5 having a low thermal conductivity (0.3-10 W / mK) of. 热阻与在厚度方向的安装基底的厚度成正比并且与热传导率成反比。 Thermal resistance proportional to the thickness of the substrate is mounted in the thickness direction and is inversely proportional to the thermal conductivity. 因此,可取的是低于LED晶片的安装基底的厚度小。 Thus, preferably a small LED mounting substrate is less than the thickness of the wafer. 然而, 低于LED晶片的安装基底或主要传导路径的厚度的减小使其难以形成安装基底。 However, the reduction in thickness below the LED chip mounting substrate or primary conduction paths makes it difficult to form a mounting substrate. 此外,这减小了安装基底的强度,从而安装基底在将LED晶片安装到安装基底的制造步骤中易于破裂。 Furthermore, this reduces the strength of the mounting substrate, thus easily broken when the substrate mounting the LED chip to the mounting substrate manufacturing step. 于是如下所述一个或多个凹槽形 Then follows one or more shaped grooves

io成于安装基底上,从而可以容易地形成安装基底,同时保持其强度,并且可以显著降低安装基底的热阻。 io to to the mounting substrate so that the substrate can be easily formed to install, while maintaining the strength, and can significantly reduce the thermal resistance of the mounting substrate.

图19A-19D显示了在安装基底上具有凹槽的发光器件的第一例子。 FIGS 19A-19D show an example of a light emitting device having a first recess in the mounting substrate. 在该例子中,彼此平行地在安装基底10的底部上提供多个凹槽(凹部)。 In this example, parallel to each other to provide a plurality of grooves (recessed portion) 10 is mounted on the base substrate. 如图19A和19B中所示,LED晶片50用接合元件51面朝下地安装到形 As shown in FIG. 19A and 19B, LED chip 50 is mounted face down engaging element 51 to form

15 成于底座117的安装基底10的顶部的凹口的底部上(倒装片)。 On the bottom of the recess 15 to be mounted on top of the substrate 117 to the base 10 (flip chip). 安装基底IO例如由氧化铝制造,并且在其底部具有突起ll。 IO mounting substrate manufactured e.g. of alumina, and having a protrusion at its bottom ll. 如图19B中所示,三个凹槽7平行地形成于突起11的中央。 As shown in FIG. 19B, three grooves 7 are formed in parallel to the center of the protrusion 11. 为了有效地散热,凹槽7被定位成穿过区域50a,该区域是LED晶片50在垂直方向的投影图像。 In order to effectively dissipate heat, the groove 7 is positioned through region 50a, the projection image region 50 in the vertical direction of the LED chip. 也就是说,低于LED晶片50的安装基底10的平均厚度变得更小,或者在该区 That is, less than the average thickness of the LED chip 50 of the mounting base 10 becomes smaller, or in the area

20 域的热阻被减小。 Resistance domain 20 is reduced.

当底座117被安装到电路板300上时,如图19C中所示,焊接层7 形成于安装基底10的底部和电路板300的顶部之间。 When the base 117 is mounted to the circuit board 300, as shown in FIG. 19C, a solder layer 7 is formed between the top and bottom mounting substrate 10 of the circuit board 300. 焊接层30也充满凹槽7,从而通过提供焊接层7进一步减小LED晶片50和金属板30之间的平均热阻。 Solder layer 30 is also filled with the recess 7, thereby further reducing the average thermal resistance between the LED chip 50 and the metal plate 30 by providing a solder layer 7.

25 通过使用具有上述凹槽7的结构,即使对于由诸如氧化铝这样的较脆 25 having the above-described configuration of the groove 7 by using, even for such a relatively brittle such as alumina

材料制造的安装基底,也可以在保持强度的同时减小厚度。 The mounting substrate material, the thickness can be reduced while maintaining strength. 此外,例如可以用更高热传导率(313 W/mK)的镀铜形成金属薄膜。 Further, a metal thin film can be formed, for example, copper plating higher thermal conductivity (313 W / mK) of. 可以通过将焊料(热传导率,50 W/mK)填充到凹槽7中进一步将热阻减小到更大的程度。 Can be greater degree in the groove 7 is further reduced through the solder heat resistance (thermal conductivity, 50 W / mK) filled. 由于作为主要传导路径低于LED晶片50的安装基底10的热阻被减小, Since as a main conductive paths 50 below the thermal resistance of the LED chip mounting substrate 10 is reduced,

30 因此LED晶片50的温度上升可以被减小。 30 so that the temperature rise of the LED chip 50 can be reduced. 淀积法或类似方法可以用于形 Deposition method or the like may be used to form

成金属薄膜。 A metal thin film. 金属薄膜可以由铜、金、银或热传导率高于安装基底10并且具有用于接合的良好湿度的类似物制造。 The metal thin film may be higher than the mounting substrate formed of copper, gold, silver or the like and manufacturing a thermal conductivity of 10 having good moisture for bonding the. 通过在凹槽7的表面上提供铜薄膜或类似薄膜,便于热量从安装基底10传递到金属板30。 By providing a copper thin film or the like on the surface of the groove 7 so that the heat is transferred from the mounting base 10 to the metal plate 30. 作为用于传热的辅助材料的用于填充凹槽7的填充物并不限于上述的焊料。 As a filler for filling the groove 7 for the auxiliary heat transfer material not limited to the solder. 例如,可 For example,

5以使用热传导率高于安装基底10的银膏、硅树脂或类似物。 5 to use higher thermal conductivity than the silver paste, silicone resin or the like mounting substrate 10. 用于传热的辅助材料可以是焊接金属线,例如焊接铜线。 Auxiliary materials may be used for heat welding a metal wire, e.g. a copper wire welding.

如图19D中所示,凹槽7可以具有侧壁,在所述侧壁之间具有空间, 该空间从底部向其开口增加。 As shown in FIG 19D, the groove 7 may have side walls, said side walls having a space therebetween, the space increases from the bottom thereof towards the opening. 由于凹槽7朝其开口变宽,因此与图18C 中所示的凹槽相比,便于热量从安装基底10传递到电路板的金属板30。 Since the recesses 7 towards its open wider, as compared with the groove shown in FIG. 18C, so that the heat transfer from the substrate 10 to a metal mounting plate 30 of the circuit board.

io此外,在凹槽7的该结构中,诸如焊料这样的填充物可以被填充到凹槽7 内,同时抑制气泡的生成。 io Further, in the configuration of the groove 7, such as a solder filler may be filled into the groove 7, while suppressing the generation of the bubble. 因此,该结构有利于提高传热效率。 Therefore, this structure will help improve the heat transfer efficiency.

图20A-20D显示了上述发光器件的修改实例。 FIGS 20A-20D show modified examples of the above light emitting device. 图19中所示的底座17 在安装基底10之下具有突起11,该突起类似于图2中所示的底座100, 同时不带有突起的该例子的底座118可以在安装基底10的底部具有凹槽 Shown in FIG. 19 of the base 17 has a projection 11 below the mounting substrate 10, the projection 100 is similar to the base shown in FIG. 2, the base of this example without having the projection 118 may have a bottom portion 10 of the mounting base notch

15 7。 157. 如图20A和20B中所示,凹槽7可以平行地形成于整个底部上。 Shown in FIGS. 20A and 20B, the grooves 7 may be formed in parallel on the entire bottom.

当底座118被安装到电路板300上时,如图19C所示,电路板300 可以具有薄绝缘层40 (例如等于或小于大约IOO微米),除了与用于传导层的焊料42接合之外,通过使用焊接形成的焊接层43,底座118可以被直接安装到电路板300的金属板30上。 When the base 118 is mounted to the circuit board 300, shown in Figure 19C, circuit board 300 may have a thin insulating layer 40 (e.g. equal to or less than about IOO [mu] m), except for the solder and the conductive layer 42 is bonded, welding by using a welding layer 43 is formed, the base 118 may be directly mounted on the metal plate 30 to the circuit board 300.

20 作为另一选择,当底座118被安装到电路板300上时,具有图4中所 20 Alternatively, when the base 118 is mounted to the circuit board 300, as with FIG. 4

示的突起的板300可以用于接触安装基底10的底部。 Plate 300 may be shown projections for contacting the base substrate 10 is mounted. 作为另一选择,如图20D中所示,具有与凹槽7适配的突起的金属元件25a可以被插入到安装基底10和金属板30之间。 Alternatively, as shown in FIG. 2OD, between the groove 7 having a projection adapted metal element 25a may be inserted into the mounting substrate 10 and the metal plate 30.

接着,解释在具有含上述凹槽7的底座117、 118的发光器件上传导 Next, explanation on the light emitting device having a conductive base 117 having the above-mentioned groove 7, 118

25的模拟的结果。 The results of the simulation 25. 在三种情况下执行传导模拟,其中LED晶片的热条件和环境温度保持相同。 Conducting simulation performed in three cases, where the LED chip and the ambient temperature of the thermal conditions remain the same. 在第一种情况下,凹槽未被设置于安装基底10的底部上;在第二种情况下,凹槽7在它们之间等距离地被设置于安装基底10上;在第三种情况下,凹槽7被设置于安装基底IO上,从而凹槽中空间的总体积与第二种情况相同,但是凹槽7仅被设置于LED晶片5的接 In the first case, the recess is not provided on the bottom of the mounting base 10; in the second case, the recesses 7 are disposed equidistantly between the mounting substrate 10; the third case the recess 7 is provided in the IO mounted on the base, so that the total volume of the space in the groove with the second case of the same, but only the groove 7 is provided in the LED chip 5 only

30 合材料之下。 30 under the composite material. 模拟结果显示了LED晶片5的温度在按照第一种情况,第 Simulation results show that the temperature of the LED chip 5 in accordance with the first case, the first

二种情况和第三种情况的顺序递减。 And two cases decreasing order of the third case. 如果在第一种情况下的LED晶片5 If the LED chip in the first case 5

的温度被设置成100,它在第二种情况下减小为83,在第三种情况下减小为77。 The temperature is set to 100, which is reduced in the second case 83, 77 is reduced as in the third case. 因此,可以发现如果凹槽7仅仅被设置在LED晶片50的接合材料51之下,可以进一步提高传热效率,并且LED晶片50的温度上升可 Thus, the groove 7 can be found if only the bonding material is disposed beneath the wafer 50 LED 51, heat transfer efficiency can be further improved, and the temperature rise of the LED die 50 may be

5 以被减小。 5 so as to be reduced.

图21显示了具有凹槽结构的本发明的又一实施例的发光器件。 Figure 21 shows yet another of the present invention having a groove structure of the light emitting device of the embodiment. 在所述发光器件中仅在接合元件51之下的凹槽7所具有的深度大于其它情况。 In the light emitting device only under the engaging recesses 7 of element 51 has a depth greater than otherwise. 在凹槽7的该结构中,仅在LED晶片50之下的安装基底10的厚度可以进一步被减小而不减小安装基底10的强度。 In the configuration of the groove 7, the thickness of the substrate 10 is mounted just below the LED chip 50 can be further reduced without reducing the strength of the mounting base 10. 于是从LED晶片50到金属io 板30的热阻可以进一步被减小,并且LED晶片50的温度上升可以被降低。 Thus the thermal resistance may be further reduced from the LED chip 50 to the metal plate 30 io, and the temperature rise of the LED chip 50 can be reduced.

图22显示了具有凹槽结构的本发明的另一实施例的发光器件。 22 shows a light emitting device according to another embodiment of the present invention having a groove structure. 在所述发光器件中,凹槽7被布置成使得仅在接合元件51之下的凹槽7具有最深的深度,同时邻近具有最深的深度的其中一个凹槽的凹槽随着离所述15 具有最深的深度的所述其中一个凹槽的距离的增加而逐渐增加。 In the light emitting device, the groove 7 is arranged such that only the engagement member 51 under the groove having the deepest depth of 7, while the adjacent one has the deepest depth of the groove from the groove 15 as the deepest has a depth which increases from the groove gradually increases. 类似于图21中所示的发光器件,仅在LED晶片50之下的安装基底10的厚度可以进一步被减小而不损害安装基底10的强度。 The light emitting device similar to that shown in FIG. 21, the thickness of the mounting base 50 just below the LED wafer 10 can be further reduced without compromising the strength of the substrate 10 is mounted. 于是从LED晶片50到金属板30的热阻可以进一步被减小,并且LED晶片50的温度上升可以被降低。 Thus from the LED chip 50 to the metal plate 30 of the thermal resistance may be further reduced, and the temperature rise of the LED chip 50 can be reduced.

20 图23显示了具有凹槽结构的本发明的又一实施例的发光器件。 20 Figure 23 shows still another light emitting device of the present invention has a structure of an embodiment of a groove. 在所 In the

述发光器件中,宽凹口71被设置在LED晶片50之下的安装基底10的底部中,并且凹槽7被设置在用于LED晶片50的接合材料51之下的凹口71的内部。 The bottom of the mounting base 10 of said light emitting device, the wide notches 71 are provided below the LED chip 50, and the groove 7 is disposed under the bonding material 50 for the LED chip 51 inside the recess 71. 由于凹口71较宽并且凹槽7的深度比图22中的配对物浅, 因此焊料更容易进入和填充凹槽7。 Since the recess 71 wider and shallower than the depth of the recess 7 of the counterpart in FIG. 22, and therefore easier to enter and solder filling the groove 7.

25 图24-27显示了具有凹槽结构和多个LED晶片50的本发明的又一实 24-27 show a further 25 having a solid structure and a plurality of recesses LED wafer according to the present invention 50

施例的发光器件。 Examples of the light emitting device is applied. 在所述发光器件中,LED晶片50彼此邻近地安装在安装基底10地中央,同时凹槽(或凹口) 7被设置在LED晶片50之下的安装基底10上。 In the light emitting device, LED chips 50 mounted adjacent to each other in the central mounting base 10, while the groove (or recess) 7 is disposed on the mounting base 50 below the LED chips 10. 在图24所示的发光器件中,凹槽7具有相同的尺寸。 In the light emitting device shown in FIG. 24, the grooves 7 have the same size. 在图25所示的发光器件中,对于多个LED晶片50之中的中央LED晶片50, In the light emitting device shown in FIG. 25, a plurality of LED chips 50 in the central LED chip 50,

30凹槽7的深度最深,并且在其两侧根据离用于中央LED晶片50的中央凹 30 the deepest groove 7, and from both sides thereof according to the fovea center of the LED chip 50

槽的距离而变浅。 From the groove becomes shallower. 在图26所示的发光器件中,对于每个LED晶片50设置了宽度狭窄的多个凹槽,并且对于中央LED晶片,在LED晶片50之下的凹槽的数量和密度变为最高。 In the light emitting device shown in FIG. 26, for each of the LED chip 50 provided with a plurality of narrow width recesses, and the central LED chip, and the number density of the recesses under the LED chip 50 becomes the highest. 此外,图27中所示的发光器件具有类似于图25和26中所示的凹槽7,但是用于中央LED晶片50的凹槽具有 Further, the light emitting device shown in FIG 27 has similar recesses 25 and 26 shown in 7, but for the central recess 50 of the LED wafer having

5 最高的密度和最深的深度。 5 highest density and the deepest depths. 于是,中央LED晶片50可以有效地散热,从而可以使LED晶片50的温度分布均匀。 Thus, the central LED chip 50 can be efficiently dissipated, so that the temperature of the LED chip 50 can be distributed uniformly.

图28-31显示了具有本发明的又一实施例的发光器件,所述发光器件具有类似于图24-27中所示的凹槽结构,但是具有面朝上安装的LED晶片55。 Figures 28-31 show a further light emitting device of the present invention having the embodiment, the light emitting device having a groove structure similar to that shown in FIG. 24-27, but having a face-up mounted LED chip 55. 用诸如压模接合元件或镀层这样的接合材料57安装LED晶片55。 With such a joining material such as die coating or engaging element 57 mounted LED chip 55.

io用引线接合执行对LED晶片55的电极56的电连接。 io performing wire bonding electrodes 56 of the LED chip 55 is connected. 在所述发光器件中, 凹槽7的结构具有的优点是使温度分布均匀和有效地散热,类似于上述的发光器件。 In the light emitting device, the structure of the recess 7 has the advantage that a uniform temperature distribution and effective heat dissipation, similar to the above light emitting device.

图32A和32B显示了具有凹槽结构的本发明的又一实施例的底座119。 32A and 32B show the base 119 of another embodiment of the present invention having a groove structure. 在底座119中,如图32B中所示,凹槽7在垂直和横向方向形成于 In the base 119, as shown in FIG. 32B, in the vertical grooves 7 are formed in the lateral direction and

15 其底部(或后部)上。 15 the bottom (or back) on. 当底座119被安装到电路板300上时,焊料或类似物被插入到底座119的底部和电路板之间,并且如上述图20D中所示, 它被填充到凹槽7中。 When the base 119 is mounted to the circuit board 300, the solder or the like is inserted in the end of the seat between the bottom and the circuit board 119, and as shown in FIG. 20D as described above, it is filled into the groove 7.

在安装基底IO的结构中,与图19和20中所示的其中凹槽7仅仅沿一个方向被布置的配对物相比,凹槽7可以以更高的密度垂直地和横向地 IO structure compared to the mounting substrate, and as shown in FIGS. 19 and 20 wherein the grooves 7 are arranged in one direction only counterpart, the recesses 7 may be vertically higher density and laterally

20 形成,同时不减小安装基底10的强度。 20 is formed, without reducing the strength of the mounting base 10. 此外,热量可以有效地从LED晶片50散发到电路板30,并且LED晶片50的温度可以进一步被减小。 Further, heat can be efficiently radiated from the LED chip 50 to the circuit board 30, and the temperature of the LED chip 50 can be further reduced. 此夕卜,由于同时垂直地和横向地形成凹槽7,当焊料53被填充到凹槽7中时空气可以容易地从突起的侧面泄漏。 Bu this evening, since simultaneously vertically and laterally formed groove 7, when the solder 53 is filled into the air grooves 7 can be easily leaked from the side surface of the projection. 因此,能更容易地将焊料填充到凹槽7中。 Thus, the solder can be more easily filled into the groove 7. 此外,由于焊料43的热传导率高于安装基底10,因此热量可以 Further, since the solder 43 is higher than the thermal conductivity of the mounting substrate 10, so that heat can be

25有效地被散发。 25 is effectively distributed. 如果LED晶片50被安装到垂直和横向凹槽的交点之上, 可以更有效地进行传热。 If the LED chip is mounted on the intersection of vertical and lateral grooves 50, the heat transfer can be performed more efficiently.

图33显示了具有凹槽结构的本发明的又一实施例的底座。 33 shows still another structure of the present invention has a groove base embodiment. 设置凹槽7以从安装基底10的突起11的中央径向延伸。 Setting groove 7 extends from the central radial projection 11 of the mounting base 10. 尽管在该例子中仅有一个LED晶片(未示出)被安装在突起11的中央的区域50a之上,但是也可 Although only one LED die in this example (not shown) is mounted over a central region 50a of the protrusion 11, but may also

30以安装多个LED晶片。 30 for mounting a plurality of LED dies. 当多个LED晶片被安装时,它们可以从光学视点 When a plurality of LED chips are mounted, they may be from the optical viewpoint

径向地被安装。 It is mounted radially. 在这种情况下,当上述径向凹槽7被形成时,可以减小位 In this case, when the groove 7 is formed in the radial direction, it can reduce bit

于仅在它们之中的中央LED晶片之下的安装基底10的厚度。 To just below the center of the substrate mounted LED chip 10 in the thickness thereof. 于是,促进了从LED晶片到金属板的传热,并且可以降低LED晶片的平均温度。 Accordingly, to promote the heat transfer from the LED chip to the metal plate, and may reduce the average temperature of the LED chip. 图34显示了具有凹槽结构的本发明的又一实施例的底座。 Figure 34 shows yet another configuration of the present invention has a groove base embodiment. 凹槽7在5 —些区域密集地被形成,而在安装基底10的底部的其它区域疏松地被形成。 In the groove 7 5 - these regions are densely formed, is formed in other regions of the substrate bottom portion 10 of the mounting loose ground. 尤其是,凹槽7在中央区域密集地被形成,从而可以减小仅在LED 晶片之下的安装基底10的厚度,并且促进从LED晶片到印刷板的传热。 In particular, the groove 7 is formed in a central region densely, thereby reducing the thickness of the mounting base 10 only under the LED chip, and to facilitate heat transfer from the LED chip to the printed board. 图35A和35B显示了具有凹槽结构的本发明的又一实施例的底座120。 35A and 35B show yet another configuration of the present invention has a groove base 120 of this embodiment. 深孔72在仅处于用于LED晶片50的接合元件之下的区域中形成于 72 is formed in the deep hole only in a region below the wafer engaging element 50 of the LED

io 安装基底10的底部上,并且凹槽7垂直地和横向地通过孔72形成。 io mounted on the base substrate 10, and the groove 7 is formed vertically and laterally through the aperture 72. 焊料被填充到安装基底10的底部与印刷板(未示出)的金属板之间的凹槽7 和孔72中。 A groove between the solder is filled into the bottom of the mounting base 10 of the printing plate (not shown) of the metal plate 7 and the hole 72. 凹槽7和孔72的数量以及它们的位置关系并不限于图35A 和35B中所示的例子。 The number of grooves 7 and holes 72 and their positional relationship are not limited to the example shown in FIGS. 35A and 35B. 由于深孔72形成于LED晶片之下的上述结构中以用于LED晶片的主传热路径,因此,可以减小刚好处于LED晶片之下的 Since the deep hole 72 formed in the structure below the LED chip to the primary heat transfer path for an LED chip, therefore, can be reduced in just under the LED chip

15安装基底10的厚度。 15 thickness of the mounting substrate 10. 于是,促进了从LED晶片到金属板的传热,并且可以降低LED晶片的温度。 Accordingly, to promote the heat transfer from the LED chip to the metal plate, and may reduce the temperature of the LED chip.

图36显示了具有凹槽结构的本发明的又一实施例的底座。 36 shows still another embodiment of the chassis according to the invention has a groove structure. 凹槽7从安装基底10的突起11的中央径向延伸,并且其它凹槽7a同心地形成于突起11上。 7 projecting radially central recess 10 from the mounting base 11 extends concentrically and other grooves 7a formed in the projection 11. 当多个LED晶片被安装时,它们可以从光学视点径向地被安 When a plurality of LED chips are mounted, they may be radial from the optical viewpoint Ann

20装。 20 installed. 在该例子中,上述的凹槽7、 7a在每个LED晶片周围径向地形成以安装到区域50a之上。 In this example, the recess 7, 7a is formed radially above the region 50a to be mounted around each LED die. 于是,可以减小刚好处于LED晶片(一个或多个) 之下的安装基底IO的厚度。 Thus, the thickness of the mounting substrate can be reduced just at the IO LED wafer (s) below. 于是,促进了从LED晶片(一个或多个)到电路板的传热,并且可以降低LED晶片(一个或多个)的温度。 Accordingly, to promote the heat transfer from the LED chip (s) to a circuit board, and may reduce the temperature of the LED chip (s) is.

图37显示了具有凹槽结构的本发明的又一实施例的底座。 37 shows still another embodiment of the chassis according to the invention has a groove structure. 凹槽7在 7 in the groove

25每个LED晶片的周围径向地形成以安装到区域50a之上。 Around each LED die 25 is formed to be mounted radially above the region 50a. 于是,当多个LED晶片被安装时,可以接收刚好处于LED晶片之下的安装基底10的厚度。 Thus, when a plurality of LED chips are mounted, it can be received in the thickness of the mounting base 10 just below the LED chip. 于是,促进了从LED晶片到电路板的传热,并且可以降低LED晶片 Accordingly, to promote the heat transfer from the LED chip to the circuit board, and the LED chip can be reduced

的温度。 temperature.

图38和39显示了具有凹槽结构的本发明的又一实施例的底座。 Figures 38 and 39 show still another embodiment of the base according to the present invention having a groove structure. 在图30 38所示的底座中, 一个螺旋凹槽7形成于安装基底10的底部上的突起11 In the base of the projection 38 shown in FIG. 30, a helical groove 7 is formed on the bottom 10 of the mounting base 11

上,而在图39所示的底座上中, 一个凹槽7曲折地形成于安装基底10的底部上的突起11上。 On and in the base as shown in FIG. 39, a meander groove 7 formed on the mounting base 11 on the projection 10 on the bottom. 当底座被安装到电路板(未示出)的金属板上时, 用于接合的焊接层被插入到底座和金属板之间。 When the base is mounted to a circuit board (not shown) of the metal plates, for joining the solder layer is interposed between the base and the metal plate in the end.

在图38或39所示的凹槽中,诸如焊接铜线这样的焊接金属线可以作 In the groove shown in FIG. 38 or 39, the welding metal wire such as copper can be welded

5为促进传热的辅助材料被插入到其中。 Auxiliary materials to facilitate heat transfer 5 is inserted. 金属线或铜线具有高于安装基底 Metal or copper wires having a higher mounting substrate

10和高于焊料的热传导率。 10 and higher than the thermal conductivity of the solder. 因此,通过插入所述线,可以更多地减小热阻。 Thus, by inserting the wire, the thermal resistance can be reduced more. 由于仅有一个凹槽形成于安装基底10的突起11的底部,因此容易将所述线插入到凹槽7中。 Since only one recess is formed in the bottom of the mounting base 11 of the projection 10, the wire is easily inserted into the groove 7.

图40A和40B显示了具有凹槽结构的本发明的又一实施例的底座 40A and 40B show still another embodiment of the base according to the present invention has a groove structure

io 121。 io 121. 两个凹口(凹槽)73在仅处于LED晶片50之下的区域的外部平行地形成于安装基底10的底部。 Two recesses (grooves) 73 formed at the bottom of the mounting base 10 in parallel to the outside only at the area under the LED wafer 50. 用于接合的焊接层43被插入到安装基底10和电路板300的金属层30之间。 For bonding the solder layer 43 is inserted between the metal layer 10 and the substrate 30 is mounted to the circuit board 300. 在具有凹口73的该结构中,沿安装基底10的表面从热接触(焊接层43)到导线和电路板300的图案41之间的电接触(焊料42)的长度变长,从而可以防止它们之间的电短路。 In the structure having a recess 73, along the surface of the substrate 10 is mounted in thermal contact with the (solder layer 43) to the wire and the electrical contact pattern of the circuit board (solder 42) is between 41 300 becomes longer, thereby preventing electrical short between them.

is 图41A和41B显示了具有凹槽结构的本发明的又一实施例的底座 41A and 41B is shown the base of another embodiment of the present invention has a groove structure

122。 122. 凹口74形成为类似于图40A和40B中所示的凹口73,但是具有比它更大的尺寸。 Recess 74 is formed similarly to FIGS. 40A and 40B in the recess 73 as shown, but of a larger size than it. 如图41A中所示,凹口74具有一个底面和在所述底面和凹口74的开口之间延伸的两个平面,并且所述凹口的宽度朝其开口变宽。 As shown in FIG 41A, the recess 74 having a bottom surface and two plane between the bottom surface and an opening extending recess 74, and the width of the recess widens towards its opening. 在具有凹口74的结构中,类似于图40A和40B中所示的底座,沿安 In the configuration having the recess 74, similar to the base shown in FIG. 40A and 40B, the direction Ann

20 装基底10的表面从热接触(焊接层43)到导线和电路板300的金属图案41之间的电接触(焊料42)的长度变长,从而可以防止它们之间的电短路。 Length of the surface 20 from substrate 10 mounted in thermal contact (solder layer 43) to the wire and electrical contact between the circuit board 41 of the metal pattern 300 (the solder 42) becomes long, thereby preventing an electrical short therebetween. 此外,用于传热的区域被加宽,并且促进了传热。 Further, for the heat transfer area is widened, and promote heat transfer. 此外,由于安装基底10的厚度差异不太大,因此在图41A和41B中所示的安装基底10可以采用注塑容易地制造成三维电路板,并且可以减少用于注塑的材料的用 Further, since the mounting substrate 10 is not so large difference in thickness, thus mounting substrate shown in FIG. 10, 41A and 41B can be injection easily manufactured using a three-dimensional circuit board, and can reduce the material used for injection molding

图42显示了具有凹槽结构的本发明的又一实施例的底座123。 Figure 42 shows the base 123 of another embodiment of the present invention having a groove structure. 安装基底10具有类似于在图41A和41B中所示的凹口(凹槽74),并且金属层74a形成于凹口中的侧板上。 Mounting base 10 having a similar recess (groove 74) as shown in FIGS. 41A and 41B, and the metal layer 74a is formed on the side plate recess. 可以通过用银或诸如铜或镍这样的其它金属镀覆而形成金属层74a。 The metal layer 74a may be formed by other metals such as copper or silver or nickel plating. 作为另一选择,可以应用白漆。 Alternatively, you can use white paint. 于是,除了在30图41A和41B中所示的底座上的上述优点之外,有利的是金属层74a反 Thus, in addition to the above advantages on the base 30 shown in FIGS. 41A and 41B, a metal layer 74a is advantageously trans

射由LED晶片50发出并且传递到安装层10的一部分或所有光。 Emission emitted by the LED chip 50 and a part or all of the light transmitted to the mounting layer 10. 因此, therefore,

沿侧向方向的漫射光可以被聚集到顶面,从而可以增加使用发射光的效率。 Diffuse light in the lateral direction of the top surface may be aggregated, thereby increasing the use efficiency of emitted light.

图43显示了具有凹槽结构的本发明的又一实施例的底座124。 Figure 43 shows the base 124 of another embodiment of the present invention having a groove structure. 安装5 基底10具有类似于在图41A和41B中所示的凹口74。 5 has a mounting base 10 similar to the recesses illustrated in FIGS. 41A and 41B, 74. 此外,在安装基底10的底面上沿侧向方向从凹口74的内部至安装基底10的侧面形成气孔75。 Further, in the lateral direction of the substrate mounting surface of the bottom 10 of the recess 74 from the inner side of the substrate 10 to the mounting hole 75 is formed. 于是,可以因在侧向方向的气孔75而进一步促进传热。 Thus, the pores can vary in a lateral direction 75 and to further promote heat transfer.

图44显示了具有凹槽结构的本发明的又一实施例的底座125。 Figure 44 shows yet another configuration of the invention has a groove base 125 according to an embodiment. 安装基底10具有类似于在图43中所示的凹口74和气孔75。 10 has a mounting base 74 similar to the recess 43 and hole 75 shown in FIG. 此外,沿垂直方io 向从凹口74的内部至安装基底10的顶部形成气孔。 Further, in the vertical direction to form pores io mounted to the inside top of the substrate 10 from the recess 74. 于是,可以因在垂直方向的气孔而进一步提高传热。 Thus, heat transfer can be further improved due to the pores in the vertical direction.

可以以各种方式修改上述实施例。 The above-described embodiments may be modified in various ways. 例如,LED晶片和在底座中的安装基底并不限于引线接合、倒装等。 For example, LED chip and a mounting substrate in the base is not limited to wire bonding, flip chip and the like. 在上述的实施例中,安装基底由氧化铝制造,但是它也可以由不同于氧化铝的陶瓷或树脂制造。 In the above embodiment, the mounting substrate made from aluminum, but it can also be a ceramic or a resin different from the manufactured alumina. 用于凹槽的填15充物并不限于焊料,也可以使用热传导率高于安装基底的诸如银膏或硅树脂这样的材料。 Filling material for filling grooves 15 is not limited to solder, higher thermal conductivity than the substrate mounting such a material such as silver paste or silicone resin may also be used. 此外,凹槽的数量和LED晶片的数量也并不限于上述实施例中所示的例子。 Further, the number of the LED die and the recess is not limited to the examples shown in the above embodiments.

在下面将要解释的实施例中,为了进一步提高传热效率,除了在底座和电路板之间的热接触之外还增加了用于传热的附加路径。 In the following embodiments will be explained in the embodiment, in order to further improve heat transfer efficiency, in addition to the thermal contact between the base and the circuit board also adds additional path for heat transfer. 于是可以进一20 步增加用于LED晶片的注入电流。 It can then be injected into a 20 to further increase the current for the LED chip.

图45显示了根据本发明的又一实施例的发光器件,图46A和46B显示了用于图45中所示的发光器件的底座126的结构。 Figure 45 shows a light emitting device according to still another embodiment of the present invention, FIGS. 46A and 46B show a structure for a light emitting device shown in FIG. 45 of the chassis 126. 图45中所示的发光器件具有插入到都为传热而提供的第一板30a和第二板30b之间的一个或多个底座126。 The light emitting device shown in FIG. 45 having a plate 30a between the first and the second plate 30b of the base 126 is inserted into one or more heat transfer are provided. 如图46A和46B中所示,底座126具有带有导线12、 15 25的安装基底10和安装在安装基底10上的LED晶片5。 As shown in FIG. 46A and 46B, a base 126 having 12, 25, 10 mounting substrate 15 and the LED chip 5 with a wire on the mounting substrate 10. 安装基底10在其顶部具有凹口435,并且两个电导线12、 15形成于凹口435中和安装基底10的顶面上。 Mounting base 10 has a recess 435 at its top, and the two electrical conductors 12, 15 formed in the mounting substrate 435 and the top surface 10 of the recess. 安装基底10的形状并不限于图46A和46B中所示的情况。 Mounting the substrate 10 is not limited to the case of the shape shown in FIGS. 46A and 46B. 例如,它可以具有平坦的顶部平面。 For example, it may have a flat top plane. LED晶片5在凹口435的底部用它们之间的接合材料434连接到导线12、 15,如图46B中所示,并且30底座126如图45中所示地被安装在发光器件中。 LED chip 5 in the bottom of the recess 435 by a bonding material 434 between them is connected to a wire 12, 15, as shown in FIG. 46B, 30 and the base 126 as shown in Fig 45 are mounted in the light emitting device.

第一板30是上述的电路板,其具有金属板411、绝缘层412和形成于绝缘层412上的金属图案。 The first plate 30 is the above-described circuit board having a metal plate 411, the insulating layer 412 and an insulating layer formed on the metal pattern 412. 在安装基底10的顶面上的电导线12、 15的两端被用作用于电连接的线路区域432以用作正极和负极端子。 Line across the installation area of ​​the substrate top surface 10 of electrical conductors 12, 15 is used for electrical connection 432 to serve as positive and negative terminals. 底座126 的线路区域432和第一板30a的图案413用焊料415进行连接。 Line 126 of the base region 432 and the first plate 30a of the pattern 413 are connected by solder 415. 与LED 5 晶片5相对的板30a的一部分具有对应于凹口的开口410。 5 with a portion of the LED chip 5 opposite plate 30a having an opening corresponding to the recess 410. 诸如荧光材料这样的用于转换入射光的波长的器件可以设置在所述开口中。 Such as a fluorescent material for converting the wavelength of incident light device may be disposed in the opening.

第二板30b由金属板制造。 The second plate 30b made of metal plate. 电绝缘线路区域436用来焊接到安装基底IO的底(后)平面上,并且它用焊料425接合到第二板30b。 Electric insulating regions 436 welded to the bottom mounting substrate for the IO (rear) on the plane, and it is bonded to the second plate 425 with solder 30b. 第二板30b 具有导热部分424,该导热部分具有与第一板30a相对的平面。 The second plate 30b has a thermal section 424, the heat-conducting portion having a planar first plate 30a opposite. 第二板30b io 的导热部分424接触第一板30a,或者优选地用焊接与之连接。 Heat-conducting portion 424 contacts the first plate of the second plate 30b io 30a, or connected thereto preferably by welding. 导热部分424可以作为单独元件而设置,以用焊料或类似物与第一和第二板30a和30b接合,或者可以是第一或第二板30a, 30b的组成部分。 Heat conducting portion 424 may be provided as a separate element, with solder or the like to the first and second engaging plates 30a and 30b, or may be an integral part of the first or the second plate 30a, 30b of. 此外,导热部分424可以与底座126的侧面接触或与之接合。 Further, the thermally conductive portion 424 may contact or engages with the side of the base 126.

在图45所示的结构中,消耗在安装基底10中的热量除了通过如前述15 实施例所述的第一板30a被散发之外,还通过第二板30b被散发。 In the configuration shown in FIG. 45, the heat consumed in the mounting substrate 10 in addition to the first plate by the preceding embodiment of the embodiment 15 30a is radiated, but also is radiated through the second plate 30b. 因此, 与图2中所示的发光器件相比,可以进一步减小LED晶片5的温度。 Thus, as compared with the light emitting device shown in FIG. 2, the temperature of the LED chip can be further reduced to 5. 如果安装基底10由诸如氮化铝这样的具有高热传导率的陶瓷材料制造,那么可以更有效地导热,并且可以更多地减小LED晶片5的温度。 If the mounting substrate 10, it can be manufactured more efficiently conduct heat such as aluminum nitride having high thermal conductivity such as a ceramic material, and may more reduce the temperature of the LED chip 5.

在图45所示的结构中,用于传热的两个板30a、30b被安装在底座(一20 个或多个)126之上和之下,但是板30a和30b的设置并不被局限于该例子。 In the configuration shown in FIG. 45, a two heat transfer plates 30a, 30b are mounted above and below the base 126 (a 20 or more), but the plates 30a and 30b are disposed not to be limited in this example.

如果安装基底10例如为模制互连设备(MID)板,那么在导线的延伸上没有限制。 If the mounting substrate 10, for example, a molded interconnect device (MID) plate, there is no limit on the extension wire. 因此,根据发光器件所使用的空间上的要求,用于传热的所述两个板例如可以设置在两个平面或后平面和侧平面上的合适位置。 Thus, according to the requirements on spatial light-emitting device is used, the two plates may be provided for the heat transfer, for example, in place on the plane and the side plane or the plane of the two. This

25也适用于在下面说明的下述实施例。 25 is also applicable to the following embodiments described below.

此外,用于传热的板的数量并不限于两个。 Further, the number of plates for heat transfer is not limited to two. 在图45所示的例子中, 用于传热的第三和第四板可以进一步设置在底座126的两侧。 In the example shown in FIG 45, the third and fourth for the heat transfer plate may be further provided on both sides of the base 126. 这进一步促进了传热,并且进一步减小晶片温度。 This further facilitates heat transfer and to further reduce the wafer temperature.

图47显示了根据本发明的又一实施例的发光器件,图48显示了在图30 47中的右侧观察到的发光器件的剖面。 Figure 47 shows a light emitting device according to still another embodiment of the present invention, FIG 48 shows a cross section of the light emitting device on the right side as viewed in FIG. 30, 47. 此外,图49A、 49B和50A、 50B Further, FIG. 49A, 49B and 50A, 50B

分别显示了用于图47中所示的发光器件的传热的底座127和第一板30a 的结构。 They show the mount for the light emitting device shown in FIG. 47 of the heat transfer structure 127 and the first plate 30a.

该实施例的发光器件类似于图45和46中所示的发光器件,区别在于以下几点。 The light emitting device of this embodiment is similar to the light emitting device shown in FIG. 45 and 46, except that the following points. 如图50A和50B中所示,通过去除绝缘层412的一部分,第5 —板30a的金属板411的一部分被暴露,或者其上不形成导电图案,从而使金属板411接触安装基底10的顶部。 As shown in FIG. 50A and 50B, by removing a portion of the insulating layer 412, 5 - plate 30a of the metal plate 411 is partially exposed or on which no conductive pattern is formed, so that the metal plate 411 contacts the top 10 of the mounting substrate . 如图49A和49B中所示,凹槽437 形成于安装平面10的顶部,并且将延伸到电导线12、 15的线路432形成于凹槽437中。 As shown in FIG. 49A and 49B, a groove 437 is formed on top of the mounting plane 10, and extending to the electrical conductors 12, 15 line 432 is formed in the groove 437. 图案413形成于第一板30a的一部分上以适配到安装基底10的顶平面上的凹槽437。 Pattern 413 is formed on a portion of the first plate to fit into the recess 30a of the top plane 10 of the mounting substrate 437. 线路区域432用焊料接合到第一板30a上的图io案413。 Line region 432 by solder bonding to the first plate of FIG. 30a io case 413. 第一板30a用焊料416接合到在安装基底10的顶部形成的图案438。 The first plate 30a is joined to the solder pattern 416 formed on top of the substrate 10 mounting 438.

与前述实施例类似,与LED晶片5相对的板30a具有开口410。 Similar to the previous embodiment, the LED chip 5 opposite to the plate 410 has an opening 30a. 此夕卜,如果第二板30b是热传导率高于电路板的金属板,那么在陶瓷材料制造的安装基底10中扩散的热量可以进一步被扩散,并且LED晶片5的温 Bu this evening, if the second plate 30b is higher than the thermal conductivity of the metal plate of the circuit board, the heat can be diffused further the mounting base 10 made of ceramics diffused, and the LED chip 5 Temperature

15 度可以进一步被降低。 15 degrees can be further reduced.

由于用于传热的所述板中的金属板与底座127接触或接合,因此可以更有效地传热,并且LED晶片5地温度可以进一步被降低。 Since 127 contacts or engages the heat transfer plate for a plate and the base metal, it is possible to more effectively transfer heat, and the temperature of the LED chip 5 can be further reduced. 此外,由于电路板被用于传热,因此可以增加底座电连接的自由度。 Further, since the circuit board is used for heat transfer, it is possible to increase the degree of freedom of the base are electrically connected.

图51显示了根据本发明的又一实施例的发光器件,图52A和52B显 Figure 51 shows a light emitting device according to still another embodiment of the present invention, FIGS. 52A and 52B significant

20 示了发光器件的底座128。 20 illustrates the base 128 of the light emitting device. 底座128的安装基底10具有由平板制造的多层结构并且具有电导线12和15。 The mounting base 128 has a substrate 10 made from a multilayer structure having a flat plate and electrical leads 12 and 15. 然而,安装基底10的形状并不限于平面,它可以是具有凹口或类似物的板。 However, the shape of the mounting plane of the substrate 10 is not limited, it may be a recess or the like plate. 如图52B中所示,电导线12和15 从安装基底10的顶部通过通孔12a、 15a延伸到内层并且进一步延伸到其侧面和安装基底10的底部的一部分。 As shown in FIG 52B 12 and the electric wire 15 from the top portion of mounting base 10 through the through hole 12a, 15a extends to the inner layer and further extended to its sides and bottom of the mounting base 10. 形成用于焊接在安装基底10的底部 For welding is formed at the bottom of the mounting base 10

25 上的线路区域436形成于底座128的底部并且接合到第一板30a上的图案413,但是电绝缘。 Region on the line 25436 is formed in the base bottom 128 and engage the pattern on the first plate 30a 413, but electrically insulated. LED晶片5在安装基底10的电导线12、 15上安装有接合材料434。 LED chip 5 is mounted on the electrical conductor 10 base 12 is mounted on the bonding material 434 15.

第一板30a具有金属板411、绝缘层412和形成于所述绝缘层412上的金属图案413。 The first plate 30a having a metal plate 411, and the insulating layer 412 is formed on the insulating layer 412 on the metal patterns 413 通过去除没有导电图案形成于其上的绝缘层412的一部30 分,第一板30a的金属板411的一部分被暴露,从而使金属板接触安装基 An insulating layer 30 is formed thereon by removing 412 without the conductive pattern, the first plate 30a of the metal plate 411 is partially exposed so that contact with the metal mounting base plate

底10的顶面。 The top surface of the bottom 10. 第一板30a用焊料416接合到在安装基底10的底平面处的电线路436。 The first plate 30a is joined to the electrical line 436 at the bottom plane of the mounting substrate 10 with solder 416. 此外,在第一板30a的图案413的一端的线路区域用焊料415 接合到安装基底10的图案413的一端处的线路432。 Further, in the region of one end of the line pattern 30a of the first plate 413 is bonded to a mounting substrate with solder 415 at one end of the wiring pattern 432 10 413.

用于传热的第二板30b是由铜制造的金属板,在该实施例中它被接合5 到安装基底10的顶面。 The second heat transfer plate for a metal plate 30b is made of copper, and in this embodiment it is bonded to the mounting 5 in the top surface of the base 10. 该金属板由铜制造,但是并不局限于此。 The metal plate made of copper, but not limited thereto. 开口420 被设置在与LED晶片5相对的第二板30a的一部分中。 An opening 420 is provided in a portion opposing the LED chip 5 of the second plate 30a. 优选的是开口420 的侧部呈锥形,但是并不限于锥形。 Preferably the opening side of the tapered portion 420, but is not limited to tapered. 在该例子中,银被淀积在所述锥形部分的表面上,并且银膜被抛光。 In this example, the silver is deposited on the surface of the tapered portion, and the silver film is polished. 如果安装基底10由陶瓷材料制造,那么优选的是与第二板30b接触的平面例如用钨金属化,并且用于传热的该金 If the mounting 10 is manufactured from a ceramic material substrate, it is preferred that the plane of contact with the second plate 30b, for example, of tungsten metal, and heat transfer for the gold

io属化部分可以直接被接合而不用焊接到第二板30b。 io metallized portions may be joined directly without welded to the second plate 30b.

仍然在该例子中,在由高热传导率的陶瓷材料制造的安装基片10中扩散的热量被引导通过具有高热传导率的金属板,从而可以进一步降低LED晶片5的温度。 In this example, still in the heat of a ceramic material of high thermal conductivity of the mounting substrate 10 is directed through the diffusion plate having a high thermal conductivity metal, thereby further reducing the temperature of the LED chip 5. 此外,由于图案413可以形成于与底座128相对的第一板30a的两侧,通常固定到外部设备的第二板可以不具有图案。 Further, since the pattern 413 may be formed on both sides of the base 128 opposite the first plate 30a, the second plate is generally fixed to the external device may not have a pattern. 于是, then,

15有利的是电绝缘设计具有高自由度。 15 is advantageously designed to have a high degree of freedom electrically insulating.

图53显示了根据本发明的又一实施例的发光器件,图54A和54B显示了其底座129。 Figure 53 shows a light emitting device according to still another embodiment of the present invention, FIGS. 54A and 54B show a base 129 thereof. 具有金属板411、绝缘层412和图案413的电路板30a 被设置在底座129的底面。 Metal plate 411, the circuit board 412 and the insulating layer pattern 413 is disposed on the bottom surface 30a of the base 129. 凹口435和凹槽437形成于底座129的顶部上, 并且电导线12、 15形成于凹槽437和凹口435的底部上。 Recess grooves 435 and 437 formed on top of the base 129, and the electrical conductors 12, 15 formed on the bottom of the recess 437 and the recess 435. 由于形成于底 Since the formation of the bottom

20 座129上的导线12和15形成于凹槽437中,它们不会接触第二板30b。 129 20 wires 12 and 15 are formed in the groove 437, they do not contact the second plate 30b. 作为第二板30b的金属板具有开口420,该开口具有与LED晶片5安装在其上的凹口435的开口大约相同的尺寸。 The metal plate 30b of the second plate 420 has an opening, the opening having the LED chip 5 is mounted in a recess of approximately the same opening size 435 thereon. 由透明材料或诸如荧光材料这样的转换LED晶片5发出的入射光的波长的材料制造的盖426可以设置在第二板30b的开口420中,或者它可以被用作安放荧光材料的元件。 The wavelength of incident light or a transparent material such as phosphor converted LED chip 5 is emitted material 426 may be provided in the cover plate 30b of the second opening 420, or it may be used as the fluorescent material element is placed.

25 在该实施例中,在LED晶片5中产生的热量通过底座129的安装基 25 In this embodiment, the heat generated in the LED chip 5 in the mounting base 129 through the base

底10被传导到第二板30b并且从第二板30b的表面散发。 10 is conducted to the bottom plate 30b and is radiated from the second surface of the second plate 30b. 由于热量也从第二板30b被散发,因此促进了底座129的传热,并且LED晶片5的温度被减小。 Since the amount of heat is radiated from the second plate 30b, thus facilitating the heat transfer base 129, and the temperature of the LED chip 5 is reduced. 因此,发光器件具有更长的使用寿命。 Thus, the light emitting device having a longer life. 此外,由于可以流入较大电流,因此可以增加光强度。 Further, since a large current flows, the light intensity can be increased. 由于第二板也被用作保持荧光盖的元件, Since the second plate is also used as a cap holding member fluorescence,

30 因此可以减小制造成本。 30 can be reduced manufacturing cost.

图55和56A、 56B显示了根据本发明的又一实施例的发光器件。 55 and FIGS. 56A, 56B show a light emitting device according to still another embodiment of the present invention. 底座130的安装基底10由树脂或陶瓷制造,并且由诸如铜、焊料或金这样的具有高热传导率的金属制造的多个热通道439形成于安装基底10中。 The mounting base 130, or a ceramic substrate 10 made from a resin, and the mounting substrate 439 is formed in the channels 10 a plurality of heat copper, solder, or gold having a high thermal conductivity such as a metal such as manufactured. 热通道439并不接触形成于底座130上的电导线12、 15或与之绝缘。 Electrical conductor 439 does not contact the heat passage is formed on the base 130, 12, 15, or insulated. 热5 通道439的顶平面在底座130的顶平面上被暴露。 5 channel hot top plane 439 is exposed on the top plane of the base 130. 凹口435和凹槽437形成于底座130的顶部上,电导线12、 15形成于其底面上。 Recess grooves 435 and 437 formed on top of the base 130, the electrical conductors 12, 15 formed on its bottom surface. 用作第二板30b 的金属板被设置在与用作第一板30a的电路板的顶部相对的底座130的顶平面上。 Serving as a second sheet metal plate 30b is provided on the top plane opposite the first top plate 30a is used as the base circuit board 130.

第二板30b具有开口420,该开口具有与LED晶片5安装在其上的 The second plate 30b has an opening 420, the opening having the LED chip 5 mounted thereon

io 凹口435的开口大约相同的尺寸。 io opening of the recess 435 of approximately the same size. 安装基底10的第二板30b用焊料接合到形成于安装基底10中的热通道439。 Mounting base 30b of the second plate 10 is bonded by solder to the hot channel 10 formed in the mounting substrate 439. 由透明材料或诸如荧光材料这样的转换LED晶片5发出的入射光的波长的材料制造的盖426可以设置在第二板30b的开口420中,或者它可以用作安放荧光材料的元件。 The wavelength of incident light or a transparent material such as phosphor converted LED chip 5 is emitted material 426 may be provided in the cover plate 30b of the second opening 420, or it may be used as the fluorescent material member placed. 由于电导线12和15形成于凹槽437中,因此它们并不接触第二板30b。 Since the electrical leads 12 and 15 are formed in the groove 437, so they do not contact the second plate 30b. 可以通 Can pass

15过从底座130的顶平面之上形成孔,通过在所述孔的侧面镀金和通过在其中填充焊料而制造热通道439。 15 collected from the top plane of the base 130 is formed above the hole, the plated through a side aperture therein and manufactured by a thermal channel 439 filled with solder.

由于热通道被定位成比底座130的侧平面更靠近LED晶片5,因此由LED晶片5产生的热量可能通过热通道439而非底座130的侧面传导。 Since the heat passage is positioned closer to the LED chip 5 side than the plane of the base 130, so that heat generated by the LED chip 5 may be thermally conductive path through the side surface 130 of the base 439 instead. 因此,热量从底座的安装基底10通过热通道439传导到第二板30b以从 Accordingly, the heat conduction from the mounting base 10 through the base 439 to the heat passage from the second plate 30b to

20 其表面散发。 20 surface distribution.

如上所述,根据所述实施例,由于热量也从用于传热的第二板散发, 因此促进了底座的传热,并且因此降低LED晶片的温度。 As described above, according to the embodiment, since the amount of heat radiated from the second plate for transferring heat, thereby promoting heat transfer base, and thus reduce the temperature of the LED chip. 因此,发光器件具有更长的使用寿命。 Thus, the light emitting device having a longer life. 此外,由于可以流入更大的电流,因此可以增加光强度。 Moreover, since a larger current can flow, the light intensity can be increased. 由于第二板也被用作保持荧光盖的元件,因此可以减小制造成本。 Since the second plate is also used as the fluorescent element holding cover, the manufacturing cost can be reduced.

25 图57A和57B显示了底座131,图58A和58B显示了根据本发明的 25 FIGS 57A and 57B show the base 131, FIGS. 58A and 58B show according to the invention is

又一实施例的带有底座131的发光器件。 The light emitting device having a base 131 according to another embodiment. 在底座131的大致整个底平面上设置金属板436a。 The metal plate 436a is provided over substantially the entire bottom plane of the base 131. 热通道439a-439f被嵌入到安装基底10中,并且其底平面接触金属板436a的顶部。 Hot channel 439a-439f are embedded in the mounting substrate 10, a bottom plane and the top plate 436a of the contact metal. 金属板436a的底平面用焊料425接合到用作传热的第二板30b的金属板。 Metal plate 436a of the bottom plane 425 solder bonded to the metal plate 30b serving as the second heat transfer plate. 因此,热通道439a-439f中的每一个都紧 Thus, each of the hot channel 439a-439f are tight

30 密地热连接到第二板30b。 30 tightly thermally coupled to the second plate 30b. 热通道439a-439f地底部可以被延伸到第二板 439a-439f to the bottom of the hot channel may be extended to the second plate

30b的底平面。 30b is a bottom plane. 嵌入在安装基底10的四个角周围的热通道439a-439f的顶部在底座131的顶面被暴露,不接触电导线12、 15,但接触第一板30a 的金属板411。 Embedded in the four corners of the top of the hot runner 10 is mounted around the base 439a-439f are exposed at the top surface of the base 131 does not contact the electrical conductors 12, 15, the metal plate 411 contacts the first plate 30a. 形成于底座131的凹口435上的电导线12、 15延伸到安装基底10的顶面并且连接到衬垫432。 Formed in the base 131 of the recess 435 of the electrical leads 12 and 15 extend to the top surface of the mounting base 10 and is connected to the pad 432. 5 如图58A和58B中所示,用作第一板30a的电路板具有金属板411、 5 As shown in FIG. 58A and 58B, the first plate 30a serves as a circuit board having a metal plate 411,

绝缘层412和图案层413,并且图案层413的图案面对底座131的顶部。 Insulating layer 412 and the pattern layer 413, and the patterns of the pattern layer 413 facing the top of the base 131. 图案层413用焊料415连接到衬垫432,该衬垫连接到电导线12、 15。 A pattern layer 413 with a solder 415 is connected to the pad 432, the pad is connected to the electrical conductors 12, 15. 在底座131的顶面暴露的热通道439a-439d的顶部用焊料连接到第一板30a 的金属板411。 A first plate 30a is connected to the solder on the top surface of the base 131 top exposed thermal path 439a-439d of the metal plate 411. 金属板411也被用作用于安放荧光盖426的夹具。 Metal plate 411 is also used as a cover 426 mounted fluorescent fixture.

io 在该实施例中,用于传热的第二板30b和底座131大面积地彼此连接 In this embodiment the second plate io embodiment, 30b for heat transfer base 131 and connected to each other over a large area

以便于通过主要传热路径导热。 Through the primary heat transfer path in order to conduct heat. 当LED被用于发光器件或显示设备时, 当绝缘处理之后,在底座的底面的板通常被固定到所述设备的主体。 When the LED is used for the light emitting device or display device, when the insulation after processing, is normally fixed to the body of the device in the bottom surface of the base plate. 在该实施例的结构中,这对应于第二板30b。 In the structure of this embodiment, this corresponds to a second plate 30b. 由于它与LED晶片5绝缘,因此不需要绝缘处理,或者说可以减小制造成本。 Since the LED chip 5 and insulating it, so no insulation process, or that the manufacturing cost can be reduced. 此外,可以减小第二板 Further, the second plate can be reduced

15 30b和所述设备的主体之间的热阻,并且可以有效地进行传热。 15 30b thermal resistance between the body and the device, and the heat transfer can be efficiently performed.

图59A、 59B和59C显示了根据本发明的又一实施例的发光器件。 FIG. 59A, 59B and 59C show the light-emitting device according to still another embodiment of the present invention. 具有高热传导率的多个金属薄片层431a (用于传热)被设置在底座132的安装基底10a中。 A plurality of metal foil layer 431a having a high thermal conductivity (for heat transfer) is provided on the mounting base 10a of the base 132. 金属薄片有必要被水平地布置,但是它们理想地被布置成具有便于导热的良好平衡。 Metal foil disposed horizontally is necessary, but they are desirably arranged to have a well-balanced to facilitate heat conduction. 它们被暴露于底座132的外部。 They are exposed to the outside of the base 132. 金属板436b Metal plate 436b

20 具有相继形成于其上的电导线431和绝缘层430b,并且它们被布置在底座132的底面上。 Electrical leads 20 having sequentially formed thereon and the insulating layer 431 430b, and they are disposed on the bottom surface of the base 132. 它们延伸到侧面以在其顶面设置衬垫432。 They extend to the side thereof to a top surface of the pad 432 is provided. 电导线431b 形成于在底座132的顶平面的中央形成的凹口435上,以连接金属薄片431a和电导线431。 Electrical conductor 431b is formed on the center of the top plane in a recess 132 formed in base 435, is connected to the metal foil 431a and electrical leads 431.

被用作用于热交换的第一板30a或电路板的金属板411的一部分被暴 The metal plate is used as a part of a first heat exchange plate 30a or the circuit board 411 is violent

25 露,并且暴露部分用焊料416接合到底座132的金属板436b。 25 exposed, and the exposed portion engages with solder 416 in the end 132 of the base plate 436b. 衬垫432 用引线接合连接到第一板30b中的图案413。 Wire bonding pad 432 is connected to the first plate 30b is a pattern 413. 用于电连接的技术不受限制。 Technology is not limited to the electrical connection. 在图59A-59C所示的例子中,线432a的端部被接合,而其另一端用焊料415连接到图案413。 In the example shown in FIGS. 59A-59C, the end portion 432a of the line is engaged, and the other end connected to the pattern 413 by solder 415.

待连接到LED晶片5的p和ri电极的金属薄片431a和在底座132的 Metal foil 431a and the base 132 to be connected to the p-electrode and the LED chip ri 5

30 凹口435的侧面的金属层431b彼此独立,并且它们在p和n侧面之间不 The metal layer 30 side surface 431b of the recess 435 independently of each other, and they are not between the p and n sides

连接。 connection. 如图59C中所示,可以通过在成形为具有预定形状的陶瓷薄片上 As shown in FIG 59C, by forming on a ceramic sheet having a predetermined shape,

形成金属薄片431a的图案,通过在金属板436b上的陶瓷薄片上叠加金属薄片,和通过对其进行固化,从而形成图案431b。 Patterning the metal sheet 431a through the ceramic sheet on the metal plate 436b superimposed sheet metal, and by its curing, to form a pattern 431b.

在该实施例中,在LED晶片中产生的热量通过用于传热的图案被传5 导到整个底座,因此从底座的表面的传热被加速。 In this embodiment, the heat generated in the LED wafer by a heat transfer pattern is transferred to the entire base of the guide 5, thus accelerating the heat transfer from the surface of the base. 由于没有图案存在于与底座的底面相对的用于传热的第一板上,因此它们之间的接触区域变宽, 从而向电路板的传热被增强,或者说通过该路径的传热被增加。 Since there is no pattern is present on the first plate and the bottom surface of the base opposite to the heat transfer, so that the contact area therebetween is widened, thereby enhancing heat transfer to the circuit board, or the heat transfer path is through increase.

在该实施例中,由于向用于传热的第一板的传热被增强并且从底座的表面的传热也增加,因此LED晶片的温度可以被降低以给予发光器件更io 长的使用寿命。 In this embodiment, since the enhanced heat transfer plates for a first heat transfer and also increases heat transfer from the surface of the base, the temperature of the LED chip can be lowered to give a more light-emitting device longevity io . 由于更大的电流可通过LED晶片流入,因此可以增加光强度。 Since greater current may flow through the LED chip, the light intensity can be increased.

图60A显示了根据本发明的又一实施例的发光器件,其中底座具有图59A-59C中所示的结构。 FIG 60A shows a light emitting device according to still another embodiment according to the present invention, wherein the base has the structure shown in FIG. 59A-59C. 设置在底座的顶面上的板30b也被用作用于安置荧光材料426和用于光控的透镜427的框架。 A base plate disposed on the top surface 30b of the frame 426, and is also used as a lens for a light control fluorescent material 427 for placement. 热通道439通过薄片 Hot aisle 439 through the sheet

is 431a形成,但是在底座的顶部不暴露。 It is 431a, but is not exposed to the top of the base. 热通道439的顶部具有金层,并且用于固定透镜的框架30b用焊料与之接合。 Top of the heat passage 439 and a gold layer, and a frame 30b for fixing the lens engages with solder. 作为另一选择,如图60B 中所示,顶板30b也可以仅仅被用来安置荧光盖426,而透镜427可以与之分离。 Alternatively, as shown in FIG. 60B, the top plate 30b may be disposed only be used to cover the phosphor 426, and the lens 427 can be separated therefrom. 参考数字440代表电子部件。 Reference numeral 440 denotes an electron component.

作为另一选择,热通道439可以在底座的顶部暴露。 Alternatively, the channel 439 may be exposed to heat in the top of the base. 在该情况下,电 In this case, electrical

20 路板被设置在顶板上,并且作为电极的热通道连接到电路板或用于传热的第一板。 Circuit board 20 is disposed on the top plate, and a first plate electrode connected to the heat channel or a circuit board for transferring heat.

在该实施例的结构中,通过热通道向底座的传热变得均匀,并且在用于传热的第二板的向上方向上的传热也被加速。 In the structure of this embodiment, the passage through the heat becomes uniform heat transfer to the base, and the heat transfer in the upward direction of the second plate for heat transfer is also accelerated. 通过在底座的顶部上提供用于传热的金属板可以获得类似的优点,但是热通道可以更加加速传热。 By providing a metal plate for the heat transfer similar advantages can be obtained on top of the base, but the heat transfer path can be more accelerated.

25 根据该实施例,通过使用用于传热的图案和热通道可以更加加速传热。 Example 25 According to this embodiment, by using a pattern for the heat transfer and the heat transfer channels can be more accelerated. 在该实施例中,使用了底座,但是其类型并不限于此。 In this embodiment, the base used, but the type is not limited thereto.

尽管参考附图结合其优选实施例全面描述了本发明,应当注意的是对于本领域的技术人员来说各种变化和修改是显而易见的。 While the preferred embodiments thereof with reference to the accompanying drawings in conjunction with embodiments of the present invention is fully described, it should be noted that those skilled in the art that various changes and modifications will be apparent. 这样的变化和修改应当被理解成包含在由附加权利要求限定的本发明的范围内,除非它们 Such changes and modifications are to be understood as included within the scope of the invention defined by the appended claims unless they

30 脱离该范围。 30 out of this range.

Claims (27)

1.一种发光器件,其包括: 底座,其包括由电绝缘材料制成的安装基底,安装在安装基底上的至少一个发光二极管晶片和形成于所述安装基底上以电连接到所述发光二极管晶片的电导线;和用于传热的第一板,其包括金属板; 其中与所述第一板的金属板相对的安装基底的第一平面被热接合到所述第一板;并且所述安装基底具有凹口,所述至少一个发光二极管晶片安装在所述凹口的底部上。 A light emitting device, comprising: a base including a mounting base made of an electrically insulating material, is mounted on the mounting base at least one light emitting diode chip and is formed on the mounting substrate to be electrically connected to the light emitting electrical leads of the diode chip; and the first plate for transferring heat, comprising a metal plate; a first plane wherein the metal plate opposite the first plate mounting substrate is thermally bonded to the first plate; and the mounting substrate has a recess, the at least one light emitting diode chip mounted on the bottom of the recess.
2. 根据权利要求1所述的发光器件,其中用于传热的所述第一板包括所述金属板、形成于金属板上的绝缘层、和形成于所述绝缘层上的电连接图案层,所述底座的安装基底的第一平面被热接合到所述第一板的所述金属板的一部分,所述金属板的所述一部分为在与所述底座相对的一侧通过去除所述绝缘层和所述电连接图案层而暴露的部分,并且所述底座的所述电导线电连接到所述第一板的所述电连接图案层。 2. The light emitting device according to claim 1, wherein the first heat transfer plate for a plate comprising a metal, an insulating layer formed on the metal plate and electrically connected to the pattern on the insulating layer layer, the first mounting plane of the base substrate is thermally bonded to a portion of the metal plate of the first plate, said part of the metal plate on a side opposite to the base by removing the said insulating layer and electrically connected to the exposed portions of patterned layer, and said electrical lead electrically connected to the base pattern layer is electrically connected to the first panel.
3. 根据权利要求2所述的发光器件,其中所述安装基底和用于传热的所述第一板中的至少一个具有突起,该突起具有平面以热接合到所述安装基底和所述第一板中的另一个。 3. The light emitting device according to claim 2, wherein the first substrate and the mounting plate for heat transfer with at least one projection, the projection having a planar thermally bonded to the mounting substrate and the the other of the first plate.
4. 根据权利要求2所述的发光器件,其中所述安装基底和所述用于传热的第一板中的一个具有突起,而另一个具有凹口,从而所述突起适配在所述凹口中以在它们之间热接合。 4. The light emitting device according to claim 2, wherein the mounting for the first substrate and the heat transfer plate has one protrusion and the other has a recess, so that the said projection fits recess to thermal bonding therebetween.
5. 根据权利要求2所述的发光器件,其中用接合材料使所述发光二极管晶片面朝下地被安装到所述安装基底。 The light emitting device according to claim 2, wherein the bonding material so that the LED chip is mounted face-down to the mounting base.
6. 根据权利要求2所述的发光器件,其中所述安装基底包括通孔, 所述通孔由热传导率高于所述安装基底的材料制成的层覆盖。 6. The light emitting device according to claim 2, wherein said mounting base comprises a through hole, the through-hole covering layer made of a material of the mounting base by a thermal conductivity higher than that.
7. 根据权利要求6所述的发光器件,其中所述通孔充满热传导率高于所述安装基底的材料。 The light emitting device according to claim 6, wherein said through-holes filled with material of higher thermal conductivity than said mounting substrate.
8.根据权利要求2所述的发光器件,进一步包括设在所述安装基底和用于传热的所述第一板之间的金属元件,所述金属元件与所述底座的安装基底以及所述第一板的所述金属板的所述暴露部分热接合。 8. The light emitting device of claim 2, further comprising a metal member disposed between the first substrate and the mounting plate for heat transfer, said metal substrate mounted to said base member, and the said metal plate exposed portion of said first plate thermally bonded.
9. 根据权利要求8所述的发光器件,其中所述金属元件是接合元件, 以将所述底座的安装基底接合到所述第一板的所述金属板的所述暴露部5分。 9. The light emitting device of claim 8, wherein said engaging element is a metal element, is mounted to the base substrate of the metal plate is joined to the exposed portion of the first plate 5 min.
10. 根据权利要求1所述的发光器件,其中所述安装基底由陶瓷材料制造。 10. The light emitting device according to claim 1, wherein said mounting substrate manufactured from a ceramic material.
11. 根据权利要求1所述的发光器件,其中至少一个凹槽被设置在所述安装基底的所述第一平面上。 11. The light emitting device of claim 1, wherein the at least one groove is provided on the first plane of the mounting substrate.
12.根据权利要求11所述的发光器件,其中所述至少一个凹槽中的每一个都包括一个底部和两个侧面,所述两个侧面之间的宽度沿着从所述底部向所述至少一个凹槽中的每一个的开口的方向增加。 The light emitting device according to claim 11, wherein each of said at least one groove comprises a bottom and two sides, a width between the two sides from the base along to the at least one additional direction of the opening of each of the grooves.
13.根据权利要求11所述的发光器件,进一步包括在所述至少一个凹槽上形成的层,所述层由热传导率高于所述安装基底的材料形成。 The light emitting device according to claim 11, further comprising at least one layer formed on the groove, the layer higher thermal conductivity than said mounting substrate material.
14.根据权利要求11所述的发光器件,其中用接合材料使所述发光二极管晶片面朝下地被安装到所述安装基底,并且所述至少一个凹槽形成于所述接合材料和所述安装基底的第一平面之间以热接合到所述金属板的暴露部分。 The light emitting device according to claim 11, wherein the bonding material so that the light emitting diode chip is mounted face-down to the mounting base, and said at least one groove formed in the bonding material and the mounting between the first plane of the substrate to thermally bonded to the exposed portion of the metal plate.
15. 根据权利要求11所述的发光器件,其中所述至少一个凹槽的数20量等于或大于两个,并且所述凹槽的密度朝着刚好处于所述发光二极管晶片之下的区域增加。 15. The light emitting device according to claim 11, wherein an amount of said at least one groove 20 is equal to or greater than the number two, and the density of the recess toward just below the area in the light emitting diode chip increases .
16. 根据权利要求11所述的发光器件,其中所述至少一个凹槽的数量等于或大于两个,并且所述凹槽具有不同的深度,所述凹槽的深度朝着刚好处于所述发光二极管晶片之下的区域增加。 Just at the depth toward the emitting of the light emitting device of claim 11, wherein said at least a number of grooves equal to or greater than two, and the groove have different depths, the groove increase in the area under the diode chip.
17.根据权利要求14所述的发光器件,其中所述至少一个凹槽的数量等于或大于两个,并且所述凹槽的密度朝着刚好处于所述接合材料之下的区域增加。 The light emitting device according to claim 14, wherein said at least a number of grooves equal to or greater than two, and said density towards the recess just regions under the bonding material increases.
18.根据权利要求14所述的发光器件,其中所述至少一个凹槽的数量等于或大于两个,并且所述凹槽具有不同的深度,所述凹槽的深度朝着30 刚好处于所述接合材料之下的区域增加。 The light emitting device according to claim 14, wherein said at least a number equal to or greater than two grooves, and the grooves have different depths, the depth of the groove 30 toward just at the increase in the area under the bonding material.
19.根据权利要求11所述的发光器件,其中所述至少一个发光二极管晶片的数量等于或大于两个,所述至少一个凹槽的数量等于或大于两个,并且所述凹槽的密度朝着刚好处于所述至少一个发光二极管晶片中的中央发光二极管晶片之下的区域增加。 19. The light emitting device according to claim 11, wherein said at least one light emitting diode chip number equal to or greater than two, at least a number of grooves equal to or greater than two, and the density of the groove towards just the regions under the at least one light emitting diode chip in the center of the light emitting diode chip increases.
20.根据权利要求11所述的发光器件,其中所述至少一个发光二极管晶片的数量等于或大于两个,所述至少一个凹槽的数量等于或大于两个,所述凹槽具有不同的深度,并且所述凹槽在所述至少一个发光二极管晶片中的中央发光二极管晶片和所述金属板的暴露部分之间的区域中的深度大于在其它区域中的深度。 20. The light emitting device according to claim 11, wherein the number of the at least one light emitting diode chip is equal to or greater than two, at least a number of grooves equal to or greater than two, the groove has different depths and said at least one groove depth in the region between the exposed portions of the central LED chip LED chip and the metal plate greater than the depth in other regions.
21.根据权利要求1所述的发光器件,进一步包括用于传热的第二板,该第二板被热接合到不同于其第一平面的所述安装基座的第二平面。 21. The light emitting device according to claim 1, further comprising a second heat transfer plate, the second plate is thermally bonded to a second plane which is different from the first plane of the mounting base.
22.根据权利要求21所述的发光器件,其中用于传热的所述第二板包括另一金属板、形成于其上的绝缘层、和形成于所述绝缘层上的电连接图案层,所述电连接图案层电连接到所述底座的所述电导线。 22. A light emitting device according to claim 21, wherein the second heat transfer plate for a plate of another metal comprising an insulating layer formed thereon, and a pattern layer formed on the electrical connection to the insulating layer , the electrical pattern electrically connecting said electrical conductor layer is connected to the base.
23.根据权利要求21所述的发光器件,其中所述第一和第二板中的--个包括至少一个板状元件以与所述第一和第二板中的另一个热接合。 23. A light emitting device according to claim 21, wherein said first and second plate - of a plate-shaped element comprises at least one thermal engagement with the other of said first and second plates.
24. 根据权利要求21所述的发光器件,进一步包括设在所述第一和第二板之间的导热元件以与所述第一和第二板中的每一个热接合。 24. The light emitting device according to claim 21, further comprising a heat conducting member disposed between the first and the second plate to engage with each of the first and second heat plate.
25. 根据权利要求21所述的发光器件,其中所述安装基座的第一平20面和第二平面中的一个具有在安装在所述安装基底上的所述至少一个发光二极管晶片之上的开口。 25. The light emitting device according to claim 21, wherein a first planar surface 20 and the second plane in the mounting base having at least one light emitting over the substrate mounted on the mounting wafer diode opening.
26. 根据权利要求2或21所述的发光器件,其中所述安装基底包括嵌入到其中的传热材料,所述传热材料具有比所述安装基底的主体更高的热传导率。 26. The light emitting device of claim 2 or claim 21, wherein said mounting substrate comprises a heat transfer material embedded therein, said heat transfer material having a higher body than the mounting substrate thermal conductivity.
27.根据权利要求26所述的发光器件,其中所述传热材料与所述第--和第二板中的至少一个接合。 27. The light emitting device according to claim 26, wherein the heat transfer material and the first - and at least a second engaging plate.
CNB2004800147284A 2003-05-26 2004-05-26 Light-emitting device CN100391017C (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP148050/2003 2003-05-26
JP2003148050 2003-05-26
JP298007/2003 2003-08-21
JP394451/2003 2003-11-25

Publications (2)

Publication Number Publication Date
CN1795567A CN1795567A (en) 2006-06-28
CN100391017C true CN100391017C (en) 2008-05-28

Family

ID=36806188

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB2004800147284A CN100391017C (en) 2003-05-26 2004-05-26 Light-emitting device

Country Status (1)

Country Link
CN (1) CN100391017C (en)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101425496B (en) 2006-08-04 2012-02-29 探微科技股份有限公司 Silicon substrate having flip chip projection
RU2518198C2 (en) * 2008-09-16 2014-06-10 Конинклейке Филипс Электроникс Н.В. Light-emitting device
KR101064098B1 (en) 2009-02-23 2011-09-08 엘지이노텍 주식회사 The light emitting device package and a method of manufacturing the same
CN102640310A (en) * 2009-11-13 2012-08-15 旭硝子株式会社 Substrate for light-emitting elements and light-emitting device
CN102214768A (en) * 2010-04-07 2011-10-12 顺德工业股份有限公司 Encapsulating bracket structure for high-reliability luminous device
CN102214767B (en) * 2010-04-07 2013-12-11 顺德工业股份有限公司 High-reliability packaging support structure of light emitting device
CN202103046U (en) * 2011-05-16 2012-01-04 深圳市华星光电技术有限公司 Light emitting diode radiating structure and backlight module
CN102299080A (en) * 2011-08-29 2011-12-28 深南电路有限公司 A substrate processing method and
CN103363363B (en) * 2012-03-30 2016-03-23 展晶科技(深圳)有限公司 Light bar
EP2852975A1 (en) * 2012-05-23 2015-04-01 Koninklijke Philips N.V. Surface mountable semiconductor device
KR20160066589A (en) * 2014-12-02 2016-06-13 엘지디스플레이 주식회사 LED assembly of liquid crystal display device

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5172301A (en) 1991-10-08 1992-12-15 Lsi Logic Corporation Heatsink for board-mounted semiconductor devices and semiconductor device assembly employing same
US5825625A (en) 1996-05-20 1998-10-20 Hewlett-Packard Company Heat conductive substrate mounted in PC board for transferring heat from IC to heat sink
US6159764A (en) 1997-07-02 2000-12-12 Micron Technology, Inc. Varied-thickness heat sink for integrated circuit (IC) packages and method of fabricating IC packages
EP1139439A1 (en) 2000-03-31 2001-10-04 Relume Corporation Led integrated heat sink
US6498355B1 (en) 2001-10-09 2002-12-24 Lumileds Lighting, U.S., Llc High flux LED array
US6501103B1 (en) 2001-10-23 2002-12-31 Lite-On Electronics, Inc. Light emitting diode assembly with low thermal resistance

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5172301A (en) 1991-10-08 1992-12-15 Lsi Logic Corporation Heatsink for board-mounted semiconductor devices and semiconductor device assembly employing same
US5825625A (en) 1996-05-20 1998-10-20 Hewlett-Packard Company Heat conductive substrate mounted in PC board for transferring heat from IC to heat sink
US6159764A (en) 1997-07-02 2000-12-12 Micron Technology, Inc. Varied-thickness heat sink for integrated circuit (IC) packages and method of fabricating IC packages
EP1139439A1 (en) 2000-03-31 2001-10-04 Relume Corporation Led integrated heat sink
US6498355B1 (en) 2001-10-09 2002-12-24 Lumileds Lighting, U.S., Llc High flux LED array
US6501103B1 (en) 2001-10-23 2002-12-31 Lite-On Electronics, Inc. Light emitting diode assembly with low thermal resistance

Also Published As

Publication number Publication date
CN1795567A (en) 2006-06-28

Similar Documents

Publication Publication Date Title
KR100586944B1 (en) High power light emitting diode package and method of producing the same
CN101432896B (en) Submounts for semiconductor light emitting device packages and semiconductor light emitting device packages including the same
JP4791381B2 (en) Method of manufacturing a light emitting device
US7808013B2 (en) Integrated heat spreaders for light emitting devices (LEDs) and related assemblies
US7473933B2 (en) High power LED package with universal bonding pads and interconnect arrangement
CN104916770B (en) Light emitting diode device
US8610145B2 (en) Light emitting device
CN100530727C (en) Light emitting diode package having multi-stepped reflecting surface structure and fabrication method thereof
US6614103B1 (en) Plastic packaging of LED arrays
US7772609B2 (en) LED package with structure and materials for high heat dissipation
CN1306626C (en) Semiconductor luminescent device
JP3736366B2 (en) A surface mount-type light-emitting element and a light-emitting device using the same
US6930332B2 (en) Light emitting device using LED
CN1747192B (en) Light emitting means
EP1670072B1 (en) Illuminating device
JP5129847B2 (en) Led package
CN101051665B (en) Light emitting diode package having anodized insulation layer and fabrication method therefor
KR101162404B1 (en) Resin-Sealed Light Emitting Device and Its Manufacturing Method
US20090166664A1 (en) High power light emitting diode package and manufacturing method thereof
US20080261339A1 (en) Packaging method to manufacture package for a high-power light emitting diode
CN1212676C (en) Light source device using LED and method of producing same
US20070247855A1 (en) Light Emitting Device,Lighting Equipment or Liquid Crystal Display Device Using Such Light Emitting Device
CN100391019C (en) Semiconductor light-emitting device and method of manufacturing the same
WO2011136236A1 (en) Leadframe, wiring board, light emitting unit, and illuminating apparatus
JP4689637B2 (en) Semiconductor light-emitting device

Legal Events

Date Code Title Description
C06 Publication
C10 Entry into substantive examination
C14 Grant of patent or utility model