CN114005803A - Integrated embedded micro-channel heat dissipation system and method of micro-system - Google Patents
Integrated embedded micro-channel heat dissipation system and method of micro-system Download PDFInfo
- Publication number
- CN114005803A CN114005803A CN202111277438.0A CN202111277438A CN114005803A CN 114005803 A CN114005803 A CN 114005803A CN 202111277438 A CN202111277438 A CN 202111277438A CN 114005803 A CN114005803 A CN 114005803A
- Authority
- CN
- China
- Prior art keywords
- micro
- heat dissipation
- chip
- channel
- dissipation system
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention discloses an integrated embedded micro-channel heat dissipation system and method of a micro-system, and the integrated embedded micro-channel heat dissipation system comprises a packaging substrate, wherein a packaging shell is connected onto the packaging substrate, a chip and a silicon adapter plate are arranged in an inner cavity of the packaging shell, pins of the silicon adapter plate are electrically interconnected with the packaging substrate, a plurality of micro-bumps are connected between the silicon adapter plate and the chip, adjacent micro-bumps are not in contact with each other, the micro-bumps and the inner wall of the packaging shell are not in contact with each other, an embedded micro-channel is formed at intervals between the micro-bumps and the inner wall of the packaging shell, a liquid supply pipe is connected to one side of the embedded micro-channel, a liquid return pipe is connected to the other side of the embedded micro-channel, the liquid supply pipe is used for outputting a cooling working medium, and the liquid return pipe is used for receiving the cooling working medium after heat exchange. The whole liquid cooling heat dissipation system ensures high-efficiency heat dissipation and simultaneously realizes light weight and miniaturization of the heat dissipation system.
Description
Technical Field
The invention belongs to the technical field of chip heat dissipation, and particularly belongs to an integrated embedded micro-channel heat dissipation system and method of a micro-system.
Background
The high-performance chip is used as an important base stone in high-tech fields such as industrial control, big data, information communication, national defense military industry, aerospace and the like, and has profound influence on transformation and optimization upgrading of industrial structures in China. At present, the development of the chip industry in China still faces a plurality of difficulties, and besides the chip design and manufacturing technology, the heat management technology becomes a key bottleneck for restricting the development of related industries in China. Over the last decades, the number of circuits integrated per unit area of a chip has continuously increased due to the constant evolution of microelectronic technology. The performance is improved, meanwhile, the heating value of the unit area is also improved, and if insufficient heat dissipation is caused, the temperature of the chip is too high, so that the service life and the operation efficiency of the chip are influenced. According to the prediction made by part of mechanisms, the average heat flow density generated by the next generation chip under the normal working state reaches 500W/cm2The heat flow density of the local hot spot reaches 1000W/cm2The limits of conventional thermal management techniques have been exceeded.
The microsystem based on the three-dimensional stereo integration technology adopts the TSV technology to realize high-density packaging of chip lamination through a vertical interconnection mode, the application of the microsystem in the microelectronics industry is more and more extensive, and a series of heat management problems are brought along with the improvement of the internal power density of the highly integrated microsystem packaging and the increase of the number of stacked chips. Aiming at the heat dissipation requirement of a micro-system chip under high heat flux density, the embedded micro-channel liquid cooling heat dissipation system is an effective solution. Such systems typically embed a micro-scale channel heat exchanger above the chip, apply external force through bayonets, screws, etc. to press the heat absorbing surface of the heat exchanger against the heat emitting surface of the chip, and fill insulating and heat conducting material between the chip and the contact surface of the heat exchanger to reduce thermal resistance. When the chip works, the generated heat is conducted to the micro-scale channel heat exchanger, the liquid cooling working medium enters the micro-scale channel heat exchanger to absorb heat under the driving of the infusion pump and then flows into the radiator to be cooled, and the circulation work is carried out. Thereby maintaining the temperature of the chip, ensuring the normal work of the chip and reducing the concentration of thermal stress.
The main components of the existing embedded micro-channel liquid cooling heat dissipation system comprise a liquid cooling pump, a micro-channel, a radiator and a liquid supply/return pipeline. In order to ensure good liquid cooling heat dissipation efficiency, the heating end and the condensation end are separated usually, so that the distance between the liquid cooling pump, the micro-channel heat exchanger and the radiator is far, the system complexity is increased, the problems of high system quality and large volume exist, and in addition, the product needs an additional liquid cooling pump provided by the system externally when applied, so that the limitation of product application is increased. Therefore, while ensuring efficient heat dissipation, it is necessary to optimize the structure of the heat dissipation system, reduce the number of components, shorten the length of the pipeline, and achieve light weight and miniaturization of the heat dissipation system.
Disclosure of Invention
In order to solve the problems in the prior art, the invention provides an integrated embedded micro-channel heat dissipation system and method of a micro-system, and solves the problems of large number of components, complex pipelines, large system mass and volume and product application limitation of the conventional micro-channel liquid cooling heat dissipation system.
In order to achieve the purpose, the invention provides the following technical scheme: the utility model provides an integrated embedded microchannel cooling system of integration of microsystem, includes packaging substrate, the last packaging shell that is connected with of packaging substrate, be equipped with chip and silicon keysets in packaging shell's the inner chamber, the pin and the packaging substrate circuit interconnection of silicon keysets, be connected with a plurality of little bump between silicon keysets and the chip, all do not contact between the adjacent little bump and between the inner wall of little bump and packaging shell, form airtight space through the silicon wall shape between little bump and the packaging shell inner wall, airtight space is embedded microchannel, one side of embedded microchannel has connect the feed pipe, embedded microchannel's opposite side has connect back the liquid pipe, the feed pipe is used for exporting the cooling medium, it is used for receiving the cooling medium after the heat transfer to return the liquid pipe.
Furthermore, the micro-bumps are located at the bottom of the chip, a micro pump is arranged at the top of the chip and connected to the wall surface of the packaging shell, a cooling working medium outlet of the micro pump is connected with an inlet of the liquid supply pipe, an outlet of the liquid supply pipe is connected to one side of the embedded micro channel, and a recovery inlet of the micro pump is connected with the liquid return pipe.
Furthermore, the micropump is also connected with an external radiator, and the external radiator is used for cooling the cooling working medium in the micropump.
Furthermore, the top of the chip is also provided with a buffer pad, the buffer pad is positioned between the chip and the micropump, and the micropump is also fixedly connected with the buffer pad.
Furthermore, the buffer pad adopts the silica gel pad.
Furthermore, the chip and the silicon adapter plate are electrically interconnected through the TSV through holes.
Furthermore, a first solder ball is connected to a pin of the silicon adapter plate, and the silicon adapter plate is interconnected with the packaging substrate circuit through the first solder ball.
Furthermore, filling glue is filled between the silicon adapter plate and the packaging substrate.
Furthermore, the micro-bumps are second solder balls, and the second solder balls are connected with the chip and the silicon adapter plate in a welding mode.
The invention also provides a heat dissipation method of the integrated embedded micro-channel heat dissipation system of the micro-system, which comprises the following steps: the liquid supply pipe inputs a cooling working medium to the embedded micro-channel, heat generated by the chip during working is directly conducted to the cooling working medium through the bottom of the chip and conducted to the cooling working medium through the micro-bumps, the cooling working medium enters the liquid return pipe after convective heat transfer, and the heat dissipation process of the micro-channel heat dissipation system is achieved by circulating the processes.
Compared with the prior art, the invention has at least the following beneficial effects:
the invention also provides an integrated embedded micro-channel heat dissipation system of the micro-system, and the main components of the existing embedded micro-channel liquid cooling heat dissipation system comprise a liquid cooling pump, a micro-channel, a radiator and a liquid supply/return pipeline, so that the problems of complex structure and large system mass and volume exist. The liquid cooling channel integrated design is formed by the liquid supply pipe, the liquid return pipe, the chip and the silicon adapter plate, so that the number of parts of the system is reduced, and meanwhile, the length of the liquid cooling pipeline is shortened. The chip and the silicon adapter plate are interconnected through the micro-bumps, an embedded micro-channel is formed by utilizing the space between the micro-bumps, a liquid cooling loop is formed through the liquid supply pipe and the liquid return pipe, and finally the embedded micro-channel liquid cooling heat dissipation system is formed. Compared with the traditional design, the invention does not need to additionally install a microchannel device. Compared with the traditional design, the whole liquid cooling heat dissipation system of the invention reduces the whole mass and volume of the system and realizes the light weight and miniaturization of the heat dissipation system while ensuring high-efficiency heat dissipation, and in addition, the invention does not need to additionally install a liquid cooling pump, thereby expanding the application range of the embedded micro-channel heat dissipation system in the application of micro-system engineering.
Furthermore, the micropump simultaneously takes on the functions of the liquid cooling pump and the radiating cover plate, so that the number of parts of the system is reduced, and the length of a liquid cooling pipeline is shortened. And the micro pump enables the invention to realize high-efficiency heat dissipation of a high-power chip in the micro system without additionally installing a liquid-cooled pump, thereby reducing the overall mass and volume of the system and realizing light weight and miniaturization of a heat dissipation system.
Furthermore, the cooling working medium flowing back into the micro pump carries out heat convection through an external radiator used when the cooling working medium is applied to the micro system in a plate level mode, absorbed heat is dissipated into the system heat dissipation environment to achieve cooling, and the working cycle is completed. Is convenient and quick.
Furthermore, the buffer cushion has insulation, thermal-insulated and damping function concurrently, and the micropump is fixed on the buffer cushion, and the buffer cushion can reduce the chip and to micropump heat conduction to the vibration of buffering micropump during operation is in order to protect the chip.
Furthermore, the silicon adapter plate is connected with the packaging substrate through the first solder balls and the filling adhesive, so that the stability and the reliability of the whole micro-channel heat dissipation system are improved.
Drawings
FIG. 1 is a schematic structural diagram of an integrated embedded micro-channel heat dissipation system according to the present invention;
FIG. 2 is a heat dissipation path diagram of an integrated embedded micro-channel heat dissipation system;
in the drawings: the chip packaging structure comprises a packaging substrate 1, an embedded microchannel 2, a first solder ball 3, a silicon adapter plate 4, a chip 5, a cushion pad 6, a liquid return pipe 7, a micropump 8, a liquid supply pipe 9, a microbump 10, a packaging shell 11 and a filling adhesive 12.
Detailed Description
The invention is further described with reference to the following figures and detailed description.
As shown in fig. 1 and 2, the invention provides an integrated embedded micro-channel heat dissipation system of a micro-system, which integrates a liquid cooling channel by a micro-pump 8 and a chip 5, and the micro-pump 8 simultaneously takes on the functions of the liquid cooling pump and a heat dissipation cover plate, thereby reducing the number of components of the system and shortening the length of the liquid cooling pipeline. The chip 5 and the silicon adapter plate 4 are interconnected through the micro-bumps 10, a closed space is formed between the micro-bumps 10 and the inner wall of the packaging shell through a silicon wall, the closed space is an embedded micro-channel, a liquid cooling loop is formed through the liquid supply pipe 9 and the liquid return pipe 7, and finally the embedded micro-channel 2 liquid cooling heat dissipation system is formed. Compared with the traditional design, the liquid cooling heat dissipation system does not need to be additionally provided with a liquid cooling pump, the whole mass and the volume of the system are reduced while the whole liquid cooling heat dissipation system ensures high-efficiency heat dissipation, and the light weight and the miniaturization of the heat dissipation system are realized.
In the embodiment, the bottom layer is the package substrate 1 of the microsystem, the pins of the silicon adapter plate 4 are interconnected with the circuit on the package substrate 1 through the first solder balls 3 and are fixed on the package substrate 1, the chip 5 and the silicon adapter plate 4 are electrically interconnected through the TSV through holes, and the chip 5 and the silicon adapter plate 4 are interconnected through the micro bumps 10. Wherein, little bump 10 is equipped with a plurality of, and all contactless between the adjacent little bump 10 and between the inner wall of little bump 10 and packaging shell 11, interval between little bump 10 and the packaging shell 11 inner wall forms embedded microchannel 2 to form the liquid cooling return circuit through feed pipe 9 and liquid return pipe 7, one side of embedded microchannel 2 has connect feed pipe 9, embedded microchannel 2's opposite side has connect liquid return pipe 7, feed pipe 9 is used for exporting cooling medium, liquid return pipe 7 is used for receiving the cooling medium after the heat transfer. Finally, an embedded micro-channel liquid cooling heat dissipation system is formed. The heat generated by the chip 5 is conducted to the embedded micro-channel 2 along the bottom of the chip and the micro-bumps 10, and the cooling working medium flowing in the embedded micro-channel 2 generates convection heat exchange to absorb the heat, so that the chip 5 in the micro-system is cooled. Preferably, the micro bump 10 uses a second solder ball.
Preferably, the filling adhesive is filled between the silicon interposer and the package substrate.
Specifically, the whole encapsulation casing 11 that adopts of microsystem module protects, and chip 5, silicon keysets 4 all are located encapsulation casing 11, and the blotter 6 that has insulating, thermal-insulated and damping function concurrently is still installed at the top of chip 5, and micropump 8 is fixed on blotter 6. Preferably, the cushion pad 6 is a silica gel pad, which can reduce the heat conduction from the chip 5 to the micro pump 8 and buffer the vibration of the micro pump 8 during operation to protect the chip 5. The micropump 8 gives consideration to the effect of the packaging cover plate, the micropump 8 and the packaging shell 11 are fixed into a whole, a cooling working medium outlet of the micropump 8 is connected with an inlet of the liquid supply pipe 9, an outlet of the liquid supply pipe 9 is connected to one side of the embedded microchannel 2, a recycling inlet of the micropump 8 is connected with the liquid return pipe 7, the micropump 8 is further connected with an external radiator, and the external radiator is used for cooling the cooling working medium in the micropump 8.
In another embodiment of the present invention, a heat dissipation method for an integrated embedded micro-channel heat dissipation system of a micro-system is further provided, which includes the following steps: the liquid supply pipe 9 inputs a cooling working medium to the embedded micro-channel 2, heat generated by the chip 5 during working is directly transmitted to the cooling working medium through the bottom of the chip 5 and transmitted to the cooling working medium through the micro-bumps 10, the cooling working medium enters the liquid return pipe 7 after heat convection, and the heat dissipation process of the micro-channel heat dissipation system is realized by circulating the processes.
Specifically, the internal flow channel of the micro pump 8 is connected with the embedded micro channel 2 at the bottom of the chip 5 through the liquid supply pipe 9 and the liquid return pipe 7 to form a closed and sealed circulation loop. When the heat dissipation system operates, the micropump 8 outputs liquid cooling working medium under the drive of electric power, the liquid cooling working medium flows into the embedded microchannel 2 through the liquid supply pipeline, heat generated by the work of the chip 5 is absorbed, and the cooling working medium after heat absorption and temperature rise flows back to the micropump 8 through the liquid return pipe 7. The working medium flowing back to the micro pump 8 carries out heat convection through an external radiator used when the working medium is applied to a micro system board level, and absorbed heat is radiated into a system heat dissipation environment to realize cooling, so that the working cycle is completed.
Finally, it should be noted that: the above-mentioned embodiments are only specific embodiments of the present invention, which are used for illustrating the technical solutions of the present invention and not for limiting the same, and the protection scope of the present invention is not limited thereto, although the present invention is described in detail with reference to the foregoing embodiments, those skilled in the art should understand that: any person skilled in the art can modify or easily conceive the technical solutions described in the foregoing embodiments or equivalent substitutes for some technical features within the technical scope of the present disclosure; such modifications, changes or substitutions do not depart from the spirit and scope of the embodiments of the present invention, and they should be construed as being included therein. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.
Claims (10)
1. An integrated embedded micro-channel heat dissipation system of a micro-system is characterized by comprising a packaging substrate (1), wherein a packaging shell (11) is connected onto the packaging substrate (1), a chip (5) and a silicon adapter plate (4) are arranged in an inner cavity of the packaging shell (11), pins of the silicon adapter plate (4) are interconnected with a circuit of the packaging substrate (1), a plurality of micro-bumps (10) are connected between the silicon adapter plate (4) and the chip (5), adjacent micro-bumps (10) and the micro-bumps (10) are not in contact with the inner wall of the packaging shell (11), a closed space is formed between the micro-bumps (10) and the inner wall of the packaging shell (11) through a silicon wall surface, the closed space is an embedded micro-channel (2), a liquid supply pipe (9) is connected to one side of the embedded micro-channel (2), a liquid return pipe (7) is connected to the other side of the embedded micro-channel (2), the liquid supply pipe (9) is used for outputting cooling working media, and the liquid return pipe (7) is used for receiving the cooling working media after heat exchange.
2. The integrated embedded micro-channel heat dissipation system of a micro-system as claimed in claim 1, wherein the micro-bumps (10) are located at the bottom of the chip (5), the micro-pump (8) is disposed at the top of the chip (5), the micro-pump (8) is connected to the wall surface of the package housing (11), the outlet of the cooling medium of the micro-pump (8) is connected to the inlet of the liquid supply pipe (9), the outlet of the liquid supply pipe (9) is connected to one side of the embedded micro-channel (2), and the recycling inlet of the micro-pump (8) is connected to the liquid return pipe (7).
3. The integrated embedded micro-channel heat dissipation system of a micro-system as claimed in claim 2, wherein the micro-pump (8) is further connected to an external heat sink for cooling the cooling medium in the micro-pump (8).
4. The integrated embedded micro-channel heat dissipation system of a micro-system as claimed in claim 2, wherein a buffer pad (6) is further disposed on the top of the chip (5), the buffer pad (6) is located between the chip (5) and the micro-pump (8), and the micro-pump (8) is further fixedly connected to the buffer pad (6).
5. The integrated embedded micro-channel heat dissipation system of micro-system as claimed in claim 4, wherein the cushion pad (6) is a silicone pad.
6. The integrated embedded micro-channel heat dissipation system of a micro-system as claimed in claim 1, wherein the chip (5) and the silicon interposer (4) are electrically interconnected through TSV.
7. The integrated embedded micro-channel heat dissipation system of a micro-system as claimed in claim 1, wherein the pins of the silicon interposer (4) are connected with first solder balls (3), and the silicon interposer (4) is electrically interconnected with the package substrate (1) through the first solder balls (3).
8. The integrated embedded micro-channel heat dissipation system of micro-system as claimed in claim 7, wherein the filling adhesive (12) is filled between the silicon interposer (4) and the package substrate (1).
9. The integrated embedded micro-channel heat dissipation system of a micro-system as claimed in claim 1, wherein the micro-bumps (10) are second solder balls, and the second solder balls and the chip and the silicon interposer (4) are connected by soldering.
10. The method for dissipating heat from a micro-system integrated embedded micro-channel heat dissipation system as recited in any one of claims 1 to 9, comprising the steps of: the liquid supply pipe (9) inputs a cooling working medium to the embedded microchannel (2), heat generated by the chip (5) during working is directly conducted to the cooling working medium through the bottom of the chip (5) and conducted to the cooling working medium through the micro-bumps (10), the cooling working medium enters the liquid return pipe (7) after convective heat transfer, the processes are circulated, and the heat dissipation process of the microchannel heat dissipation system is realized.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111277438.0A CN114005803A (en) | 2021-10-29 | 2021-10-29 | Integrated embedded micro-channel heat dissipation system and method of micro-system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111277438.0A CN114005803A (en) | 2021-10-29 | 2021-10-29 | Integrated embedded micro-channel heat dissipation system and method of micro-system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114005803A true CN114005803A (en) | 2022-02-01 |
Family
ID=79925722
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111277438.0A Pending CN114005803A (en) | 2021-10-29 | 2021-10-29 | Integrated embedded micro-channel heat dissipation system and method of micro-system |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114005803A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115296118A (en) * | 2022-08-12 | 2022-11-04 | 联合微电子中心有限责任公司 | TSV-based on-chip light source module structure |
-
2021
- 2021-10-29 CN CN202111277438.0A patent/CN114005803A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115296118A (en) * | 2022-08-12 | 2022-11-04 | 联合微电子中心有限责任公司 | TSV-based on-chip light source module structure |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP6588654B2 (en) | Working medium contact cooling system for high power components and method of operating the same | |
| US11915996B2 (en) | Microelectronics assembly including top and bottom packages in stacked configuration with shared cooling | |
| CN101146429A (en) | Radiator of electronic device | |
| CN100423243C (en) | Miniature efficient self-circulating electronic cooler | |
| CN218918850U (en) | Integrated circuit element with high-efficiency heat dissipation package | |
| CN109974137B (en) | Air conditioner outdoor unit and air conditioner | |
| JP2012080071A (en) | High power heat radiation module | |
| TWM597382U (en) | Phase change heat dissipation device | |
| CN110062565A (en) | Soaking plate based on thermoelectric cooling technology reinforces server efficient radiating apparatus and method | |
| CN111081665A (en) | Device for heat dissipation of multi-heat-source device | |
| CN208093545U (en) | Large power heat pipe radiator | |
| CN103327792A (en) | Passive-driven micro-channel heat-sink cooling device | |
| CN114005803A (en) | Integrated embedded micro-channel heat dissipation system and method of micro-system | |
| CN104134637B (en) | Radiating structure for high-power logic chip PoP | |
| CN106225539A (en) | A kind of three-dimensional pulsating heat pipe cooling chiller of band flat panel microchannel vaporizer | |
| CN209745070U (en) | Phase change heat dissipation device | |
| WO2020135311A1 (en) | Heat dissipation apparatus and method | |
| CN114530646B (en) | Temperature-consistent power module and radiator design method thereof | |
| CN113448027B (en) | Optical module heat radiation structure, optical module and optical communication equipment | |
| Brunschwiler et al. | Dual-side heat removal by micro-channel cold plate and silicon-interposer with embedded fluid channels | |
| CN220340668U (en) | Dual-cycle liquid cooling device and dual-cycle liquid cooling system | |
| CN217721817U (en) | Heat radiator | |
| Han et al. | Investigation of liquid cooling for data center server based on micro-fluid technology | |
| CN221281507U (en) | Liquid cooling heat dissipation system for multi-blade server and server | |
| CN221175348U (en) | Heat abstractor and server |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |