JPS641263A - Cooling of semiconductor element - Google Patents

Cooling of semiconductor element

Info

Publication number
JPS641263A
JPS641263A JP62156124A JP15612487A JPS641263A JP S641263 A JPS641263 A JP S641263A JP 62156124 A JP62156124 A JP 62156124A JP 15612487 A JP15612487 A JP 15612487A JP S641263 A JPS641263 A JP S641263A
Authority
JP
Japan
Prior art keywords
gas
pin
chip
gas stream
cooling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62156124A
Other languages
Japanese (ja)
Other versions
JPH011263A (en
Inventor
Aritaka Tatsumi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Cable Ltd
Original Assignee
Hitachi Cable Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Cable Ltd filed Critical Hitachi Cable Ltd
Priority to JP62-156124A priority Critical patent/JPH011263A/en
Priority claimed from JP62-156124A external-priority patent/JPH011263A/en
Publication of JPS641263A publication Critical patent/JPS641263A/en
Publication of JPH011263A publication Critical patent/JPH011263A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73253—Bump and layer connectors

Abstract

PURPOSE: To simplify and to enhance the efficiency of a cooling system by cooling an LSI chip by a forcible air (gas) cooling system.
CONSTITUTION: A heat transfer pin 13 is attached to a cylinder 5 in a slidable state pressed by a pressure application spring 16, and the end of the pin 13 is brought into contact with a back face of an LSI chip 2. A slit 17 is formed on the cylindrical face of the pin 13 to be able to supply gas. When gas of predetermined pressure is supplied to a gas passage 14, and the side of a sealed space 4 is evacuated by means, such as a gas pump 18 to a low pressure, gas stream is generated between both to generate a resisting force formed by multiplying pressure difference generated in response to the flowing resistance of the gas around the pin 13 by its sectional area. Thus, the pin 13 is pressed together with the force of the spring 16 and to the chip 2. As a result, the heat generated at the chip 2 is transmitted to the pin 13 by conduction, dissipated to the gas stream from the surface including the slit 17, and transmitted directly from a circuit substrate to the gas stream around the chip 2 to be effectively cooled by the effect of both.
COPYRIGHT: (C)1989,JPO&Japio
JP62-156124A 1987-06-23 Semiconductor device cooling method Pending JPH011263A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62-156124A JPH011263A (en) 1987-06-23 Semiconductor device cooling method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62-156124A JPH011263A (en) 1987-06-23 Semiconductor device cooling method

Publications (2)

Publication Number Publication Date
JPS641263A true JPS641263A (en) 1989-01-05
JPH011263A JPH011263A (en) 1989-01-05

Family

ID=

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