CN109323657A - A method of measurement optical interconnection module key position postwelding alignment offset - Google Patents

A method of measurement optical interconnection module key position postwelding alignment offset Download PDF

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Publication number
CN109323657A
CN109323657A CN201810995985.4A CN201810995985A CN109323657A CN 109323657 A CN109323657 A CN 109323657A CN 201810995985 A CN201810995985 A CN 201810995985A CN 109323657 A CN109323657 A CN 109323657A
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interconnection module
optical interconnection
key position
alignment offset
postwelding
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CN109323657B (en
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黄春跃
王建培
邵良滨
路良坤
何伟
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Guilin University of Electronic Technology
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Guilin University of Electronic Technology
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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01BMEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00Measuring arrangements characterised by the use of optical means
    • G01B11/02Measuring arrangements characterised by the use of optical means for measuring length, width or thickness

Abstract

The invention discloses a kind of methods for measuring optical interconnection module key position postwelding alignment offset, it is by will be put into temperature control box after optical interconnection module bottom clamping, apply temperature loading to optical interconnection module to weld, Michelson's interferometer is connected in the cooling and solidifying stage, film viewing screen is reflected back by horizontal glass and index glass respectively by the two beam He-Ne laser that beam splitter separates, so as to cause interference phenomenon, when experiment exemplar measured place is subjected to displacement, it will drive index glass to move together, the optical path difference of reflected two beams laser is caused constantly to change, interference ripple center just has N number of ring to disappear or gush out, the shift value of X and Y-direction at optical interconnection module key position can be calculated further according to formula.This method can calculate optical interconnection module key position post-welding shift magnitude, provide experimental data how to reduce postwelding initial alignment offset for the long-term work of raising optical interconnection module and the critical problem of raising optical interconnection module coupling efficiency.

Description

A method of measurement optical interconnection module key position postwelding alignment offset
Technical field
It is specifically a kind of to utilize michelson interferometer measurement light the present invention relates to microelectronics Packaging light network technical field The method of interconnecting modules key position postwelding alignment offset.
Background technique
" light network " (Optical Interconnect, OI), which refers to, uses photon as information carrier, optical signal source transmitting Optical signal optical signal is turned by conveying signal receiving end after the devices such as optical coupling element, optical transport medium, then by converter It is changed to the information of needs, to realize transmitting-transmission-receive process of signal.Light network technique functions are derived from photonic computer Developmental research, optical scientists J.M.Goodman proposes to be applied to light network technology in large-scale integrated circuit first, to mention The signal interconnection performance of large-diameter integrated circuit, light network is as a kind of interconnecting method for effectively solving that drawback is electrically interconnected, in recent years It is concerned in the world, gradually applies to reality, develop as a novel interconnection technique.Traditional electrical interconnection technology is in power Loss, signaling rate, signal interference distortion, signal decaying and time delay, system radiating etc. there are the problem of seriously The further development of integrated circuit technique is limited, it is extremely necessary for the exploration of novel interconnection mode.Light network technology is because of it High spatial time-bandwidth product, electromagnetism interference are strong, interconnection density is high, transmission rate is fast, power loss is low, excellent system dissipates The advantages that hot, is expected to solve electrical interconnection technology problem encountered.Since optical interconnection module alignment position post-welding shift amount is micro- It is small, therefore deviating measurement is problem all the time.
There is scholar to carry out correlative study such as document to LCCC solder joint in recent years
[1] Huang Chunyue, Wu Song, Liang Ying wait optical interconnection module alignment offset under temperature loading to analyze section of [J] China Electronics Learn research institute's journal, 2014,9 (2): 120-124.
[2]Krzysztof Nieweglowski,Klaus-Jugen Wolter.Optical Analysis of Short-Distance Optical Interconnect on the PCB-Level[C].Proceedings of 2006Electonic Systemintegration Technology Conference.Newyork:IEEE,2006,392- 397.
[3]Fuad E.Doany,Benjamin G.Lee,Daniel M.Kuchta,et at.Terabit/Sec VCSEL-Based 48-Channel Optical Module Based on Holey CMOS Transceiver IC[J] .Journal of Lightwave Technology,2013,31(4):672-680.
In above-mentioned three documents to mechanical erection after and thermal cycle working environment in optical interconnection module optical transport alignment Offset is studied with coupling efficiency, is not analyzed the optical interconnection module alignment offset problem after welding encapsulation.And light For interconnecting modules in welding encapsulation process, the coefficient of thermal expansion mismatch of substrate and PCB, which will lead to, generates alignment partially at key position It moves, although brought alignment offset is generally in micron dimension, optical power loss resulting from is possibly even up to 50% or more.Since light network device belongs to system using preceding needing to carry out welding installation, resulting optical path alignment error Error, can be always present in the later period use process of device, the normal work of long lasting effect optical interconnection system.Therefore, how It is most important for the long-term working stability for improving optical interconnection module to reduce postwelding initial alignment offset, it has also become further mention The critical problem of high optical interconnection module coupling efficiency.In this regard, the present invention produces typical optical interconnection module, has devised and be based on The optical interconnection module postwelding displacement measurement system of Michelson's interferometer, and its postwelding position translation carries out to optical interconnection module Measurement, result of study can provide experimental data for research optical interconnection module key position postwelding alignment offset.
Summary of the invention
It is an object of the invention to overcome the deficiencies in the prior art, and provide a kind of measurement optical interconnection module key position weldering The method of alignment offset afterwards, this method can calculate optical interconnection module key position post-welding shift magnitude, how to reduce postwelding Initial alignment offset is for improving the long-term work of optical interconnection module and improving the critical problem of optical interconnection module coupling efficiency Experimental data is provided.
Realizing the technical solution of the object of the invention is:
A method of measurement optical interconnection module key position postwelding alignment offset specifically comprises the following steps:
1) it designs and makes tested sample;
2) offset design of measuring system: by Michelson's interferometer, He-Ne laser, beam expanding lens, beam splitter, horizontal glass, Index glass, control panel, pedestal composition;The index glass is mounted on tested sample;
3) system for detecting temperature designs: J-type thermocouple terminal anode is connected Agilent 34970A data scanner 34901A unit module in the channel CH01-H, cathode connects the channel CH01-L, and end of probe is put in position to be measured, passes through RS232 number Computer and Agilent 34970A data collector are connected according to line, to the Agilent BenchLink Data on computer 3 software of Logger carries out instrument configuration-channel configuration-trace interval setting-scanning-archives data;
4) reflow welding welding system designs: successively including 1 cubic feet of glass for meeting ball bond temperature curve standard requirements Glass case, exemplar placement platform, several pieces of 800W flush type far-infrared ceramic heating plate, temperature single-chip computer control system, single-chip microcontroller System passes through to welding regional temperature induction, control infrared hot plate work, when temperature sensor reaches reflow welding curve requirement Stop heater plate, otherwise continues to heat, thus the mock standard reflow welding termination process in temperature control box, it is ensured that experimental result number According to reliable effective;
5) postwelding positional shift measuring system connects: the optical interconnection module actual measurement exemple made is placed in experimental system In, progress optical interconnection module reflow welding connects to be measured with alignment offset at key position;
6) start measuring system: opening laser switch, adjust the subsequent fine adjustment screw of horizontal glass, make two most strong on film viewing screen Luminous point is overlapped, then beam expander is gone in optical path, will so occur interference ripple, the mobile interference ripple of same fine adjustment screw on screen The line heart carries out two-dimensional adjustment to beam expander to visual field suitable position;
7) calculate displacement: record interference ripple center has N number of ring to disappear or gush out, and calculates measured position according to formula The displacement of the X at place, Y-direction:
In step 1), the exemplar includes printed circuit board (Printed Circuit Board, PCB), soldered ball, coupling Element and imbedded fiber are closed, the PCB is three layers, and ball grid array soldered ball is located between the PCB of adjacent two layers, optical coupling element It is located at the center of lower layer PCB, imbedded fiber is located on the PCB of lower layer, and upper layer PCB installs vertical cavity surface emitting laser (Vertical Cavity Surface Emitting Laser, VCSEL), VCSEL driver, the fixed photoelectricity two of middle layer PCB Pole pipe detector array (Photodiode array, PD) and PD driver, lower layer PCB are embedded to optical fiber;Upper layer PCB having a size of 27mm × 27mm × 1.52mm, middle layer PCB having a size of 35mm × 35mm × 1.52mm, lower layer PCB having a size of 55mm × 50mm × 1.52mm, optical coupling element radius is 0.0625mm, optical coupling element length is 2.76mm, and imbedded fiber radius is 0.0625mm, imbedded fiber length are 30mm, and pad radius is 0.3mm, and upper layer soldered ball volume is 0.2mm3, be highly 0.52mm, spacing 1.5mm, lower layer's soldered ball volume are 0.2mm3, be highly 0.48mm, spacing 1.5mm, soldered ball solder is 63Pb37Sn。
In step 2), the He-Ne laser wavelength is 632.8nm.
In step 3), the n- negative electrode material of J-type thermocouple be iron-steel nickel alloy, measurement temperature range be -210~ 1200℃;Agilent 34970A data scanner includes 3 modular control flumes, which uses 34901A unit mould Block, the module possess 20 road TCH test channels, and measurable (sensor of support includes thermocouple, RTD, temperature-sensitive with inversion temperature Resistance), direct current and alternating voltage, direct current and alternating current, two/four-wire ohm, input different in frequency and the period etc. 11 believe Number.
In step 4), the welding curve is the JEDEC JESD 51-2 thermal cycling curve for meeting American army mark, by preheating Area, heat preservation zone, the area Zai Liu and the warm area composition of cooling zone 4.
In step 7), due to 63Pb37Sn solder post-weld phases setting temperature be 183 DEG C, then optical interconnection module exemplar by 183 DEG C be cooled to during room temperature and incubation at room temperature 30 minutes the variation of 280~2080s period X-direction alignment offset amount compared with It is small, only find out heat preservation whole story instants offset amount.
The beneficial effects of the present invention are: a kind of measurement optical interconnection module key position postwelding alignment offset provided by the invention Method, in order to accurately obtain post-welding shift amount, herein using michelson interferometry measure, its advantage is that will be difficult to directly survey Amount offset value by deviate system for measuring quantity be converted into can direct-recording interference ripple variation circle number, passing through formula progress It calculates, and random error is reduced by the analysis to multiplicating property experimental result.This method with this design tests exemplar, Several component parts such as offset system for measuring quantity, system for detecting temperature, reflow welding welding system collectively constitute light network post-welding shift System for measuring quantity makes up the defect of the prior art.
Detailed description of the invention
Fig. 1 is the method flow schematic diagram of embodiment;
Fig. 2 is the structural model schematic diagram of embodiment;
Fig. 3 is the PCB circuit diagram of embodiment;
Fig. 4 is the postwelding exemplar pictorial diagram of embodiment;
Fig. 5 is embodiment system for detecting temperature;
Fig. 6 is embodiment reflow welding welding system;
Fig. 7 is the key position postwelding alignment offset measuring system of embodiment.
Specific embodiment
The present invention is further elaborated with reference to the accompanying drawings and examples, but is not limitation of the invention.
Embodiment:
A method of measurement optical interconnection module key position postwelding alignment offset specifically comprises the following steps, such as Fig. 1 institute Show:
1) it designs and makes tested sample;
2) offset design of measuring system: by Michelson's interferometer, He-Ne laser, beam expanding lens, beam splitter, horizontal glass, Index glass, control panel, pedestal composition;The index glass is mounted on tested sample;
3) system for detecting temperature designs: J-type thermocouple terminal anode is connected Agilent 34970A data scanner 34901A unit module in the channel CH01-H, cathode connects the channel CH01-L, and end of probe is put in position to be measured, passes through RS232 number Computer and Agilent 34970A data collector are connected according to line, to the Agilent BenchLink Data on computer 3 software of Logger carries out instrument configuration-channel configuration-trace interval setting-scanning-archives data;
4) reflow welding welding system designs: successively including 1 cubic feet of glass for meeting ball bond temperature curve standard requirements Glass case, exemplar placement platform, several pieces of 800W flush type far-infrared ceramic heating plate, temperature single-chip computer control system, single-chip microcontroller System passes through to welding regional temperature induction, control infrared hot plate work, when temperature sensor reaches reflow welding curve requirement Stop heater plate, otherwise continues to heat, thus the mock standard reflow welding termination process in temperature control box, it is ensured that experimental result number According to reliable effective;
5) postwelding positional shift measuring system connects: the optical interconnection module actual measurement exemple made is placed in experimental system In, progress optical interconnection module reflow welding connects to be measured with alignment offset at key position;
6) start measuring system: opening laser switch, adjust the subsequent fine adjustment screw of horizontal glass, make two most strong on film viewing screen Luminous point is overlapped, then beam expander is gone in optical path, will so occur interference ripple, the mobile interference ripple of same fine adjustment screw on screen The line heart carries out two-dimensional adjustment to beam expander to visual field suitable position;
7) calculate displacement: record interference ripple center has N number of ring to disappear or gush out, and calculates measured position according to formula The displacement of the X at place, Y-direction:
Detailed process is as follows:
(1) it designs and makes experiment exemplar, model structure schematic diagram is as shown in Fig. 2, PCB uses FR-4 epoxy glass cloth Pressing plate, circuit diagram as shown in figure 3, model upper layer PCB having a size of 27mm × 27mm × 1.52mm, middle layer PCB having a size of 35mm × Having a size of 55mm × 50mm × 1.52mm, optical coupling element radius is 0.0625mm, optical coupling by 35mm × 1.52mm, lower layer PCB Element duration is 2.76mm, and imbedded fiber radius is 0.0625mm, imbedded fiber length is 30mm, and pad radius is 0.3mm, upper layer soldered ball volume are 0.2mm3, highly be 0.52mm, spacing 1.5mm, lower layer's soldered ball volume be 0.2mm3, height For 0.48mm, spacing 1.5mm, soldered ball solder is 63Pb37Sn;Material object is produced as shown in figure 4, device parameters such as 1 institute of table Show;
(2) design offset system for measuring quantity, specifically by Michelson's interferometer, He-Ne laser (wavelength X= 632.8nm), beam expanding lens, beam splitter, horizontal glass, index glass (being mounted on tested sample), control panel, pedestal composition;
(3) J-type thermocouple terminal anode is connected Agilent 34970A data scanner by design temperature detection system 34901A unit module in the channel CH01-H, cathode connects the channel CH01-L, and end of probe is put in position to be measured.Pass through RS232 number Computer and Agilent 34970A data collector are connected according to line, as shown in figure 5, to the Agilent on computer 3 software of BenchLink Data Logger carries out instrument configuration-channel configuration-trace interval setting-scanning-number According to archive;
(4) reflow welding welding system designs: successively including 1 cubic feet of glass for meeting ball bond temperature curve standard requirements Glass case, exemplar placement platform, several pieces of 800W flush type far-infrared ceramic heating plate, temperature single-chip computer control system.Single-chip microcontroller System passes through to welding regional temperature induction, control infrared hot plate work, when temperature sensor reaches reflow welding curve requirement Stop heater plate, otherwise continues to heat, thus the mock standard reflow welding termination process in temperature control box, it is ensured that experimental result number According to it is reliable effectively, as shown in Figure 6;
(5) the optical interconnection module actual measurement exemple made is placed in experimental system, carries out optical interconnection module reflow welding It connects and measures work with alignment offset at key position, as shown in Figure 7;
(6) start measuring system: opening laser switch, adjust the subsequent fine adjustment screw of horizontal glass, make on film viewing screen two most Hot spot is overlapped, then beam expander is gone in optical path, will so occur interference ripple, the mobile interference wave of same fine adjustment screw on screen The line line heart can correct illumination non-uniform phenomenon on film viewing screen to beam expander progress two-dimensional adjustment to visual field suitable position, thus Facilitate observation;Michelson's interferometer belongs to precision optical instrument, need to keep under the low light environment of laboratory using the instrument, room Strong air flowing inside should be avoided, to keep base platform horizontal and avoid the vibration interference of surrounding objects as far as possible;
(7) calculate displacement: record interference ripple center has N number of ring to disappear or gush out, and calculates institute's location according to formula Set the displacement at place:
In order to minimize measurement error, X, Y-direction alignment offset amount have respectively carried out 3 groups of experiments measurements, every group of measurement Experimental situation and operating process are consistent as far as possible, guarantee that experimental data is authentic and valid, and according to postwelding optical interconnection module exemplar Corresponding finite element analysis model is established, obtains key position X, Y-direction alignment offset amount respectively as shown in table 2, table 3.
1 optical interconnection module main devices list of table
2 X-direction alignment offset amount experimental result of table
3 Y-direction alignment offset amount experimental result of table

Claims (6)

1. a kind of method for measuring optical interconnection module key position postwelding alignment offset, which is characterized in that specifically include following step It is rapid:
1) it designs and makes tested sample;
2) it offset design of measuring system: by Michelson's interferometer, He-Ne laser, beam expanding lens, beam splitter, horizontal glass, moves Mirror, control panel, pedestal composition;The index glass is mounted on tested sample;
3) system for detecting temperature designs: by J-type thermocouple terminal anode connection Agilent 34970A data scanner The channel CH01-H in 34901A unit module, cathode connect the channel CH01-L, and end of probe is put in position to be measured, pass through RS232 data Line connects computer and Agilent 34970A data collector, to the Agilent BenchLink Data on computer 3 software of Logger carries out instrument configuration-channel configuration-trace interval setting-scanning-archives data;
4) reflow welding welding system design: successively include meet ball bond temperature curve standard requirements 1 cubic feet of glass box, Exemplar placement platform, several pieces of 800W flush type far-infrared ceramic heating plate, temperature single-chip computer control system, SCM system are logical It crosses to regional temperature induction is welded, control infrared hot plate work stops adding when temperature sensor reaches reflow welding curve requirement Hot plate heating, otherwise continues to heat, thus the mock standard reflow welding termination process in temperature control box, it is ensured that experimental result data is reliable Effectively;
5) postwelding positional shift measuring system connects: the optical interconnection module actual measurement exemple made is placed in experimental system, Progress optical interconnection module reflow welding connects to be measured with alignment offset at key position;
6) start measuring system: opening laser switch, adjust the subsequent fine adjustment screw of horizontal glass, make two most hot spots on film viewing screen It is overlapped, then beam expander is gone in optical path, will so occur interference ripple, the mobile interference ripple line heart of same fine adjustment screw on screen To visual field suitable position, two-dimensional adjustment is carried out to beam expander;
7) calculate displacement: record interference ripple center has N number of ring to disappear or gush out, and is calculated at measured position according to formula X, the displacement of Y-direction:
2. a kind of method for measuring optical interconnection module key position postwelding alignment offset according to claim 1, feature It is, in step 1), the exemplar includes printed circuit board (Printed Circuit Board, PCB), soldered ball, coupling member Part and imbedded fiber, the PCB are three layers, and ball grid array soldered ball is located between the PCB of adjacent two layers, and optical coupling element is located at The center of lower layer PCB, imbedded fiber are located on the PCB of lower layer, and upper layer PCB installs vertical cavity surface emitting laser (Vertical Cavity Surface Emitting Laser, VCSEL), VCSEL driver, the fixed photoelectricity two of middle layer PCB Pole pipe detector array (Photodiode array, PD) and PD driver, lower layer PCB are embedded to optical fiber;Upper layer PCB having a size of 27mm × 27mm × 1.52mm, middle layer PCB having a size of 35mm × 35mm × 1.52mm, lower layer PCB having a size of 55mm × 50mm × 1.52mm, optical coupling element radius is 0.0625mm, optical coupling element length is 2.76mm, and imbedded fiber radius is 0.0625mm, imbedded fiber length are 30mm, and pad radius is 0.3mm, and upper layer soldered ball volume is 0.2mm3, be highly 0.52mm, spacing 1.5mm, lower layer's soldered ball volume are 0.2mm3, be highly 0.48mm, spacing 1.5mm, soldered ball solder is 63Pb37Sn。
3. a kind of method for measuring optical interconnection module key position postwelding alignment offset according to claim 1, feature It is, in step 2), the He-Ne laser wavelength is 632.8nm.
4. a kind of method for measuring optical interconnection module key position postwelding alignment offset according to claim 1, feature Be, in step 3), the n- negative electrode material of J-type thermocouple be iron-steel nickel alloy, measurement temperature range be -210~ 1200℃;Agilent 34970A data scanner includes 3 modular control flumes, which uses 34901A unit mould Block, the module possess 20 road TCH test channels, can measure and inversion temperature, direct current and alternating voltage, direct current and alternating current, two/ Different input signal in four-wire ohm, frequency and period etc. 11.
5. a kind of method for measuring optical interconnection module key position postwelding alignment offset according to claim 1, feature Be, in step 4), the welding curve is the JEDEC JESD 51-2 thermal cycling curve for meeting American army mark, by preheating zone, Heat preservation zone, the area Zai Liu and the warm area composition of cooling zone 4.
6. a kind of method for measuring optical interconnection module key position postwelding alignment offset according to claim 1, feature It is, in step 7), since the setting temperature of 63Pb37Sn solder post-weld phases is 183 DEG C, then optical interconnection module exemplar is by 183 DEG C be cooled to room temperature and during incubation at room temperature 30 minutes the variation of 280~2080s period X-direction alignment offset amount it is smaller, Only find out heat preservation whole story instants offset amount.
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CN112152077A (en) * 2020-08-28 2020-12-29 威科赛乐微电子股份有限公司 Tunable VCSEL laser chip and manufacturing method thereof

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CN112152077A (en) * 2020-08-28 2020-12-29 威科赛乐微电子股份有限公司 Tunable VCSEL laser chip and manufacturing method thereof

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