CN209745070U - Phase change heat dissipation device - Google Patents

Phase change heat dissipation device Download PDF

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Publication number
CN209745070U
CN209745070U CN201920162836.XU CN201920162836U CN209745070U CN 209745070 U CN209745070 U CN 209745070U CN 201920162836 U CN201920162836 U CN 201920162836U CN 209745070 U CN209745070 U CN 209745070U
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condensation
evaporation
cavity
heat
phase change
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CN201920162836.XU
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李纯
胡广帆
姚春红
马秋成
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ZHUZHOU ZHIRE TECHNOLOGY Co Ltd
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ZHUZHOU ZHIRE TECHNOLOGY Co Ltd
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Abstract

The utility model discloses a phase transition heat abstractor, including the inside phase transition subassembly that is provided with phase transition heat transfer medium, wherein, the phase transition subassembly includes evaporation portion and condensation portion, and the inside of evaporation portion has the evaporation chamber, and the inside of condensation portion has the condensation chamber, the evaporation chamber with condensation chamber intercommunication, heating source and evaporation chamber direct contact, phase transition heat transfer medium in the evaporation chamber can absorb the heat that generates heat the source and to the condensation chamber removes, and the condensation chamber outwards gives off the heat to cool off heating source. The utility model discloses an among the phase transition heat abstractor, phase change subassembly and the source direct contact that generates heat need not to increase the heat-conducting plate of transition, and the evaporation portion suits with the appearance in the source that generates heat, and phase change subassembly can be sufficient with the source contact that generates heat, and heat transfer area is big, and the source and the phase transition heat transfer medium's that generates heat difference in temperature is minimum.

Description

Phase change heat dissipation device
Technical Field
The utility model belongs to the technical field of the phase transition heat abstractor, especially, relate to a phase transition heat abstractor of high heat flux density.
Background
With the development of software computing of the internet, the internet of things and the like, the information processing speed of computers, notebooks, servers and the like is required to be faster and faster, and the information storage capacity is required to be larger and larger. CPU and memory power losses are increasing, requiring higher and higher heat flux densities from the heat sinks. In addition, as the power density of the CPU and the memory is increased, the heat flux density of the heat dissipation device is also increased, the conventional heat pipe is limited by the inner diameter of the heat pipe, the phase change heat exchange medium, and the like, and the heat transfer capacity cannot meet the requirements of the development of the CPU and the memory technology.
the traditional copper water heat pipe heat dissipation device and the common fin heat dissipation device cannot meet the heat dissipation requirements, and only a 3D phase change heat dissipation device or a liquid cooling heat dissipation device with higher heat flow density can be adopted. The liquid cooling heat sink requires a liquid cooling device and an external heat exchanger and other peripheral equipment, and is high in cost and complex in maintenance. Direct manufacturers of CPUs seek a breakthrough in heat dissipation technology, and some liquid-cooled heat dissipation devices are tried, but considering that the liquid-cooled heat dissipation devices need complex internal supporting equipment such as a liquid cooling source, a liquid distributor, a quick-change connector and the like, and complex external peripheral heat exchange equipment, and the influence of liquid-cooled leakage risks on the safety of operating equipment, the direct manufacturers of CPUs are not promoted in time.
In a conventional heat dissipating device, a plurality of bent heat pipes are provided in a substrate, and the shape of the heat pipes is different. The conventional heat dissipation device mainly has the following problems and disadvantages.
Firstly, the heat transfer limit of the heat pipe is limited, for the existing CPU of 45mm multiplied by 69mm, 3-4 heat pipes with diameter phi 6 can be placed at most, the process of the heat pipe is very fine and mature, and even the capillary limit of the heat pipe can only reach 40W of the single capillary limit of a single heat pipe with phi 6. Therefore, the conventional heat pipe radiator cannot meet the requirement of heat radiation of the CPU with the heat flow density of more than 600J/(m2 & s). Meanwhile, the increase of the heat dissipation air volume has very limited thermal resistance improvement on the heat dissipation device, the temperature difference between the bottom and the top of the aluminum fin can be increased along with the increase of the air volume, the effective area of the actual heat dissipation device can be reduced, and the reduction of the heat exchange thermal resistance of the heat dissipation device is very limited. Therefore, the heat resistance of the traditional heat pipe heat dissipation device is lower than 0.016K/W, and the surface temperature of the CPU reaches more than 62 ℃ under the condition of 30 ℃ of the ambient temperature.
Secondly, the heat pipe is usually a copper pipe, and the temperature equalization in the heat pipe is realized by utilizing the phase change of deionized water. Due to the layout limitation of the heat pipes, the temperature equalization of the substrate surface contacted with the CPU cannot be completely realized, and the temperature equalization of the aluminum ceramic chip directly contacted with the cooling air cannot be realized. The heat is finally transferred to cooling air through the aluminum fins, and the performance of the traditional heat pipe on the heat dissipation device is improved to a limited extent.
Finally, the shell material of the existing heat pipe is mostly red copper, the substrate material is mostly aluminum alloy, and the gap between the heat pipe and the substrate after forming is filled by low-temperature tin brazing or cementation. The disadvantages of low temperature tin-lead soldering include: before welding, the heat dissipation device needs to be subjected to surface treatment such as nickel plating or copper plating and the like, so that the cost is high due to the welding and the surface treatment, and the environment is polluted; the tin soldering is difficult to ensure that the heat pipe and the aluminum alloy substrate are completely filled in the plane, and no local gap is generated, so that the heat pipe is arranged below the power device, the heat flow density is high, and the gap can cause the local temperature rise of a CPU (Central processing Unit), thereby causing the loss of the device.
SUMMERY OF THE UTILITY MODEL
in order to solve the problems in the prior art, the utility model provides a phase change heat dissipation device to improve heat transfer efficiency, promote the heat to spread fast.
in order to achieve the above object, the utility model discloses a phase transition heat abstractor's concrete technical scheme as follows:
The phase change heat dissipation device comprises a phase change component internally provided with a phase change heat exchange medium, wherein the phase change component comprises an evaporation part and a condensation part, an evaporation cavity is arranged in the evaporation part, a condensation cavity is arranged in the condensation part, the evaporation cavity is communicated with the condensation cavity, a heating source is in direct contact with the evaporation cavity, the phase change heat exchange medium in the evaporation cavity can absorb heat of the heating source and move towards the condensation cavity, and the condensation cavity gives off heat outwards so as to cool the heating source.
Furthermore, the evaporation cavity is a cavity body which is planar, curved or polyhedral and is matched with the shape of the heating source so as to increase the contact area between the heating source and the evaporation cavity.
Further, the evaporation cavity is a thin-wall cavity, the working pressure inside the evaporation cavity is positive pressure, and the contact surface of the evaporation cavity and the heating source can elastically deform so as to improve the contact effect of the heating source and the evaporation cavity.
Furthermore, the condensation cavity is directly connected with the evaporation cavity or is connected with the evaporation cavity through a connecting pipeline.
Furthermore, the condensation part comprises a plurality of condensation support plates, and the condensation cavity is a planar cavity correspondingly arranged in the condensation support plates; or the condensation part comprises a plurality of condensation branch pipes, and the condensation cavity is a cylindrical cavity correspondingly arranged in the condensation branch pipes; or the condensation part comprises a plurality of condensation conical pipes, and the condensation cavity is a conical cavity correspondingly arranged in the condensation conical pipes.
Furthermore, a plurality of fins, salient points or fins are arranged inside the evaporation part and/or the condensation part so as to improve the pressure bearing capacity.
Further, the evaporation part is provided with an installation frame, and the heating source is connected with the evaporation part through the installation frame.
Furthermore, the condensation part can also comprise a condensation top plate, a planar condensation cavity or a curved condensation cavity is arranged in the condensation top plate, and the condensation cavity in the condensation top plate is communicated with a condensation support plate, a condensation branch pipe or a condensation cavity in the condensation conical pipe.
Further, still include the condensation fin, the condensation fin links to each other with the condensation portion.
Further, the condensation fin is connected at the surface of condensation extension board through the mode of brazing, and the condensation chamber outwards gives off the heat through the condensation fin and cools off with the source that generates heat.
The utility model discloses a phase transition heat abstractor has following advantage:
1) The phase change component is in direct contact with the heating source, a transition heat conduction plate is not required to be added, and the temperature difference between the heating source and the phase change component is small.
2) the evaporation part of the phase change component is adapted to the appearance of the heating source: when the heat source is in a plane structure, the evaporation cavity is in a plane thin-wall cavity structure; when the heat source is in a curved surface structure, the evaporation cavity is in a curved surface thin-wall cavity structure; when the heating source can be in multi-surface contact with the phase change heat dissipation device, the evaporation cavity is in a polyhedral thin-wall cavity structure. The purpose of the heat source heat dissipation device is to achieve the largest contact area between the heat source and the phase change heat dissipation device, so that the temperature difference between the phase change heat exchange medium in the evaporation cavity and the heat source is the smallest.
3) The evaporation part of the phase change component is in contact with the heating source, and the inside of the evaporation cavity is in a positive pressure state instead of the negative pressure or micro-positive pressure of the traditional phase change device. Along with the heat flux density increase of the source that generates heat, the inside operating pressure of evaporation chamber lasts and risees, and evaporation chamber and the source contact surface that generates heat are thin-walled structure, and along with the pressure rising of evaporation intracavity portion, the phase change subassembly can fully with the source contact that generates heat, combine inseparabler, heat transfer effect is good, and when the heat flux density of the source that generates heat was big, the heat quick diffusion of phase change subassembly evaporation portion can be realized in phase change heat transfer medium's vaporization, and the whole difference in temperature of evaporation portion is little.
4) The phase change component is of a three-dimensional heat dissipation structure, and after the phase change heat exchange medium is vaporized, the phase change heat exchange medium can be rapidly diffused to any low-temperature part (the low-temperature part is condensed with the phase change heat exchange medium, and low pressure occurs) of the phase change component, so that the temperature of the phase change component is uniform, the heat transfer efficiency is high, and the heat transfer is uniform.
Furthermore, the utility model discloses a phase change heat abstractor's manufacturing need not pass through surface treatment processes such as copper facing and nickel plating, and heat abstractor's phase change structure and cooling fin directly adopt high temperature brazing to weld integratively, and the gap is filled through low temperature tin soldering again in heating source (like power device CPU) and the contact of phase change heat abstractor, avoids producing the clearance, makes the utility model discloses a phase change heat abstractor's heat transfer limit is showing and is improving (being far more than 200W).
the utility model discloses a phase transition heat abstractor can be applied to chip, resistance, electric capacity, inductance, stores power electronics heat dissipation such as medium, light source, battery package.
drawings
Fig. 1a is a perspective view of a first phase change heat dissipation device according to an embodiment of the present invention;
FIG. 1b is a cross-sectional view of the phase change heat sink of FIG. 1 a;
fig. 2 is a perspective view of a second embodiment of the phase change heat dissipation device of the present invention;
Fig. 3a is a perspective view of a third embodiment of the phase change heat dissipation device of the present invention;
FIG. 3b is a cross-sectional view of the phase change heat sink of FIG. 3 a;
Fig. 4a is a perspective view of a fourth embodiment of the phase change heat dissipation device of the present invention;
FIG. 4b is a cross-sectional view of the phase change heat sink of FIG. 4 a;
5-6 show schematic diagrams of the flow of the phase change heat transfer medium in the phase change assembly of the present invention;
Fig. 7a is a perspective view of a fifth embodiment of the phase change heat dissipation device of the present invention, in which an evaporation portion and a condensation portion are separately disposed and communicated with each other through a pipeline, the evaporation portion has a hollow rectangular cavity, and the condensation portion includes a plurality of condensation support plates;
FIG. 7b is a cross-sectional view of the phase change heat sink of FIG. 7 a;
Fig. 8a is a perspective view of a sixth embodiment of the phase change heat dissipation device of the present invention, wherein an evaporation portion and a condensation portion are separately disposed and communicated with each other through a pipeline, the evaporation portion is a hollow rectangular cavity, the condensation portion includes a plurality of condensation branches, and the condensation branches have a plurality of cylindrical cavities;
FIG. 8b is a cross-sectional view of the phase change heat sink of FIG. 8 a;
fig. 9a is a front view of a seventh embodiment of the phase change heat dissipating device of the present invention, wherein a plurality of condensation plates are connected;
FIG. 9b is a cross-sectional view of the phase change heat sink of FIG. 9a with a plurality of cold plates in communication with one another through a cold top plate;
Fig. 9c is a perspective view of the phase change device in fig. 9a, wherein the evaporation portion is a curved structure, and the heat source is wrapped by the evaporation portion of the phase change heat sink.
Fig. 10a is a cross-sectional view of an eighth embodiment of the phase change heat dissipation device of the present invention;
Fig. 10b is a perspective view of the phase change heat sink of fig. 10 a.
Detailed Description
In order to better understand the purpose, structure and function of the present invention, the following description is made in detail with reference to the accompanying drawings.
In the present invention, the related terms are defined as follows:
Heat flux density: the heat transferred per unit area in a unit time is called the heat flow density, Q ═ Q/(S × t) — -Q is the heat, t is the time, S is the cross-sectional area, the unit of the heat flow density: j/(m2 · s).
heat transfer limit: the heat flux density of the maximum transmission of the phase-change heat dissipation device (including the heat pipe) is related to the size, the shape, the phase-change heat exchange medium, the working temperature and the like, the heat transfer limits of the common heat pipe, such as a capillary limit, a carrying limit, a boiling limit, a sound velocity limit, a viscosity limit and the like, exist, and the heat transfer capacity of the heat pipe is determined by the minimum limit value.
Thermal conductivity: defined as two parallel planes 1 meter apart and 1 square meter in area, taken perpendicular to the direction of heat conduction within the object, the amount of heat conducted from one plane to the other in 1 second is defined as the thermal conductivity of the object in watt-meters-1-kelvin-1 (W-m-1-K-1) if the two planes differ in temperature by 1K.
Thermal resistance: is defined as the ratio between the temperature difference across the object and the power of the heat source when heat is transferred across the object, in kelvin per watt (K/W) or degrees celsius per watt (c/W).
As shown in fig. 1a-10b, the phase change heat dissipation device 10 of the present invention includes an evaporation portion 11, a condensation portion 12 and a phase change heat transfer medium 20 disposed in the evaporation portion 11 or the condensation portion 12, wherein the evaporation portion 11 and the condensation portion 12 together form a three-dimensional heat transfer structure. When the phase change heat dissipation device 10 is in a working state, the working pressure inside the phase change heat dissipation device 10 is greater than 0.15MPa, and the phase change heat dissipation device is in a positive pressure state, and the outer wall surface of the evaporation part is in direct contact with the heating source.
The evaporation part 11 and the condensation part 12 may be directly connected together (as shown in fig. 1a to 6), or the evaporation part 11 and the condensation part 12 may be a split structure (as shown in fig. 7a to 8 b) connected together through a pipeline. In addition, the shape of the evaporation part 11 is adapted to the shape of the heat source, the evaporation cavity may be a thin-walled cavity with a plane shape, a curved surface shape or a polyhedral shape, so as to increase the contact area between the heat source and the outer wall surface of the evaporation part, the evaporation part 11 and the heat source have at least one suitable contact surface, so that the two are in close contact, and thus the temperature difference of the phase change heat transfer medium directly contacted between the heat source and the inner wall of the evaporation cavity is reduced (as shown in fig. 9a-10 b).
therefore, the evaporation part of the phase change component of the utility model is adapted to the shape of the heating source, when the heat source is a plane structure, the evaporation cavity is a plane thin-wall cavity structure; when the heat source is in a curved surface structure, the evaporation cavity is in a curved surface thin-wall cavity structure; when the heating source can be in multi-surface contact with the phase change heat dissipation device, the evaporation cavity is in a polyhedral thin-wall cavity structure. The purpose is to realize the largest contact area between the heating source and the phase-change heat dissipation device, thereby realizing the smallest temperature difference between the phase-change heat exchange medium in the evaporation cavity and the heat source.
The evaporation portion of phase change unit and the source in close contact with that generates heat, the inside non-traditional phase change device's of evaporation chamber negative pressure or pressure-fired, but the malleation state, heat flux density along with the source that generates heat increases, the operating pressure of evaporation intracavity portion lasts the rising, evaporation chamber and the source contact surface that generates heat are thin-walled structure, along with the pressure rising of evaporation intracavity portion, phase change unit can fully with the source contact that generates heat, combine inseparabler, the heat transfer effect is good, when the heat flux density of the source that generates heat is big, the heat of phase change unit evaporation portion is spread fast in phase change heat transfer medium's vaporization can be realized, the whole difference in temperature of evaporation.
As shown in fig. 1a-1b, for the first embodiment of the present invention, the phase change heat dissipation device 10 of the present invention includes a phase change component, the phase change component is a closed structure with a cavity inside, the phase change component is equipped with a phase change heat transfer medium 20 inside, the internal cavity of the phase change component is a full-communication structure, and the phase change heat transfer medium 20 can circulate in the whole internal cavity of the phase change component.
The phase change component has evaporation portion 11 and condensation portion 12, and the inside of evaporation portion 11 has the evaporation chamber, and the inside of condensation portion 12 has the condensation chamber, and the evaporation chamber of evaporation portion 11 and the condensation chamber intercommunication of condensation portion 12, evaporation chamber and condensation chamber constitute the inside cavity of phase change component, and condensation portion 12 links to each other with the condensation fin. The phase-change heat exchange medium 20 in the evaporation cavity absorbs the heat of the heat source 30, then is vaporized, evaporated and flows into the condensation cavity to be cooled and liquefied, and the condensation cavity emits the heat outwards through the condensation fins. Therefore, the phase-change heat sink 10 can transfer the heat of the heat-generating source 30 to the air or other gaseous cooling medium to achieve the effect of heat dissipation and cooling of the heat-generating source.
the evaporation part 11 of the phase change element is a planar plate or a curved plate with a cavity inside, the evaporation part 11 is provided with a planar evaporation cavity or a curved evaporation cavity inside, and the planar cavity or the curved evaporation cavity inside the evaporation part 11 is communicated with the condensation cavity inside the condensation part 12.
Condensation portion 12 includes that a plurality of inside have the condensation extension board of cavity, and the inside of condensation extension board is plane condensation chamber, and a plurality of condensation extension boards are connected on evaporation portion 11, and the inside plane condensation chamber of condensation extension board is linked together with the inside plane evaporation chamber or the curved surface evaporation chamber of evaporation portion 11. The above-mentioned a plurality of condensation extension boards are preferred in bank parallel arrangement, and the condensation extension board is connected with evaporation portion 11 perpendicularly, and the outside of condensation extension board is connected with the condensation fin, and the heat in the condensation extension board gives off to the external world through the condensation fin.
Further, as shown in fig. 2, the condensation portion 12 further includes a condensation top plate 121, a planar condensation cavity or a curved condensation cavity is provided inside the condensation top plate 121, the condensation cavity inside the condensation top plate 121 is communicated with the condensation cavity inside the condensation support plate, and the condensation portion 12 is in a comb shape as a whole. The phase change heat exchange medium 20 absorbs heat in the evaporation cavity of the evaporation part 11, and dissipates heat through the condensation support plate and the condensation top plate 121 of the condensation part 12, and the phase change heat exchange medium 20 circularly flows in the evaporation cavity of the evaporation part 11 and the condensation cavity in the condensation support plate and the condensation top plate 121, so as to dissipate heat of the heat source 30. The condensation top plate 121 can be integrally formed with the condensation support plate. The evaporation part 11 and the condensation part 12 of the phase change unit are also preferably integrally formed.
in the present embodiment, as shown in fig. 3a-3b, the condensing plate in the condensing portion 12 takes other forms, that is, the condensing portion 12 includes a plurality of cylindrical condensing branch pipes, and the condensing cavity is a cylindrical cavity correspondingly disposed inside the condensing branch pipes. As shown in fig. 4a-4b, the condensation portion 12 may further include a plurality of condensation tapered tubes, and the condensation chamber is a conical cavity correspondingly disposed inside the condensation tapered tubes. During the actual use, can select for use condensation extension board, condensation branch pipe or condensation conical duct according to the structure needs.
the evaporation part 11 directly contacts the heat source 30, that is, the surface of the evaporation part 11 (the outer surface of the evaporation cavity) directly contacts the heat source 30, and the surface of the evaporation part 11 directly replaces the substrate of the conventional heat dissipation device, so as to improve the heat transfer efficiency between the heat source 30 and the evaporation part 11. The evaporation portion 11 is preferably a flat plate-shaped body having a cavity therein, one side of the evaporation portion 11 has a contact heat absorbing surface, the heat source 30 has a flat heat source surface, and the contact heat absorbing surface of the evaporation portion 11 is disposed in contact with the heat source surface of the heat source 30.
Above-mentioned evaporation portion still can set up the mounting bracket to with generating heat the source and being in the same place the phase transition heat abstractor installation, the mounting bracket can avoid evaporating the inside pressure increase of cavity and leading to the plastic deformation of evaporation portion with generating heat source and evaporation portion fixed connection.
the area of the heat source surface of the heat source 30 is smaller than the area of the heat absorbing surface of the phase change component evaporation part 11, and the internal phase change heat exchange medium 20 can rapidly transfer heat from the heat source 30 along the two-dimensional direction through phase change flow, so that the temperature in the phase change component evaporation cavity is ensured to be uniform. The vaporized phase-change heat exchange medium 20 enters the condensing support plates and flows along a third direction, which is perpendicular to the evaporation part 11 of the planar plate-shaped body, i.e., perpendicular to the two-dimensional heat dissipation direction inside the evaporation part 11.
As shown in fig. 5 to 6, which illustrate the circulation flowing condition of the phase change heat exchange medium 20 in the phase change assembly, the phase change heat exchange medium 20 of the evaporation part 11 absorbs the heat of the heat generating source 30 and then diffuses along a two-dimensional plane in the internal evaporation cavity of the evaporation part 11, then the phase change heat exchange medium 20 evaporates and flows into the condensation support plate perpendicular to the condensation part 12 of the evaporation part 11 and then flows into the condensation top plate 121, the condensation support plate and the condensation top plate 121 are externally connected with condensation fins, and the heat carried by the phase change heat exchange medium 20 in the condensation support plate and the condensation top plate 121 diffuses outwards through the condensation fins, so as to obtain more favorable heat dissipation effect and performance.
As shown in fig. 7a, 7b, 8a, and 8b, in these embodiments, the condensation chamber of the condensation portion 12 is not directly connected to the evaporation portion 11, and the condensation chamber of the condensation portion 12 is connected to the evaporation portion 11 through a pipeline, so as to facilitate the reasonable arrangement of the evaporation portion 11 and the condensation portion 12 according to the internal system structure of the heat generating source 30. Fig. 7a, 7b show a condensation section with condensing strips, and fig. 8a, 8b show a condensation section with condensing branches.
In the embodiments shown in fig. 7a-8b, the condensing part and the evaporating part can be flexibly arranged respectively because the condensing part and the evaporating part are connected by a pipeline. For example, the condensation portion 12 can be disposed horizontally or vertically, and the structure and the disposition direction can be changed according to the structural design of the system in which the heat generating source is disposed. The heat of the heating source is directly transferred to the phase change heat transfer medium 20 through the thin wall of the evaporation part 11, the phase change heat transfer medium 20 absorbs heat and changes phase to generate pressure difference between the evaporation part 11 and the condensation part 12 in the phase change heat dissipation device 10, so that the phase change heat transfer medium 20 is driven to flow to the condensation part 12, and after the phase change heat transfer medium is condensed in the condensation part 12, the phase change heat transfer medium returns to the evaporation part 11 through gravity or capillary force to form circulation.
As shown in fig. 9a, 9b, 9c, 10a, and 10b, in these embodiments, the shape of the evaporation portion 11 is adapted to the shape of the heat source, the evaporation cavity may be a thin-walled cavity with a plane shape, a curved surface shape, or a polyhedral shape to increase the contact area between the heat source and the outer wall surface of the evaporation portion, and the evaporation portion 11 and the heat source have at least one contact surface suitable for mating connection, so that the two are in close contact, and the temperature difference of the phase change heat transfer medium directly contacted between the heat source and the inner wall of the evaporation cavity is reduced.
The evaporation part 11 shown in fig. 9a, 9b and 9c is a cylindrical groove body, the evaporation part shown in fig. 10a and 10b is a square cylindrical groove body, the heat source 30 can be directly installed in the evaporation part 11 of the phase change component, and the heat source 30 and the evaporation part 11 are provided with a plurality of contact heat exchange surfaces.
From this, the evaporation portion 11 and the condensation portion 12 intercommunication of phase change component, the evaporation portion 11 of phase change component one end and the condensation portion 12 direct intercommunication of the phase change component other end, the inside phase change heat transfer medium 20 of phase change component can realize the heat from phase change component one end to the level of the phase change component other end to, vertical three-dimensional solid diffusion, promote whole phase change component inner cavity, especially the temperature homogeneity of condensation chamber in the condensation portion 12.
furthermore, a plurality of fins, bumps or fins are arranged inside the evaporation part 11 and/or the condensation part 12 to improve the pressure-bearing capacity.
The phase change assembly and the cooling fins may be made of a copper or aluminum material, for example, the phase change assembly and the cooling fins are made of a copper or aluminum material, and are preferably connected by brazing to reduce the contact thermal resistance of the phase change assembly and the cooling fins, thereby reducing the temperature difference between the cooling fins and the heat generation source 30. After the heat source 30 (such as a power device CPU) and the phase change heat sink 10 (such as the evaporation part 11) are contacted and connected, the gap can be filled by low-temperature tin soldering, so as to avoid generating a gap.
The cooling fins and the outer wall of the condensation support plate are welded together, the pressure bearing capacity of the condensation support plate is increased, when the radiator works, the internal working pressure of the condensation part 12 and the internal working pressure of the evaporation part 11 can be increased, if the internal working pressure is increased to more than 1MPa, the interwoven structure formed by welding the cooling fins and the condensation support plate can ensure that the condensation part 12 bears the strength required by work, the condensation part 12 does not deform, and the normal work of the radiator is ensured.
The utility model discloses a phase transition heat abstractor can use and dispel the heat in chip, resistance, electric capacity, inductance, storage medium, light source, battery package etc. power electronics.
It is to be understood that the present invention has been described with reference to certain embodiments, and that various changes or equivalents may be substituted for elements thereof by those skilled in the art without departing from the spirit and scope of the invention. In addition, many modifications may be made to adapt a particular situation or material to the teachings of the invention without departing from the essential scope thereof. Therefore, the present invention is not limited to the specific embodiments disclosed herein, and all embodiments falling within the scope of the claims of the present application are intended to be covered by the present invention.

Claims (10)

1. The phase change heat dissipation device comprises a phase change component internally provided with a phase change heat exchange medium, and is characterized in that the phase change component comprises an evaporation part and a condensation part, an evaporation cavity is arranged in the evaporation part, a condensation cavity is arranged in the condensation part, the evaporation cavity is communicated with the condensation cavity, a heating source is in direct contact with the evaporation cavity, the phase change heat exchange medium in the evaporation cavity can absorb heat of the heating source and move towards the condensation cavity, and the condensation cavity gives off heat outwards so as to cool the heating source.
2. The phase-change heat dissipating device as claimed in claim 1, wherein the evaporation cavity is a cavity with a planar shape, a curved shape or a polyhedral shape, and is adapted to the shape of the heat source to increase the contact area between the heat source and the evaporation cavity.
3. The phase-change heat dissipation device according to claim 1, wherein the evaporation cavity is a thin-wall cavity, the working pressure inside the evaporation cavity is positive pressure, and the contact surface between the evaporation cavity and the heat source can be elastically deformed to improve the contact effect between the heat source and the evaporation cavity.
4. The phase-change heat sink according to claim 1, wherein the condensation chamber is directly connected to the evaporation chamber or connected to the evaporation chamber through a connection pipe.
5. The phase-change heat dissipation device as claimed in any one of claims 1-4, wherein the condensation portion comprises a plurality of condensation plates, and the condensation chamber is a planar cavity correspondingly arranged inside the condensation plates; or the condensation part comprises a plurality of condensation branch pipes, and the condensation cavity is a cylindrical cavity correspondingly arranged in the condensation branch pipes; or the condensation part comprises a plurality of condensation conical pipes, and the condensation cavity is a conical cavity correspondingly arranged in the condensation conical pipes.
6. The phase-change heat dissipating device according to claim 5, wherein a plurality of fins, protrusions or fins are provided inside the evaporation part and/or the condensation part to increase pressure-bearing capacity.
7. The phase-change heat dissipating device according to claim 5, wherein the evaporation portion is provided with a mounting bracket, and the heat generating source is connected to the evaporation portion through the mounting bracket.
8. the phase-change heat dissipating device as claimed in claim 5, wherein the condensing part further comprises a top condensing plate, and the top condensing plate has a planar or curved condensing cavity therein, and the condensing cavity inside the top condensing plate is communicated with the condensing cavity inside the condensing plate, the condensing branch pipe or the condensing cone pipe.
9. The phase-change heat dissipating device according to claim 5, further comprising a condensing fin connected to the condensing portion.
10. The phase-change heat sink as claimed in claim 9, wherein the condensing fins are connected to the outer surface of the condensing plate by soldering, and the condensing cavity dissipates heat outwards through the condensing fins to cool the heat source.
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020155900A1 (en) * 2019-01-29 2020-08-06 株洲智热技术有限公司 Phase change heat radiating device
WO2020155899A1 (en) * 2019-01-29 2020-08-06 株洲智热技术有限公司 Phase change heat radiating device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020155900A1 (en) * 2019-01-29 2020-08-06 株洲智热技术有限公司 Phase change heat radiating device
WO2020155899A1 (en) * 2019-01-29 2020-08-06 株洲智热技术有限公司 Phase change heat radiating device

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