CN109195402A - Heat abstractor and check out test set - Google Patents
Heat abstractor and check out test set Download PDFInfo
- Publication number
- CN109195402A CN109195402A CN201810933117.3A CN201810933117A CN109195402A CN 109195402 A CN109195402 A CN 109195402A CN 201810933117 A CN201810933117 A CN 201810933117A CN 109195402 A CN109195402 A CN 109195402A
- Authority
- CN
- China
- Prior art keywords
- shell
- chip
- radiating
- radiator
- heat dissipation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Investigating Or Analyzing Materials Using Thermal Means (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The application relates to a heat dissipation device and detection equipment. The detection device comprises a shell, a chip and a heat dissipation device. The housing is sealed. The chip is arranged in the shell. The heat dissipation device comprises a heat dissipation piece, and the heat dissipation piece is provided with a heat receiving part and a heat dissipation part which are mutually connected. The heat receiving part is connected with the chip, and the heat radiating part is arranged outside the shell. According to the heat dissipation device, the chip of the detection equipment can be connected through the heat receiving part of the heat dissipation piece, and therefore heat on the chip is directly conducted to the heat receiving part of the heat dissipation piece; then, the heat is conducted to the heat radiating part connected with the heat receiving part through the heat receiving part; finally, the heat dissipation part arranged outside the detection equipment dissipates heat to the outside of the detection equipment, so that the temperature of a chip of the detection equipment is reduced, and the service life of the detection equipment is prolonged.
Description
Technical field
This application involves detection technique fields, more particularly to a kind of radiator and detection device.
Background technique
With the development of detection technique, various detection settings are applied among various industries, facilitate people to various information
Judgement.
Some detection devices in the related technology can use the chip of high power consumption for high quality demand.These detections are set
When standby work, the high power consumption of introducing can generate big calorimetric.Meanwhile above equipment needs for chip to be set to the outer of sealing toward contact
In shell, so that it has functions of waterproof and dustproof.
But the shell of sealing can not aperture heat dissipation.Detection device can be excessively high due to chip temperature, negative so as to cause chip
Carry it is excessive, or even damage chip.Therefore the service life of detection device also reduces.
Summary of the invention
Based on this, it is necessary to which the technical issues of can not radiating for the shell of above-mentioned sealing, providing one kind can be to detection
The radiator that equipment is effectively radiated.
Meanwhile the application also provides a kind of detection device that can effectively radiate.
A kind of radiator is applied to detection device, and the radiator includes radiating piece, and the radiating piece has mutual
Connection connects hot portion and radiating part, described to meet hot portion and be used for for connecting the chip of the detection device, the radiating part to institute
It states and radiates outside detection device.
Meeting hot portion described in one of the embodiments, includes first shell, and the radiating part includes second shell, described
Liquid storage chamber is communicated and surrounded inside first shell and the second shell, and there is working fluid, and the work in the liquid storage chamber
Make hydraulic seal inside the liquid storage chamber.
Radiator further includes cooling component in one of the embodiments, and the cooling component is in face of at least partly institute
State radiating part.
The cooling component includes fan in one of the embodiments, and the wafter is to the radiating part.
The cooling component further includes the cooling cabinet and printed circuit with aperture in one of the embodiments,
Plate, the cooling cabinet wrap up at least partly described radiating part, and the printed circuit board and the fan are located at the heat dissipation
In cabinet, and the printed circuit board is electrically connected the fan.
The cooling component includes diffuser in one of the embodiments, and the diffuser connects the radiating part.
The diffuser includes at least one Qi piece and around being connected to the radiating part in one of the embodiments,.
The radiator further includes the conducting wire for being electrically connected the chip in one of the embodiments, described
Conducting wire is coated togather with the radiating piece.
The conducting wire includes conductor wire and insulating layer in one of the embodiments, is led described in the insulating layer cladding
Electric wire.
A kind of detection device, including shell, chip and radiator described in any of the above embodiments, the shell sealing,
The chip is set in the shell, described to connect hot portion's connection chip, and the radiating part is set to outside the shell.
Above-mentioned radiator, can be by the chip for connecing hot portion's connecting detection equipment of radiating piece, and then will be on chip
What heat was directly transferred to radiating piece meets hot portion；Then, heat is conducted to radiating part connected to it by meeting hot portion；Most
Afterwards, it is radiated by being set to the outer radiating part of detection device to outside detection device, and then reduces the chip temperature of detection device,
Improve the service life of detection device.
Detailed description of the invention
Fig. 1 is the detection device perspective view in one embodiment；
Fig. 2 is the exploded view of another angle of detection device shown in FIG. 1；
Fig. 3 is the sectional view of detection device shown in FIG. 1.
Appended drawing reference:
1- chip；2- shell；21- upper casing；22- lower casing；3- radiator；31- radiating piece；311- meets hot portion；312- dissipates
Hot portion；32- cooling component；321- fan；322- cooling cabinet；3221- air inlet；3222- venthole；323- printed circuit
Plate；324- diffuser；3241- Qi piece.
Specific embodiment
It is with reference to the accompanying drawings and embodiments, right in order to which the objects, technical solutions and advantages of the application are more clearly understood
The application is further elaborated.It should be appreciated that specific embodiment described herein is only used to explain the application, not
For limiting the application.
Radiator provided by the present application can be applied in various detection devices.Various detection devices include by chip
It is set in the shell of sealing, to make it have the detection device of functions of waterproof and dustproof, such as medical ultrasonic diagnostic instrument.Due to height
Quality image demand, medical ultrasonic diagnostic instrument is using high channel, the chip of high power consumption.The chip of high power consumption can generate big calorimetric.
Meanwhile medical ultrasonic diagnostic instrument also needs periodically to sterilize cleaning.Therefore, the chip needs of medical ultrasonic diagnostic instrument are set to sealing
Shell in so that it has functions of waterproof and dustproof.
In one embodiment, as shown in Figure 1 to Figure 2, detection device includes chip 1, shell 2 and radiator 3.
With reference to Fig. 3, chip 1 is set in shell 2.Shell 2 can specifically include upper casing 21 and lower casing 22, and upper casing 21 is under
Shell 22 assembles rear casing 2 and seals.Certainly, the shell 2 of sealing can also be other forms.
With reference to Fig. 1, radiator 3 includes radiating piece 31.Radiating piece 31 connects hot portion 311 and radiating part with interconnected
312.Hot portion 311 is met for connecting chip 1.Radiating part 312 to outside detection device for radiating.Radiator 3 is assembled to detection
When equipment, with reference to Fig. 3, meets hot portion 311 and connect chip 1.Radiating part 312 is set to outside shell 2, and then is dissipated to outside detection device
Heat.Meet hot portion 311 and the specific connection type of chip 1 various modes, the application such as solid, welding can not do this for screwed lock
Limitation.
When detection device works, chip 1 is connected due to meeting hot portion 311, and then the heat on chip 1 can directly be conducted
To meeting hot portion 311.Then, due to radiating part 312 and meet hot portion 311 and be connected with each other, connect the heat in hot portion 311 can be conducted to it is scattered
Hot portion 312.Finally, again since radiating part 312 is set to outside shell 2, it can be to the environment outside detection device after being heated
Middle heat dissipation, and then the temperature of the chip 1 of detection device is reduced, improve the service life of detection device.
31 structure of radiating piece can have liquid storage chamber (not shown) and working fluid (is not schemed similar to heat pipe
Show), working fluid is sealed in inside liquid storage chamber.Specifically, the hot portion 311 that connects of radiating piece 31 includes first shell, radiating part 312
Including second shell.Liquid storage chamber is communicated and surrounded inside first shell and second shell, and there is working fluid in liquid storage chamber.Work as inspection
When measurement equipment works, 1 persistent fever of chip can heat the intracorporal working fluid of shell for the radiating piece 31 being attached thereto.Heated
Working fluid vaporization saturation is flowed to the cold end (i.e. 312 one end of radiating part) of radiating piece 31.According to condensation liquefaction principle, after vaporization
Working fluid condense into liquid again after cold end is cooled, while releasing heat.Again condensed working fluid also returns to
Heat absorption vaporization is continued in the hot end (i.e. 311 one end of interconnecting piece) of radiating piece 31, circuits sequentially, and persistently reduces the chip temperature of equipment.
Radiating piece 31 passes through the working fluid of setting in the inner after by hot gaseous, and condensation liquefaction heat release, and then effectively accelerates radiating piece
31 radiating rate improves radiating efficiency.
Above-mentioned working fluid can be, but not limited to as pure water.Radiating piece 31 can also include liquid-sucking core.Radiating piece 31 makes
It can will be pumped into negative pressure in shell before, suitable working fluid is then filled in shell.Working fluid makes to be close to inner walls
Liquid-sucking core (capillary-porous material) in it is hydraulically full after, shell is sealed.Working fluid when reaching cold end after heated,
The effect for relying on capillary force again, flows back to hot end along porous material.It also may not include liquid-sucking core in radiating piece 31.Detection device work
When, if radiating piece 31 is placed along the vertical direction, the reflux of working fluid can also meet by gravity, without setting capillary-porous structure again
Liquid-sucking core.
Certainly, the form of the application radiating piece 31 is not limited to above-mentioned form, may be a hollow shell, or
It is possibly even solid shell.Since the radiating part 312 of radiating piece 31 has extended to other than shell 2, radiating piece 31 is
Just a hollow or solid shell is only included, can also play the purpose for improving heat dissipation to a certain extent.
In one embodiment, with reference to Fig. 1 and Fig. 2, radiator 3 can also include cooling component 32.Cooling component
32, in face of at least partly radiating part 3, can quickly reduce the temperature of the part radiating part 3, and then improve and pass the heat on chip 1
Lead the speed of the part radiating part 3.Therefore, the setting of cooling component 32 can accelerate the heat spreading function to chip 1, improve and dissipate
The thermal efficiency.
In one embodiment, cooling component 32 can specifically include fan 321.Fan 321 is dried in face of radiating part 3,
It can accelerate the heat exchange of the cold airflow and corresponding radiating part 3 in air, and then improve radiating rate.
In one embodiment, for the ease of placement and driving fan 321, cooling component 32 can also include aperture
Cooling cabinet 322 and printed circuit board 323.When printed circuit board 323 and fan 321 are respectively positioned in cooling cabinet 322.Print
Printed circuit board 323 is electrically connected fan 321, and then provides driving signal for it.
The hot gas that aperture on cooling cabinet 322 is used to provide cold air to fan 321 and discharge is exchanged with cold air.Specifically
Ground, the aperture on cooling cabinet 322 may include the air inlet 3221 and venthole 3222 being oppositely arranged.Air inlet 3221 is used to
Cold air is flowed into cooling cabinet 322, venthole 3222 is used to the hot gas being discharged in cooling cabinet 322.Certainly, cooling cabinet
Aperture mode on 322 can also be unlike this.
Cooling cabinet 322 can be with covered section radiating part 312.Specifically, radiating part 312 can run through cooling cabinet 322.
At this point, part of the radiating part 312 inside cooling cabinet 322 can be between fan 321 and gas outlet 3222, and fan
321 face part of the radiating part 312 inside cooling cabinet 322.Alternatively, the end of radiating part 312 can also be located at heat dissipation machine
Without being pierced by case 322.Certainly, cooling cabinet 322 can also coat entire radiating part 312.
In the embodiment of the present application, the printed circuit board 323 of fan 321 and driving fan 321 can also be placed in another
It is not placed in cooling cabinet 322 on a other component.The driving of fan 321 can not also separately set printed circuit board 323, but
The switch etc. of fan 321 is directly controlled using power supply.The application does not make too many restrictions this.
In the embodiment of the present application, cooling component 32 can also be using other types of cooling in addition to fan 321 is cooling.Example
Such as, ice cube or cooling water are placed in cooling cabinet 322.Ice cube or cooling water direct or through other component and dissipate
Hot portion 312 contacts, and then the cooling corresponding portion radiating part 312 by way of heat transfer.
In one embodiment, cooling component 32 can also include diffuser 324.Diffuser 324 connects radiating part 312,
And then by the heat diffusion of radiating part 312 to entire diffuser 324, and then be conducive to rapidly fall heat loss.Work as fan
321 with diffuser 324 exist simultaneously when, radiating part 312 can be between fan 321 and diffuser 324.
In one embodiment, diffuser 324 includes at least one Qi piece 3241.Diffuser 324 can be by using ring
Around mode be connected to the outer surface of radiating piece 31 so that diffuser 324 and the contact area of radiating piece 31 are relatively large.Diffusion
The connection method of part 324 and radiating piece 31 can be using the methods of welding, and the application is without limitation.At least one protrusion
Qi piece 3241 can further increase heat diffusion area, be more conducive to rapid cooling.The particular number of Qi piece 3241 can be with
It is arranged according to actual needs.
When detection device works normally, chip 1 need to provide electric signal input by conducting wire for it.Therefore, implement at one
In example, radiator 3 can also include the conducting wire being electrically connected with chip 1.Conducting wire is coated togather with radiating piece 31, Jin Erjian
Change the structure of detection device, convenient for the application of detection device.When detection device works, radiating piece 31 due to being contacted with chip 1 and
With relatively high temperature, therefore, when practical application, heat proof material can be used by radiating piece 31 and conducting wire cladding one
It rises, avoids 31 temperature of radiating piece high, cause package failure.Certainly, when detection device works, the temperature on radiating piece 31 will not be too
Gao Shi, radiating piece 31 and conducting wire cladding material also can choose common material.
In one embodiment, conducting wire includes the insulating layer of conductor wire and coated with conductive line.Insulating layer is on the one hand effective
Insulated conductive wires avoid that safety accident occurs.On the other hand, insulating layer can also be effectively isolated conductor wire and radiating piece 31, avoid
Relatively high temperature on radiating piece 31 causes conductor wire aging.
In the embodiment of the present application, detection device can include radiator 3 when manufacturing, and can also be assembled with the later period
Upper radiator 3.When detection device includes radiator 3 when manufacturing, conducting wire can not also be coated with radiating piece 31
Together.The radiator 3 that later period is assembled to detection device can not include conducting wire；Alternatively, radiator 3 includes being electrically connected
When the conducting wire of chip 1, conducting wire can not also be coated togather with radiating piece 31.
In conclusion radiator provided by the present application includes radiating piece, radiating piece have it is interconnected connect hot portion with
Radiating part.The chip of hot portion's connecting detection equipment is connect, and then the heat on chip is directly absorbed.Radiating part is connect with hot portion is met
And be located at outside the shell of detection device, and then the heat on the chip of absorption can be dissipated to outside detection device, thus effectively
To chip cooling.
Each technical characteristic of above embodiments can be combined arbitrarily, for simplicity of description, not to above-described embodiment
In each technical characteristic it is all possible combination be all described, as long as however, the combination of these technical characteristics be not present lance
Shield all should be considered as described in this specification.
The several embodiments of the application above described embodiment only expresses, the description thereof is more specific and detailed, but simultaneously
It cannot therefore be construed as limiting the scope of the patent.It should be pointed out that coming for those of ordinary skill in the art
It says, without departing from the concept of this application, various modifications and improvements can be made, these belong to the protection of the application
Range.Therefore, the scope of protection shall be subject to the appended claims for the application patent.
Claims (10)
1. a kind of radiator is applied to detection device, which is characterized in that the radiator includes radiating piece, the heat dissipation
Part connects hot portion and radiating part, the chip for meeting hot portion and being used to connect the detection device, the heat dissipation with interconnected
Portion to outside the detection device for radiating.
2. radiator according to claim 1, which is characterized in that described to meet hot portion include first shell, the heat dissipation
Portion includes second shell, communicates and surround liquid storage chamber, tool in the liquid storage chamber inside the first shell and the second shell
There is working fluid, and the working fluid is sealed in inside the liquid storage chamber.
3. radiator according to claim 1, which is characterized in that radiator further includes cooling component, the cooling
Component faces at least partly described radiating part.
4. radiator according to claim 3, which is characterized in that the cooling component includes fan, the wafter
To the radiating part.
5. radiator according to claim 4, which is characterized in that the cooling component further includes having the heat dissipation of aperture
Cabinet and printed circuit board, the cooling cabinet wrap up at least partly described radiating part, the printed circuit board and described
Fan is located in the cooling cabinet, and the printed circuit board is electrically connected the fan.
6. radiator according to claim 3, which is characterized in that the cooling component includes diffuser, the diffusion
Part connects the radiating part.
7. radiator according to claim 6, which is characterized in that the diffuser includes at least one Qi piece and surround
It is connected to the radiating part.
8. radiator according to claim 1, which is characterized in that the radiator further includes for being electrically connected
The conducting wire of chip is stated, the conducting wire is coated togather with the radiating piece.
9. radiator according to claim 8, which is characterized in that the conducting wire includes conductor wire and insulating layer, institute
It states insulating layer and coats the conductor wire.
10. a kind of detection device, which is characterized in that including shell, chip and the described in any item heat dissipation dresses of claim 1-9
It sets, the shell sealing, the chip is set in the shell, and described to connect hot portion's connection chip, the radiating part is set
It is placed in outside the shell.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810933117.3A CN109195402B (en) | 2018-08-16 | 2018-08-16 | Heat abstractor and check out test set |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810933117.3A CN109195402B (en) | 2018-08-16 | 2018-08-16 | Heat abstractor and check out test set |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109195402A true CN109195402A (en) | 2019-01-11 |
| CN109195402B CN109195402B (en) | 2020-08-04 |
Family
ID=64918113
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810933117.3A Active CN109195402B (en) | 2018-08-16 | 2018-08-16 | Heat abstractor and check out test set |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109195402B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110086723A (en) * | 2019-04-25 | 2019-08-02 | 新华三技术有限公司 | A kind of router |
| CN113819676A (en) * | 2021-09-22 | 2021-12-21 | 南阳理工学院 | Non-inductive heat dissipation system of wearable equipment |
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| US7365982B2 (en) * | 2005-11-01 | 2008-04-29 | Fu Zhun Precision Industry (Shenzhen) Co., Ltd. | Liquid cooling device |
| CN101351103A (en) * | 2007-07-16 | 2009-01-21 | 汉达精密电子(昆山)有限公司 | External connection radiating device |
| CN102098902A (en) * | 2009-12-11 | 2011-06-15 | 华为技术有限公司 | Heat dissipation device, heat dissipation method for communication device and communication device |
| CN201830590U (en) * | 2010-10-09 | 2011-05-11 | 北京维盛网域科技有限公司 | Radiating case |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN110086723A (en) * | 2019-04-25 | 2019-08-02 | 新华三技术有限公司 | A kind of router |
| CN113819676A (en) * | 2021-09-22 | 2021-12-21 | 南阳理工学院 | Non-inductive heat dissipation system of wearable equipment |
Also Published As
| Publication number | Publication date |
|---|---|
| CN109195402B (en) | 2020-08-04 |
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