CN107742621A - A kind of heat abstractor for flush type chip bga - Google Patents
A kind of heat abstractor for flush type chip bga Download PDFInfo
- Publication number
- CN107742621A CN107742621A CN201711121095.2A CN201711121095A CN107742621A CN 107742621 A CN107742621 A CN 107742621A CN 201711121095 A CN201711121095 A CN 201711121095A CN 107742621 A CN107742621 A CN 107742621A
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- CN
- China
- Prior art keywords
- cooling medium
- heat
- micro
- chip
- spray chamber
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
- H01L23/4735—Jet impingement
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention discloses a kind of heat abstractor for flush type chip bga, including printed circuit board, it is characterized in that, the inside of the printed circuit board is provided with mould plastic-sealed body, heat conduction film and the micro- spray chamber body that order is set, the molding envelope is in vivo provided with array soldered ball and the substrate being attached thereto, chip is embedded with substrate, micro- spray chamber body is provided with cooling medium entrance and cooling medium exports, and medium inlet and cooling medium outlet are connected with the cooling pump outside printed circuit board and heat exchanger respectively.This installation cost is low, is easily achieved, heat caused by chip can be conducted to encapsulation it is outer, so as to improving the heat-sinking capability of chip package.
Description
Technical field
The present invention relates to electronic encapsulated components technology, specifically a kind of heat abstractor for flush type chip bga.
Background technology
As electronic product constantly develops to miniaturization, multifunction, high integration direction, to the need of novel encapsulated technology
Ask also growing, it is desirable to which novel encapsulated technology has more I/O number of pins, smaller pin spacing, more small chi
Degree, higher electrical property and hot property, higher reliability and lower cost.Flush type as one of novel encapsulated technology
Minute yardstick ball grid array solder joint has small size, high density of integration, improves properties of product and improves the chip speed of service etc. excellent
Point, requirement of the electronic product to small size and light weight can be met.
BGA package element integrated level is very high, and heat dissipation problem is the major issue that such packing forms face, and environment temperature is sent out
Changing or element are because of break-make electrical power adstante febre, due to existing thermal coefficient of expansion mismatch between chip, solder joint and PCB
Caused alternating thermal stress can cause BGA solder joints to produce heat fatigue integrity problem in solder joint.
The content of the invention
The present invention seeks to overcome the deficiencies in the prior art, and one kind is provided and is used for flush type chip bga
Heat abstractor.This installation cost is low, is easily achieved, heat caused by chip can be conducted to encapsulation it is outer, so as to improving core
The heat-sinking capability of piece encapsulation.
Realizing the technical scheme of the object of the invention is：
A kind of heat abstractor for flush type chip bga, including printed circuit board, the inside of the printed circuit board are set
There are mould plastic-sealed body, heat conduction film and the micro- spray chamber body that order is set, the molding envelope is provided with array soldered ball and connected therewith in vivo
The substrate connect, chip is embedded with substrate, micro- spray chamber body is provided with cooling medium entrance and cooling medium exports, medium inlet
It is connected respectively with the cooling pump outside printed circuit board and heat exchanger with cooling medium outlet.
Dividing plate is provided with micro- spray chamber body, cooling medium entrance and cooling medium outlet are located at the both sides of dividing plate respectively,
Dividing plate is provided with dividing plate via.
The heat conduction film is Diamond Films With High Thermal Conductivity.
Array soldered ball, chip, substrate, heat conducting film, mould plastic-sealed body, micro- spray chamber body, dividing plate, dividing plate via, cooling medium
Entrance is collectively referred to as BGA package with cooling medium outlet.
This device uses active heat removal mode, i.e. micro jet flow heat dissipation technology is applied to package level, as early as possible will contribute to
Heat caused by chip is conducted to outside encapsulation, so as to improve the radiating efficiency of high-power chip encapsulation.
This installation cost is low, is easily achieved, and can conduct heat caused by chip to outside encapsulation, be sealed so as to improve chip
The heat-sinking capability of dress.
Brief description of the drawings
Fig. 1 is the structural representation of the present invention；
Fig. 2 is the structural representation of micro- spray chamber body in the present invention；
Fig. 3 is the A-A sectional views of micro- spray chamber body in embodiment.
In figure, the chip 106. of 101. printed circuit board, 102. soldered ball, 103. substrate, 104. heat conduction film 105. molding envelope
The micro- dividing plate via 110. of 108. dividing plate of spray chamber body 109. of the body 107. but but heat exchanger of media outlet 200. of medium inlet 111.
The connecting pipe 700.BGA of 300. first connecting pipe, 400. 500. second connecting pipe 600. of cooling pump the 3rd is encapsulated.
Embodiment
Present invention is further elaborated with reference to the accompanying drawings and examples, but is not limitation of the invention.
Embodiment：
Reference picture 1, Fig. 3, a kind of heat abstractor for flush type chip bga, including printed circuit board 101, the print
The inside of circuit board 101 processed is provided with mould plastic-sealed body 106, heat conduction film 104 and the micro- spray chamber body 107 that order is set, the molding
Array soldered ball 102 and the substrate 103 being attached thereto are provided with envelope body 106, chip 105, micro- spray chamber are embedded with substrate 103
Body 107 is provided with cooling medium entrance 110 and cooling medium outlet 111, medium inlet 110 and the difference of cooling medium outlet 111
It is connected with the cooling pump 400 outside printed circuit board 101 and heat exchanger 200, entrance and the heat exchanger 200 of cooling pump 400
Outlet be connected by the first connecting pipe 300, the outlet of cooling pump 400 passes through the second connecting tube with cooling medium entrance 110
Road 500 is connected, and cooling medium outlet 111 is connected with the entrance of heat exchanger 200 by the 3rd connecting pipe 600, the 3rd connection
Pipeline 600 is located at the outside of printed circuit board 100.
Dividing plate 108 is provided with micro- spray chamber body 107, cooling medium entrance 110 and cooling medium outlet 111 are located at respectively
The both sides of dividing plate 108, dividing plate 108 are provided with dividing plate via 109, as shown in Figure 2.
The heat conduction film 104 is Diamond Films With High Thermal Conductivity.
Array soldered ball 102, chip 105, substrate 103, heat conducting film 104, mould plastic-sealed body 106, micro- spray chamber body 107, dividing plate
108th, dividing plate via 109, cooling medium entrance 110 and cooling medium outlet 111 are collectively referred to as BGA package 700.
Flush type chip 105 is by Flip chip to soldered ball 102, to improve the reliability of chip 103, in flush type
Underfill is filled between chip and chip, micro- spray cooling medium uses deionized water or liquid metal, passes through cooling pump 200
Pressurised driving, deionized water or liquid metal is set to flow through cooling medium entrance 110 and enter in micro- spray chamber body 107, in order that burying
When entering formula chip operation, uniformity of temperature profile, avoid part from focus occur, contains a dividing plate 108 in spray chamber body, if having on dividing plate
Dry dividing plate via 109, deionized water or liquid metal uniformly in the lower cavity plate of micro- spray chamber body, absorb flush type through via
After the heated cooling of heat caused by chip 103, ionized water or liquid metal, 300 from cooling medium outlet return to heat exchanger,
Heat convection is carried out by heat exchanger 300 and surrounding air, completes a circulation.
Claims (3)
1. a kind of heat abstractor for flush type chip bga, including printed circuit board, it is characterized in that, the printing electricity
The inside of road plate is provided with mould plastic-sealed body, heat conduction film and the micro- spray chamber body that order is set, and the molding envelope is provided with array in vivo
Soldered ball and the substrate being attached thereto, chip are embedded with substrate, micro- spray chamber body is provided with cooling medium entrance and cooling medium
Outlet, medium inlet and cooling medium outlet are connected with the cooling pump outside printed circuit board and heat exchanger respectively.
2. the heat abstractor according to claim 1 for flush type chip bga, it is characterized in that, micro- spray chamber
Dividing plate is provided with vivo, and cooling medium entrance and cooling medium outlet are located at the both sides of dividing plate respectively, and dividing plate is provided with dividing plate via.
3. the heat abstractor according to claim 1 for flush type chip bga, it is characterized in that, the heat conduction is thin
Film is Diamond Films With High Thermal Conductivity.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711121095.2A CN107742621A (en) | 2017-11-14 | 2017-11-14 | A kind of heat abstractor for flush type chip bga |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711121095.2A CN107742621A (en) | 2017-11-14 | 2017-11-14 | A kind of heat abstractor for flush type chip bga |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107742621A true CN107742621A (en) | 2018-02-27 |
Family
ID=61234625
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711121095.2A Pending CN107742621A (en) | 2017-11-14 | 2017-11-14 | A kind of heat abstractor for flush type chip bga |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107742621A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109060865A (en) * | 2018-07-26 | 2018-12-21 | 桂林电子科技大学 | A kind of experimental provision of equivalent heat source |
| CN109323657A (en) * | 2018-08-29 | 2019-02-12 | 桂林电子科技大学 | A method of measurement optical interconnection module key position postwelding alignment offset |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101789408A (en) * | 2010-01-29 | 2010-07-28 | 江苏长电科技股份有限公司 | Upright packaging structure with paddle exposing chip for locking hole heat dissipation block externally connected with heat dissipation plate by raised cylinder |
| CN103489838A (en) * | 2013-10-15 | 2014-01-01 | 北京大学 | Enhanced radiation three-dimensional packaging structure and packaging method for same |
| CN104112726A (en) * | 2014-08-04 | 2014-10-22 | 华进半导体封装先导技术研发中心有限公司 | Heat radiation structure used for BGA (Ball Grid Array) package of flip-chip high-power chip |
| CN105605434A (en) * | 2014-09-22 | 2016-05-25 | 通用电气照明解决方案有限责任公司 | Electrically isolated and thermally radiated LED module |
-
2017
- 2017-11-14 CN CN201711121095.2A patent/CN107742621A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101789408A (en) * | 2010-01-29 | 2010-07-28 | 江苏长电科技股份有限公司 | Upright packaging structure with paddle exposing chip for locking hole heat dissipation block externally connected with heat dissipation plate by raised cylinder |
| CN103489838A (en) * | 2013-10-15 | 2014-01-01 | 北京大学 | Enhanced radiation three-dimensional packaging structure and packaging method for same |
| CN104112726A (en) * | 2014-08-04 | 2014-10-22 | 华进半导体封装先导技术研发中心有限公司 | Heat radiation structure used for BGA (Ball Grid Array) package of flip-chip high-power chip |
| CN105605434A (en) * | 2014-09-22 | 2016-05-25 | 通用电气照明解决方案有限责任公司 | Electrically isolated and thermally radiated LED module |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109060865A (en) * | 2018-07-26 | 2018-12-21 | 桂林电子科技大学 | A kind of experimental provision of equivalent heat source |
| CN109323657A (en) * | 2018-08-29 | 2019-02-12 | 桂林电子科技大学 | A method of measurement optical interconnection module key position postwelding alignment offset |
| CN109323657B (en) * | 2018-08-29 | 2019-10-22 | 桂林电子科技大学 | A method of measurement optical interconnection module key position postwelding alignment offset |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20180227 |