JPS641264A - Cooler for integrated circuit element - Google Patents

Cooler for integrated circuit element

Info

Publication number
JPS641264A
JPS641264A JP62157197A JP15719787A JPS641264A JP S641264 A JPS641264 A JP S641264A JP 62157197 A JP62157197 A JP 62157197A JP 15719787 A JP15719787 A JP 15719787A JP S641264 A JPS641264 A JP S641264A
Authority
JP
Japan
Prior art keywords
refrigerant
integrated circuit
circuit element
sealing
passage
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP62157197A
Other languages
Japanese (ja)
Other versions
JPH07112035B2 (en
JPH011264A (en
Inventor
Haruhiko Yamamoto
Masahiro Suzuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP62157197A priority Critical patent/JPH07112035B2/en
Publication of JPS641264A publication Critical patent/JPS641264A/en
Publication of JPH011264A publication Critical patent/JPH011264A/en
Publication of JPH07112035B2 publication Critical patent/JPH07112035B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73253—Bump and layer connectors

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

PURPOSE: To efficiently cool an integrated circuit element by filling a porous structure in a flexible structure and sealing refrigerant in a sealing structure.
CONSTITUTION: Good thermally conductive 3-dimensional porous member 4 is provided in the bottom of a flexible structure 1, and a sealing structure 5 for sealing refrigerant is provided between the member 4 and a refrigerant passage 3. The refrigerant which passes through the passage 3 and a nozzle 6 passes through the member 4 to increase the area of the member 4 in contact with the passing refrigerant, thereby efficiently transfer heat to the member 4 of good thermal conductor, and returns from the member to a return passage 3-1. Accordingly, its heat transfer efficiency is improved to efficiently cool an integrated circuit element, thereby improving its performance.
COPYRIGHT: (C)1989,JPO&Japio
JP62157197A 1987-06-23 1987-06-23 Integrated circuit element cooling device Expired - Fee Related JPH07112035B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62157197A JPH07112035B2 (en) 1987-06-23 1987-06-23 Integrated circuit element cooling device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62157197A JPH07112035B2 (en) 1987-06-23 1987-06-23 Integrated circuit element cooling device

Publications (3)

Publication Number Publication Date
JPS641264A true JPS641264A (en) 1989-01-05
JPH011264A JPH011264A (en) 1989-01-05
JPH07112035B2 JPH07112035B2 (en) 1995-11-29

Family

ID=15644326

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62157197A Expired - Fee Related JPH07112035B2 (en) 1987-06-23 1987-06-23 Integrated circuit element cooling device

Country Status (1)

Country Link
JP (1) JPH07112035B2 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008244398A (en) * 2007-03-29 2008-10-09 Nissan Motor Co Ltd Cooling device
EP2151863A1 (en) 2008-07-31 2010-02-10 Lucent Technologies Inc. A jet impingement cooling system
JP2011138840A (en) * 2009-12-26 2011-07-14 Kyocera Corp Structure for bearing light emitting element, light emitting element cooling mechanism, and light emitting device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008244398A (en) * 2007-03-29 2008-10-09 Nissan Motor Co Ltd Cooling device
EP2151863A1 (en) 2008-07-31 2010-02-10 Lucent Technologies Inc. A jet impingement cooling system
JP2011138840A (en) * 2009-12-26 2011-07-14 Kyocera Corp Structure for bearing light emitting element, light emitting element cooling mechanism, and light emitting device

Also Published As

Publication number Publication date
JPH07112035B2 (en) 1995-11-29

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees