JPS5598849A - Heat pipe type cooler - Google Patents

Heat pipe type cooler

Info

Publication number
JPS5598849A
JPS5598849A JP485779A JP485779A JPS5598849A JP S5598849 A JPS5598849 A JP S5598849A JP 485779 A JP485779 A JP 485779A JP 485779 A JP485779 A JP 485779A JP S5598849 A JPS5598849 A JP S5598849A
Authority
JP
Japan
Prior art keywords
pipe
heat
piece
heat pipe
board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP485779A
Other languages
Japanese (ja)
Inventor
Yasuo Aoki
Kazuhiro Sano
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP485779A priority Critical patent/JPS5598849A/en
Publication of JPS5598849A publication Critical patent/JPS5598849A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE: To readily mount a heat transfer element at a package attached with components of complicated configuration by integrally molding a heating element and a heat transfer element such as a heat pipe using molding material having high thermal conductivity.
CONSTITUTION: A printed board 3 attached with IC element 4, resistors 10, and capacitors 11 and the like, and a heat collecting plate 2 fixed with a heat pipe 1 are arranged at an appropriate interval. A heat dissipating piece 9 is connected to the terminal of the pipe 1 in this state, and the board is molded using epoxy material containing beryllia while integrating the piece 9 to the board. Thus, the heat generated from the element 4, the resistors 10 and the capacitors 11 is externally dissipated from the piece 9 through the pipe 1. According to this configuration, even if the shape of the components are complicated, the pipe 1 can be readily mounted.
COPYRIGHT: (C)1980,JPO&Japio
JP485779A 1979-01-22 1979-01-22 Heat pipe type cooler Pending JPS5598849A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP485779A JPS5598849A (en) 1979-01-22 1979-01-22 Heat pipe type cooler

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP485779A JPS5598849A (en) 1979-01-22 1979-01-22 Heat pipe type cooler

Publications (1)

Publication Number Publication Date
JPS5598849A true JPS5598849A (en) 1980-07-28

Family

ID=11595338

Family Applications (1)

Application Number Title Priority Date Filing Date
JP485779A Pending JPS5598849A (en) 1979-01-22 1979-01-22 Heat pipe type cooler

Country Status (1)

Country Link
JP (1) JPS5598849A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59100394A (en) * 1982-12-01 1984-06-09 M C L:Kk Heat transfer device
US4614227A (en) * 1983-11-02 1986-09-30 Bbc Brown, Boveri & Company Limited Cooling body for the liquid cooling of high-power semiconductor components
JPS61165354U (en) * 1986-04-03 1986-10-14
JPS61165355U (en) * 1986-04-03 1986-10-14
EP1512890A2 (en) 2003-09-03 2005-03-09 Enplas Corporation Plastic molded gear, and intermittent rotation transmission device and gear train using same

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59100394A (en) * 1982-12-01 1984-06-09 M C L:Kk Heat transfer device
US4614227A (en) * 1983-11-02 1986-09-30 Bbc Brown, Boveri & Company Limited Cooling body for the liquid cooling of high-power semiconductor components
JPS61165354U (en) * 1986-04-03 1986-10-14
JPS61165355U (en) * 1986-04-03 1986-10-14
JPH0310679Y2 (en) * 1986-04-03 1991-03-15
JPH0310680Y2 (en) * 1986-04-03 1991-03-15
EP1512890A2 (en) 2003-09-03 2005-03-09 Enplas Corporation Plastic molded gear, and intermittent rotation transmission device and gear train using same

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