CN109323657B - A method of measurement optical interconnection module key position postwelding alignment offset - Google Patents
A method of measurement optical interconnection module key position postwelding alignment offset Download PDFInfo
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- CN109323657B CN109323657B CN201810995985.4A CN201810995985A CN109323657B CN 109323657 B CN109323657 B CN 109323657B CN 201810995985 A CN201810995985 A CN 201810995985A CN 109323657 B CN109323657 B CN 109323657B
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- interconnection module
- optical interconnection
- key position
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
Abstract
The invention discloses a kind of methods for measuring optical interconnection module key position postwelding alignment offset, it is by will be put into temperature control box after optical interconnection module bottom clamping, apply temperature loading to optical interconnection module to weld, Michelson's interferometer is connected in the cooling and solidifying stage, film viewing screen is reflected back by horizontal glass and index glass respectively by the two beam He-Ne laser that beam splitter separates, so as to cause interference phenomenon, when experiment exemplar measured place is subjected to displacement, it will drive index glass to move together, the optical path difference of reflected two beams laser is caused constantly to change, interference ripple center just has N number of ring to disappear or gush out, the shift value of X and Y-direction at optical interconnection module key position can be calculated further according to formula.This method can calculate optical interconnection module key position post-welding shift magnitude, provide experimental data how to reduce postwelding initial alignment offset for the long-term work of raising optical interconnection module and the critical problem of raising optical interconnection module coupling efficiency.
Description
Technical field
It is specifically a kind of to utilize michelson interferometer measurement light the present invention relates to microelectronics Packaging light network technical field
The method of interconnecting modules key position postwelding alignment offset.
Background technique
" light network " (Optical Interconnect, OI), which refers to, uses photon as information carrier, optical signal source transmitting
Optical signal optical signal is turned by conveying signal receiving end after the devices such as optical coupling element, optical transport medium, then by converter
It is changed to the information of needs, to realize transmitting-transmission-receive process of signal.Light network technique functions are derived from photonic computer
Developmental research, optical scientists J.M.Goodman proposes to be applied to light network technology in large-scale integrated circuit first, to mention
The signal interconnection performance of large-diameter integrated circuit, light network is as a kind of interconnecting method for effectively solving that drawback is electrically interconnected, in recent years
It is concerned in the world, gradually applies to reality, develop as a novel interconnection technique.Traditional electrical interconnection technology is in power
Loss, signaling rate, signal interference distortion, signal decaying and time delay, system radiating etc. there are the problem of seriously
The further development of integrated circuit technique is limited, it is extremely necessary for the exploration of novel interconnection mode.Light network technology is because of it
High spatial time-bandwidth product, electromagnetism interference are strong, interconnection density is high, transmission rate is fast, power loss is low, excellent system dissipates
The advantages that hot, is expected to solve electrical interconnection technology problem encountered.Since optical interconnection module alignment position post-welding shift amount is micro-
It is small, therefore deviating measurement is problem all the time.
There is scholar to carry out correlative study such as document to LCCC solder joint in recent years
[1] Huang Chunyue, Wu Song, Liang Ying wait optical interconnection module alignment offset under temperature loading to analyze section, [J] China Electronics
Learn research institute's journal, 2014,9 (2): 120-124.
[2]Krzysztof Nieweglowski,Klaus-Jugen Wolter.Optical Analysis of
Short-Distance Optical Interconnect on the PCB-Level[C].Proceedings of
2006Electonic Systemintegration Technology Conference.Newyork:IEEE,2006,392-
397.
[3]Fuad E.Doany,Benjamin G.Lee,Daniel M.Kuchta,et at.Terabit/Sec
VCSEL-Based 48-Channel Optical Module Based on Holey CMOS Transceiver IC[J]
.Journal of Lightwave Technology,2013,31(4):672-680.
In above-mentioned three documents to mechanical erection after and thermal cycle working environment in optical interconnection module optical transport alignment
Offset is studied with coupling efficiency, is not analyzed the optical interconnection module alignment offset problem after welding encapsulation.And light
For interconnecting modules in welding encapsulation process, the coefficient of thermal expansion mismatch of substrate and PCB, which will lead to, generates alignment partially at key position
It moves, although brought alignment offset is generally in micron dimension, optical power loss resulting from is possibly even up to
50% or more.Since light network device belongs to system using preceding needing to carry out welding installation, resulting optical path alignment error
Error, can be always present in the later period use process of device, the normal work of long lasting effect optical interconnection system.Therefore, how
It is most important for the long-term working stability for improving optical interconnection module to reduce postwelding initial alignment offset, it has also become further mention
The critical problem of high optical interconnection module coupling efficiency.In this regard, the present invention produces typical optical interconnection module, has devised and be based on
The optical interconnection module postwelding displacement measurement system of Michelson's interferometer, and its postwelding position translation carries out to optical interconnection module
Measurement, result of study can provide experimental data for research optical interconnection module key position postwelding alignment offset.
Summary of the invention
It is an object of the invention to overcome the deficiencies in the prior art, and provide a kind of measurement optical interconnection module key position weldering
The method of alignment offset afterwards, this method can calculate optical interconnection module key position post-welding shift magnitude, how to reduce postwelding
Initial alignment offset is for improving the long-term work of optical interconnection module and improving the critical problem of optical interconnection module coupling efficiency
Experimental data is provided.
Realizing the technical solution of the object of the invention is:
A method of measurement optical interconnection module key position postwelding alignment offset specifically comprises the following steps:
1) it designs and makes tested sample；
2) offset design of measuring system: by Michelson's interferometer, He-Ne laser, beam expander, beam splitter, horizontal glass,
Index glass, control panel, pedestal composition；The index glass is mounted on tested sample；
3) system for detecting temperature designs: J-type thermocouple terminal anode is connected Agilent 34970A data scanner
34901A unit module in the channel CH01-H, cathode connects the channel CH01-L, and end of probe is put in position to be measured, passes through RS232 number
Computer and Agilent 34970A data collector are connected according to line, to the Agilent BenchLink Data on computer
3 software of Logger carries out instrument configuration-channel configuration-trace interval setting-scanning-archives data；
4) reflow welding welding system designs: successively including 1 cubic feet of glass for meeting ball bond temperature curve standard requirements
Glass case, exemplar placement platform, several pieces of 800W flush type far-infrared ceramic heating plate, temperature single-chip computer control system, single-chip microcontroller
System passes through to welding regional temperature induction, control infrared hot plate work, when temperature sensor reaches reflow welding curve requirement
Stop heater plate, otherwise continues to heat, thus the mock standard reflow welding termination process in temperature control box, it is ensured that experimental result number
According to reliable effective；
5) postwelding positional shift measuring system connects: the optical interconnection module actual measurement exemple made is placed in experimental system
In, progress optical interconnection module reflow welding connects to be measured with alignment offset at key position；
6) start measuring system: opening laser switch, adjust the subsequent fine adjustment screw of horizontal glass, make two most strong on film viewing screen
Luminous point is overlapped, then beam expander is gone in optical path, will so occur interference ripple, the mobile interference ripple of same fine adjustment screw on screen
The line heart carries out two-dimensional adjustment to beam expander to visual field suitable position；
7) calculate displacement: record interference ripple center has N number of ring to disappear or gush out, and calculates measured position according to formula
The displacement of the X at place, Y-direction:
In step 1), the exemplar includes printed circuit board (Printed Circuit Board, PCB), soldered ball, coupling
Element and imbedded fiber are closed, the PCB is three layers, and ball grid array soldered ball is located between the PCB of adjacent two layers, optical coupling element
It is located at the center of lower layer PCB, imbedded fiber is located on the PCB of lower layer, and upper layer PCB installs vertical cavity surface emitting laser
(Vertical Cavity Surface Emitting Laser, VCSEL), VCSEL driver, the fixed photoelectricity two of middle layer PCB
Pole pipe detector array (Photodiode array, PD) and PD driver, lower layer PCB are embedded to optical fiber；Upper layer PCB having a size of
27mm × 27mm × 1.52mm, middle layer PCB having a size of 35mm × 35mm × 1.52mm, lower layer PCB having a size of 55mm × 50mm ×
1.52mm, optical coupling element radius is 0.0625mm, optical coupling element length is 2.76mm, and imbedded fiber radius is
0.0625mm, imbedded fiber length are 30mm, and pad radius is 0.3mm, and upper layer soldered ball volume is 0.2mm3, be highly
0.52mm, spacing 1.5mm, lower layer's soldered ball volume are 0.2mm3, be highly 0.48mm, spacing 1.5mm, soldered ball solder is
63Pb37Sn。
In step 2), the He-Ne laser wavelength is 632.8nm.
In step 3), the n- negative electrode material of J-type thermocouple be iron-steel nickel alloy, measurement temperature range be -210~
1200℃；Agilent 34970A data scanner includes 3 modular control flumes, which uses 34901A unit mould
Block, the module possess 20 road TCH test channels, and measurable (sensor of support includes thermocouple, RTD, temperature-sensitive with inversion temperature
Resistance), direct current and alternating voltage, direct current and alternating current, two/four-wire ohm, 11 kinds of different inputs such as frequency and period believe
Number.
In step 4), the welding curve is the JEDEC JESD 51-2 thermal cycling curve for meeting American army mark, by preheating
Area, heat preservation zone, the area Zai Liu and the warm area composition of cooling zone 4.
In step 7), due to 63Pb37Sn solder post-weld phases setting temperature be 183 DEG C, then optical interconnection module exemplar by
183 DEG C be cooled to during room temperature and incubation at room temperature 30 minutes the variation of 280~2080s period X-direction alignment offset amount compared with
It is small, only find out heat preservation whole story instants offset amount.
The beneficial effects of the present invention are: a kind of measurement optical interconnection module key position postwelding alignment offset provided by the invention
Method, in order to accurately obtain post-welding shift amount, herein using michelson interferometry measure, its advantage is that will be difficult to directly survey
Amount offset value by deviate system for measuring quantity be converted into can direct-recording interference ripple variation circle number, passing through formula progress
It calculates, and random error is reduced by the analysis to multiplicating property experimental result.This method with this design tests exemplar,
Several component parts such as offset system for measuring quantity, system for detecting temperature, reflow welding welding system collectively constitute light network post-welding shift
System for measuring quantity makes up the defect of the prior art.
Detailed description of the invention
Fig. 1 is the method flow schematic diagram of embodiment；
Fig. 2 is the structural model schematic diagram of embodiment；
Fig. 3 is the PCB circuit diagram of embodiment；
Fig. 4 is the postwelding exemplar pictorial diagram of embodiment；
Fig. 5 is embodiment system for detecting temperature；
Fig. 6 is embodiment reflow welding welding system；
Fig. 7 is the key position postwelding alignment offset measuring system of embodiment.
Specific embodiment
The present invention is further elaborated with reference to the accompanying drawings and examples, but is not limitation of the invention.
Embodiment:
A method of measurement optical interconnection module key position postwelding alignment offset specifically comprises the following steps, such as Fig. 1 institute
Show:
1) it designs and makes tested sample；
2) offset design of measuring system: by Michelson's interferometer, He-Ne laser, beam expander, beam splitter, horizontal glass,
Index glass, control panel, pedestal composition；The index glass is mounted on tested sample；
3) system for detecting temperature designs: J-type thermocouple terminal anode is connected Agilent 34970A data scanner
34901A unit module in the channel CH01-H, cathode connects the channel CH01-L, and end of probe is put in position to be measured, passes through RS232 number
Computer and Agilent 34970A data collector are connected according to line, to the Agilent BenchLink Data on computer
3 software of Logger carries out instrument configuration-channel configuration-trace interval setting-scanning-archives data；
4) reflow welding welding system designs: successively including 1 cubic feet of glass for meeting ball bond temperature curve standard requirements
Glass case, exemplar placement platform, several pieces of 800W flush type far-infrared ceramic heating plate, temperature single-chip computer control system, single-chip microcontroller
System passes through to welding regional temperature induction, control infrared hot plate work, when temperature sensor reaches reflow welding curve requirement
Stop heater plate, otherwise continues to heat, thus the mock standard reflow welding termination process in temperature control box, it is ensured that experimental result number
According to reliable effective；
5) postwelding positional shift measuring system connects: the optical interconnection module actual measurement exemple made is placed in experimental system
In, progress optical interconnection module reflow welding connects to be measured with alignment offset at key position；
6) start measuring system: opening laser switch, adjust the subsequent fine adjustment screw of horizontal glass, make two most strong on film viewing screen
Luminous point is overlapped, then beam expander is gone in optical path, will so occur interference ripple, the mobile interference ripple of same fine adjustment screw on screen
The line heart carries out two-dimensional adjustment to beam expander to visual field suitable position；
7) calculate displacement: record interference ripple center has N number of ring to disappear or gush out, and calculates measured position according to formula
The displacement of the X at place, Y-direction:
Detailed process is as follows:
(1) it designs and makes experiment exemplar, model structure schematic diagram is as shown in Fig. 2, PCB uses FR-4 epoxy glass cloth
Pressing plate, circuit diagram as shown in figure 3, model upper layer PCB having a size of 27mm × 27mm × 1.52mm, middle layer PCB having a size of 35mm ×
Having a size of 55mm × 50mm × 1.52mm, optical coupling element radius is 0.0625mm, optical coupling by 35mm × 1.52mm, lower layer PCB
Element duration is 2.76mm, and imbedded fiber radius is 0.0625mm, imbedded fiber length is 30mm, and pad radius is
0.3mm, upper layer soldered ball volume are 0.2mm3, highly be 0.52mm, spacing 1.5mm, lower layer's soldered ball volume be 0.2mm3, height
For 0.48mm, spacing 1.5mm, soldered ball solder is 63Pb37Sn；Material object is produced as shown in figure 4, device parameters such as 1 institute of table
Show；
(2) design offset system for measuring quantity, specifically by Michelson's interferometer, He-Ne laser (wavelength X=
632.8nm), beam expander, beam splitter, horizontal glass, index glass (being mounted on tested sample), control panel, pedestal composition；
(3) J-type thermocouple terminal anode is connected Agilent 34970A data scanner by design temperature detection system
34901A unit module in the channel CH01-H, cathode connects the channel CH01-L, and end of probe is put in position to be measured.Pass through RS232 number
Computer and Agilent 34970A data collector are connected according to line, as shown in figure 5, to the Agilent on computer
3 software of BenchLink Data Logger carries out instrument configuration-channel configuration-trace interval setting-scanning-number
According to archive；
(4) reflow welding welding system designs: successively including 1 cubic feet of glass for meeting ball bond temperature curve standard requirements
Glass case, exemplar placement platform, several pieces of 800W flush type far-infrared ceramic heating plate, temperature single-chip computer control system.Single-chip microcontroller
System passes through to welding regional temperature induction, control infrared hot plate work, when temperature sensor reaches reflow welding curve requirement
Stop heater plate, otherwise continues to heat, thus the mock standard reflow welding termination process in temperature control box, it is ensured that experimental result number
According to it is reliable effectively, as shown in Figure 6；
(5) the optical interconnection module actual measurement exemple made is placed in experimental system, carries out optical interconnection module reflow welding
It connects and measures work with alignment offset at key position, as shown in Figure 7；
(6) start measuring system: opening laser switch, adjust the subsequent fine adjustment screw of horizontal glass, make on film viewing screen two most
Hot spot is overlapped, then beam expander is gone in optical path, will so occur interference ripple, the mobile interference wave of same fine adjustment screw on screen
The line line heart can correct illumination non-uniform phenomenon on film viewing screen to beam expander progress two-dimensional adjustment to visual field suitable position, thus
Facilitate observation；Michelson's interferometer belongs to precision optical instrument, need to keep under the low light environment of laboratory using the instrument, room
Strong air flowing inside should be avoided, to keep base platform horizontal and avoid the vibration interference of surrounding objects as far as possible；
(7) calculate displacement: record interference ripple center has N number of ring to disappear or gush out, and calculates institute's location according to formula
Set the displacement at place:
In order to minimize measurement error, X, Y-direction alignment offset amount have respectively carried out 3 groups of experiments measurements, every group of measurement
Experimental situation and operating process are consistent as far as possible, guarantee that experimental data is authentic and valid, and according to postwelding optical interconnection module exemplar
Corresponding finite element analysis model is established, obtains key position X, Y-direction alignment offset amount respectively as shown in table 2, table 3.
1 optical interconnection module main devices list of table
2 X-direction alignment offset amount experimental result of table
3 Y-direction alignment offset amount experimental result of table
Claims (6)
1. a kind of method for measuring optical interconnection module key position postwelding alignment offset, which is characterized in that specifically include following step
It is rapid:
1) it designs and makes tested sample；
2) it offset design of measuring system: by Michelson's interferometer, He-Ne laser, beam expander, beam splitter, horizontal glass, moves
Mirror, control panel, pedestal composition；The index glass is mounted on tested sample；
3) system for detecting temperature designs: by J-type thermocouple terminal anode connection Agilent 34970A data scanner
The channel CH01-H in 34901A unit module, cathode connect the channel CH01-L, and end of probe is put in position to be measured, pass through RS232 data
Line connects computer and Agilent 34970A data collector, to the Agilent BenchLink Data on computer
3 software of Logger carries out instrument configuration-channel configuration-trace interval setting-scanning-archives data；
4) reflow welding welding system design: successively include meet ball bond temperature curve standard requirements 1 cubic feet of glass box,
Exemplar placement platform, several pieces of 800W flush type far-infrared ceramic heating plate, temperature single-chip computer control system, SCM system are logical
It crosses to regional temperature induction is welded, control infrared hot plate work stops adding when temperature sensor reaches reflow welding curve requirement
Hot plate heating, otherwise continues to heat, thus the mock standard reflow welding termination process in temperature control box, it is ensured that experimental result data is reliable
Effectively；
5) postwelding positional shift measuring system connects: the optical interconnection module actual measurement exemple made is placed in experimental system,
Progress optical interconnection module reflow welding connects to be measured with alignment offset at key position；
6) start measuring system: opening laser switch, adjust the subsequent fine adjustment screw of horizontal glass, make two most hot spots on film viewing screen
It is overlapped, then beam expander is gone in optical path, will so occur interference ripple, the mobile interference ripple line heart of same fine adjustment screw on screen
To visual field suitable position, two-dimensional adjustment is carried out to beam expander；
7) calculate displacement: record interference ripple center has N number of ring to disappear or gush out, and is calculated at measured position according to formula
X, the displacement of Y-direction:
2. a kind of method for measuring optical interconnection module key position postwelding alignment offset according to claim 1, feature
It is, in step 1), the exemplar includes printed circuit board, soldered ball, coupling element and imbedded fiber, and the PCB is three
Layer, ball grid array soldered ball are located between the PCB of adjacent two layers, and optical coupling element is located at the center of lower layer PCB, imbedded fiber
It is located on the PCB of lower layer, upper layer PCB installs vertical cavity surface emitting laser, VCSEL driver, fixed two pole of photoelectricity middle layer PCB
Pipe detector array and PD driver, lower layer PCB are embedded to optical fiber；Upper layer PCB is having a size of 27mm × 27mm × 1.52mm, middle layer
PCB is having a size of 55mm × 50mm × 1.52mm, optical coupling element radius having a size of 35mm × 35mm × 1.52mm, lower layer PCB
0.0625mm, optical coupling element length are 2.76mm, and imbedded fiber radius is 0.0625mm, imbedded fiber length is
30mm, pad radius are 0.3mm, and upper layer soldered ball volume is 0.2mm3, highly be 0.52mm, spacing 1.5mm, lower layer's soldered ball body
Product is 0.2mm3, highly be 0.48mm, spacing 1.5mm, soldered ball solder be 63Pb37Sn.
3. a kind of method for measuring optical interconnection module key position postwelding alignment offset according to claim 1, feature
It is, in step 2), the He-Ne laser wavelength is 632.8nm.
4. a kind of method for measuring optical interconnection module key position postwelding alignment offset according to claim 1, feature
Be, in step 3), the n- negative electrode material of J-type thermocouple be iron-steel nickel alloy, measurement temperature range be -210~
1200℃；Agilent 34970A data scanner includes 3 modular control flumes, which uses 34901A unit mould
Block, the module possess 20 road TCH test channels, can measure and inversion temperature, direct current and alternating voltage, direct current and alternating current, two/
Four-wire ohm, frequency and period.
5. a kind of method for measuring optical interconnection module key position postwelding alignment offset according to claim 1, feature
Be, in step 4), the welding curve is the JEDEC JESD 51-2 thermal cycling curve for meeting American army mark, by preheating zone,
Heat preservation zone, the area Zai Liu and the warm area composition of cooling zone 4.
6. a kind of method for measuring optical interconnection module key position postwelding alignment offset according to claim 1, feature
It is, in step 7), since the setting temperature of 63Pb37Sn solder post-weld phases is 183 DEG C, then optical interconnection module exemplar is by 183
DEG C be cooled to room temperature and during incubation at room temperature 30 minutes the variation of 280~2080s period X-direction alignment offset amount it is smaller,
Only find out heat preservation whole story instants offset amount.
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| CN110243522A (en) * | 2019-07-08 | 2019-09-17 | 桂林电子科技大学 | A kind of measuring system and method for solder joint reflow welding postwelding residual stress |
| CN110986792B (en) * | 2019-12-13 | 2021-05-25 | 合肥工业大学 | High-precision detection device and detection method for one-dimensional ball or cone nest array |
| CN112152076A (en) * | 2020-08-14 | 2020-12-29 | 威科赛乐微电子股份有限公司 | Tunable laser chip |
| CN112152077B (en) * | 2020-08-28 | 2023-01-03 | 威科赛乐微电子股份有限公司 | Tunable VCSEL laser chip and manufacturing method thereof |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103658975A (en) * | 2013-12-03 | 2014-03-26 | 张立国 | Laser beam splitting and processing device |
| CN205156864U (en) * | 2015-11-27 | 2016-04-13 | 西安建筑科技大学 | Small displacement measurement device of heat supply pipeline |
| CN105628413A (en) * | 2014-10-30 | 2016-06-01 | 陕西盛迈石油有限公司 | Method for evaluating performance of reflow soldering equipment |
| CN205484926U (en) * | 2016-02-02 | 2016-08-17 | 武汉电信器件有限公司 | Smooth subassembly that interconnects |
| CN205844668U (en) * | 2016-07-15 | 2016-12-28 | 北京大学 | Electric light lumped modulator |
| CN107742621A (en) * | 2017-11-14 | 2018-02-27 | 桂林电子科技大学 | A kind of heat abstractor for flush type chip bga |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020044713A1 (en) * | 2000-10-16 | 2002-04-18 | Henry Hung | Multiple wavelength michelson interferometer |
| US8542365B2 (en) * | 2009-03-23 | 2013-09-24 | The United States Of America, As Represented By The Secretary Of The Navy | Optical MEMS chemical sensor array |
-
2018
- 2018-08-29 CN CN201810995985.4A patent/CN109323657B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103658975A (en) * | 2013-12-03 | 2014-03-26 | 张立国 | Laser beam splitting and processing device |
| CN105628413A (en) * | 2014-10-30 | 2016-06-01 | 陕西盛迈石油有限公司 | Method for evaluating performance of reflow soldering equipment |
| CN205156864U (en) * | 2015-11-27 | 2016-04-13 | 西安建筑科技大学 | Small displacement measurement device of heat supply pipeline |
| CN205484926U (en) * | 2016-02-02 | 2016-08-17 | 武汉电信器件有限公司 | Smooth subassembly that interconnects |
| CN205844668U (en) * | 2016-07-15 | 2016-12-28 | 北京大学 | Electric light lumped modulator |
| CN107742621A (en) * | 2017-11-14 | 2018-02-27 | 桂林电子科技大学 | A kind of heat abstractor for flush type chip bga |
Non-Patent Citations (2)
| Title |
|---|
| Optical Interconnect on the PCB-Level;Krzysztof Nieweglowski等;《Proceedings of 2006Electonic Systemintegration Technology Conference》;20061231;第392-397页 * |
| 压电陶瓷微位移的光干涉测量与控制系统;齐艳强等;《太原理工大学学报》;20180731;第49卷(第4期);第612-6161页 * |
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Application publication date: 20190212 Assignee: Guilin Gaopu Electronic Technology Co.,Ltd. Assignor: GUILIN University OF ELECTRONIC TECHNOLOGY Contract record no.: X2022450000412 Denomination of invention: A Method for Measuring the Alignment Offset of Key Position of Optical Interconnection Module after Welding Granted publication date: 20191022 License type: Common License Record date: 20221227 |