CN108800703B - Semiconductor refrigeration equipment - Google Patents

Abstract

The invention discloses a semiconductor refrigeration equipment, comprising a box shell and an inner tank arranged in the box shell, the inner tank is configured with a semiconductor refrigeration module, and the semiconductor refrigeration module includes assembled semiconductor refrigeration chips , a hot-end radiator and a cold-end radiator, the cold-end radiator includes a cold-end heat-conducting seat and a first heat pipe connected to the cold-end heat-conducting seat, the first heat pipe is attached to the inner tank, the The hot-end radiator includes a hot-end heat-conducting seat and a second heat pipe connected to the hot-end heat-conducting seat, the second heat pipe is provided with a plurality of heat dissipation fins, and one side of the heat dissipation fin is provided with a notch structure, A plurality of the notch structures form installation grooves, and cooling fans are arranged in the installation grooves. Improve the cooling efficiency of refrigeration equipment and reduce energy consumption.

Description

Semiconductor refrigeration equipment

technical field

The present invention relates to refrigeration equipment, in particular to a semiconductor refrigeration equipment.

Background technique

At present, with the development of semiconductor refrigeration technology, refrigeration equipment using semiconductor refrigeration chips for refrigeration is widely used. Chinese Patent No. 2014107111772 discloses a semiconductor refrigeration equipment, which uses the cooling capacity generated by semiconductor refrigeration chips to achieve refrigeration. The semiconductor refrigeration chip includes a cold end that releases cold energy and a hot end that releases heat. During operation, the cold end of the semiconductor refrigeration chip releases the cold energy into the refrigeration compartment of the refrigeration equipment through the cold end radiator. The hot end of the chip needs to dissipate heat to the outside through the hot end heat sink. The hot-end radiator in the above-mentioned patent includes a hot-end heat-conducting seat, a heat pipe and a fin connected to the hot-end of the semiconductor refrigeration chip, and a heat-dissipating fan is arranged on the hot-end heat-conducting seat. The wind enters between the fins through the through holes or gaps on the fins, and the wind direction will change by 90 degrees. The fins have a large wind resistance to the airflow, resulting in poor heat dissipation efficiency, which in turn causes the semiconductor refrigeration chip to cool due to poor heat dissipation. The capacity decreases, and the overall energy consumption of the refrigeration equipment increases. How to design a refrigeration device with strong heat dissipation capability, high refrigeration efficiency and low energy consumption is the technical problem to be solved by the present invention.

SUMMARY OF THE INVENTION

The invention provides a semiconductor refrigeration equipment, which can improve the heat dissipation capacity and refrigeration efficiency of the refrigeration equipment and reduce the energy consumption.

In order to achieve the above-mentioned technical purpose, the present invention adopts the following technical solutions to realize:

A semiconductor refrigeration equipment, comprising a box shell and an inner tank arranged in the box shell, the inner tank is configured with a semiconductor refrigeration module, and the semiconductor refrigeration module includes an assembled semiconductor refrigeration chip, a hot end heat dissipation and a cold end radiator, the cold end radiator includes a cold end heat conducting seat and a first heat pipe connected to the cold end heat conducting seat, the first heat pipe is attached to the inner tank, and the hot end radiator It includes a hot-end heat-conducting seat and a second heat pipe connected to the hot-end heat-conducting seat, the second heat pipe is provided with a plurality of heat dissipation fins, and one side of the heat dissipation fin is provided with a gap structure, and a plurality of the heat dissipation fins are provided. The notch structure forms an installation groove, and a cooling fan is arranged in the installation groove.

Further, a fan bracket is provided on the cooling fan, and the fan bracket spans the cooling fins.

Further, a heat sink is provided on the hot-end heat-conducting seat.

Further, the semiconductor refrigeration module includes an assembly module, the assembly module includes a first heat insulation support and a second heat insulation support, the first heat insulation support is fixed on the second heat insulation support, the An installation cavity is formed between the first heat insulation support and the second heat insulation support, the first heat insulation support is provided with an installation hole communicating with the installation cavity, and the semiconductor refrigeration chip is located in the installation hole , the cold-end heat-conducting seat is arranged in the installation cavity and is in contact with the cold end surface of the semiconductor refrigeration chip, and the hot-end heat-conducting seat is arranged on the first heat insulation bracket and is connected to the semiconductor refrigeration chip hot end contact.

Further, the outer surface of the first heat insulation bracket is provided with a heat insulation groove around the installation hole, and the heat insulation groove is provided with heat insulation cotton; the outer surface of the first thermal insulation bracket.

Further, the cold-end heat-conducting seat is provided with an avoidance gap, the first heat-insulating bracket, the second heat-insulating support and the hot-end heat-conducting seat are respectively provided with through holes, and the bolts pass through the corresponding holes. In the through hole, the bolt passes through the area formed by the avoidance gap.

Further, the cold-end heat-conducting seat includes a first heat-conducting plate and a second heat-conducting plate that are connected together; the inner surface of the first heat-conducting plate is provided with a horizontally arranged first installation groove, and the second heat-conducting plate is The inner surface is provided with a longitudinally arranged second installation slot, the first heat pipe is divided into a horizontal flat heat pipe and a longitudinal flat heat pipe, the horizontal flat heat pipe is arranged in the first installation slot, and the longitudinal flat heat pipe is arranged in the in the second installation groove, and the transverse flat heat pipe and the longitudinal flat heat pipe are in contact with each other.

Further, the inner surface of the first heat insulation support is provided with a first pipe groove for installing the first heat pipe, and the edge of the second heat insulation support is provided with a gap or a gap for the first heat pipe to pass through. Through hole or second pipe groove.

Further, the outer surface of the first heat insulating bracket is provided with a plurality of positioning baffles around the outside of the installation hole, and the hot end heat conduction seat is arranged between the plurality of positioning baffles.

Further, the semiconductor refrigeration module includes a plurality of the semiconductor refrigeration chips, the assembly module is configured with the hot-end heat-conducting seat and the cold-end heat-conducting seat corresponding to the semiconductor refrigeration chips, and the The first heat insulating bracket is provided with the mounting hole corresponding to the semiconductor refrigeration chip.

Compared with the prior art, the advantages and positive effects of the present invention are: by forming a gap structure in the plurality of cooling fins, the gap structure forms an installation groove for installing the cooling fan, and in the actual use process, the cooling fan sucks The cold air can be transmitted through the channel formed between the two cooling fins, so that the cold air can be in contact with the fins to the greatest extent for heat exchange, effectively reducing wind resistance, improving heat dissipation efficiency, and improving the heat dissipation capacity of the refrigeration equipment. Cooling efficiency and reduce energy consumption.

The installation cavity formed between the two heat-insulating brackets is used to install the cold-end heat-conducting seat, so that the cold-end heat-conducting seat and the hot-end heat-conducting seat are effectively separated by the heat-insulating bracket, thereby greatly reducing the distance between the cold-end heat-conducting seat and the hot-end heat-conducting seat. The amount of heat exchange generated between the heat-conducting bases at the hot end can effectively reduce the loss of cooling capacity, so as to improve the cooling efficiency of the refrigeration equipment and reduce energy consumption. At the same time, the semiconductor refrigeration chip is embedded in the mounting hole of the first heat insulation bracket, which ensures good contact between the cold end surface of the semiconductor refrigeration chip and the cold end heat conduction seat, and ensures that the hot end surface of the semiconductor refrigeration chip and the hot end heat conduction seat are in good condition. Contact to ensure rapid heat dissipation and improve reliability.

Description of drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the accompanying drawings that need to be used in the description of the embodiments or the prior art. Obviously, the accompanying drawings in the following description These are some embodiments of the present invention, and for those of ordinary skill in the art, other drawings can also be obtained from these drawings without any creative effort.

1 is a schematic structural diagram of an embodiment of a semiconductor refrigeration device of the present invention;

Fig. 2 is the assembly diagram of the inner tank and the cold end radiator in the embodiment of the semiconductor refrigeration equipment of the present invention;

3 is a schematic structural diagram of a hot end radiator in an embodiment of the semiconductor refrigeration equipment of the present invention;

4 is a schematic structural diagram of a semiconductor refrigeration module of the present invention;

5 is a schematic front view of the structure of the first heat insulating support in the semiconductor refrigeration module of the present invention;

6 is a schematic view of the reverse structure of the first heat insulating support in the semiconductor refrigeration module of the present invention;

7 is a schematic front view of the structure of the second heat insulating support of the semiconductor refrigeration module of the present invention;

8 is a schematic view of the reverse structure of the second heat insulating support in the semiconductor refrigeration module of the present invention;

9 is a schematic structural diagram of a first heat conducting plate in the semiconductor refrigeration module of the present invention;

10 is a schematic structural diagram of a second heat conducting plate in the semiconductor refrigeration module of the present invention;

11 is an exploded view of the semiconductor refrigeration module of the present invention.

Detailed ways

In order to make the purposes, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments These are some embodiments of the present invention, but not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

As shown in FIGS. 1-3 , the semiconductor refrigeration equipment of this embodiment includes a case 200 and an inner tank 100 arranged in the case. The inner tank 100 is configured with a semiconductor refrigeration module, and the semiconductor refrigeration mold The set includes a semiconductor refrigeration chip, a hot-end heat sink and a cold-end heat sink assembled together, the cold-end heat sink includes a cold-end heat-conducting seat and a first heat pipe 2 connected to the cold-end heat-conducting seat, the first heat pipe 2 is attached to the inner tank 100, the hot-end heat sink includes a hot-end heat-conducting seat 33 and a second heat pipe 331 connected to the hot-end heat-conducting seat 33, and a plurality of heat dissipation fins are arranged on the second heat pipe 331 The fins 332 are provided with a notch structure on one side of the heat dissipation fin 332, and a plurality of the notch structures form an installation groove, and a heat dissipation fan 333 is arranged in the installation groove.

Specifically, the hot-end heat-conducting seat 33 in the semiconductor refrigeration equipment of this embodiment absorbs the heat released by the hot end surface of the semiconductor refrigeration chip and transfers it to the heat dissipation fins 332 through the second heat pipes 331. The heat dissipation fins 332 are provided with a gap structure, and many The notch structure on each of the cooling fins 332 will form an installation groove for installing the cooling fan 333, so that the cooling fan 333 is embedded in the plurality of cooling fins 332, so that during the operation of the cooling fan 333, the cooling fan 333 sucks the outside world After the cold air is cooled, the cold air will flow through the space formed between the two adjacent cooling fins 332, so that the cold air contacts the surface of the cooling fins 332 for heat exchange, because the array direction of the cooling fins 332 and the airflow direction Consistently, the airflow resistance is effectively reduced, the heat exchange efficiency is higher, and the heat dissipation fins 332 have greater heat dissipation per unit time. The cooling fan 333 may be a centrifugal fan, and the centrifugal fan sucks in the outside air along its axis direction and blows it out from the air formed between the cooling fins 332 . In addition, in order to facilitate the installation of the cooling fan 333, the cooling fan 333 is provided with a fan support 3331, and the fan support 3331 spans the heat dissipation fins 332. Specifically, the fan support 3331 can span multiple heat dissipation fins 332, Between the fans 3331 and the cooling fins 332 are fixed by bolts, so that the cooling fan 333 is assembled. Preferably, a heat sink (not shown) is provided on the hot-end heat-conducting base 33 , and the heat-dissipating fins are used to further rapidly dissipate the heat of the hot-end heat-conducting base 33 .

In the semiconductor refrigeration equipment of this embodiment, a gap structure is formed in the plurality of heat dissipation fins, and the gap structure forms an installation groove for installing a heat dissipation fan. During actual use, the cold air sucked by the heat dissipation fan can pass through the two heat dissipation fins. The channels formed between the fins are transmitted, so that the cold air can contact the fins to the greatest extent for heat exchange, effectively reduce the wind resistance, improve the heat dissipation efficiency, improve the heat dissipation capacity and cooling efficiency of the refrigeration equipment, and reduce energy consumption.

Further, in order to more effectively improve the cooling efficiency, as shown in FIG. 1-FIG. 11, the semiconductor refrigeration module further includes an assembly module 3, and the assembly module 3 includes a first heat insulation support 31 and a second heat insulation support 32, A first groove 311 is provided on the inner surface of the first heat insulation bracket 31, and a mounting hole 312 is formed in the first groove 311 to penetrate through the first heat insulation support 31. The second heat insulation bracket 31 The inner surface of the bracket 32 is provided with a second groove 321 , the first heat insulation support 31 is fixed on the second heat insulation support 32 , between the first groove 311 and the second groove 321 An installation cavity is formed, the semiconductor refrigeration chip 1 is located in the installation hole 312, the cold end heat-conducting seat 34 is arranged in the installation cavity and is in contact with the cold end surface of the semiconductor refrigeration chip 1, and the heat The end heat conducting seat 33 is arranged on the first heat insulating support 31 and is in contact with the hot end surface of the semiconductor refrigeration chip 1 , and the first heat pipe 2 is connected to the cold end heat conducting seat 34 .

Specifically, in the semiconductor refrigeration module of this embodiment, the semiconductor refrigeration chip 1 is embedded in the mounting hole 312 of the first heat insulation bracket 31 , and the periphery of the semiconductor refrigeration chip 1 is wrapped by the first heat insulation support 31 . A heat-insulating bracket 31 separates the hot-end heat-conducting base 33 from the cold-end heat-conducting base 34 , which can effectively reduce the amount of heat transfer between the hot-end heat-conducting base 33 and the cold-end heat-conducting base 34 , thereby reducing the cold-end heat-conducting base 34 At the same time, the cold-end heat-conducting seat 34 is wrapped in the installation cavity with temperature insulation function formed by the first heat-insulating bracket 31 and the second heat-insulating support 32, and the semiconductor that the cold-end heat-conducting seat 34 conducts The cooling capacity generated by the cooling chip 1 can be quickly transferred to the required area through the heat pipe 2 to the maximum extent, thereby reducing the cooling capacity loss of the cold end heat-conducting seat 34 itself, more effectively reducing energy consumption and improving cooling efficiency.

Preferably, the outer surface of the first heat insulating bracket 31 is provided with a heat insulating groove 313 around the mounting hole 312 , and heat insulating cotton (not marked) is provided in the heat insulating groove 313 ; The end surface protrudes outward from the outer surface of the first heat insulating support 31 . Specifically, thermal insulation cotton can be provided on the periphery of the semiconductor refrigeration chip 1 through the thermal insulation groove 313, so that the thermal insulation ring formed by the thermal insulation cotton can further reduce the cooling capacity of the cold end surface of the semiconductor refrigeration chip 1 to be dissipated to the outside. The heat of the hot end face of the semiconductor refrigeration chip 1 is reduced to enter the installation cavity, and the loss of cooling capacity is minimized; while the hot end face of the semiconductor refrigeration chip 1 is slightly higher than the outer surface of the first heat insulation bracket 31, on the one hand, the semiconductor refrigeration chip 1 is made. The hot end face of the chip 1 and the hot end heat-conducting seat 33 can have good contact and heat transfer. On the other hand, the hot end face of the semiconductor refrigeration chip 1 is separated from the mounting hole 312, which can reduce the heat transfer from the mounting hole 312 to the mounting cavity. Effectively reduce the loss of cooling capacity. Wherein, in order to facilitate the connection of circuit wiring, the outer surface of the first heat insulating bracket 31 is further provided with a wiring groove 314 , and the wiring groove 314 communicates with the mounting hole 312 . In addition, according to the cooling capacity requirement of the refrigeration equipment, the semiconductor refrigeration module in this embodiment includes a plurality of the semiconductor refrigeration chips 1 , and the assembly module 3 is configured with the hot end heat conduction seat 33 corresponding to the semiconductor refrigeration chip 1 . and the cold-end heat-conducting seat 34 , and the first heat-insulating support 31 is provided with the mounting hole 312 corresponding to the semiconductor refrigeration chip 1 .

Further, in order to more effectively reduce the heat transfer between the hot-end heat-conducting seat 33 and the cold-end heat-conducting seat 34 caused by the assembly, the cold-end heat-conducting seat 34 is provided with an escape gap 340, and the first heat insulating bracket 31, Through holes (not marked) are respectively provided on the second heat insulation bracket 32 and the hot end heat conduction seat 33 , and the bolts 35 pass through the corresponding through holes, and the bolts 35 pass through the avoidance gap. The area formed by 340. Specifically, during the assembly process, the hot-end heat-conducting seat 33 , the first heat-insulating bracket 31 , the cold-end heat-conducting seat 34 and the second heat-insulating support 32 are assembled and fixed in sequence through the bolts 35 , and the bolts 35 pass through the The gap 340 avoids the cold-end heat-conducting seat 34, so that heat exchange between the hot-end heat-conducting seat 33 and the cold-end heat-conducting seat 34 through the bolts 35 can be avoided. Wherein, the inner surface of the first heat insulation bracket 31 is provided with a first pipe groove 316 and a first pipe groove 317 for installing the first heat pipe 2, and the edge of the second heat insulation support 32 is provided with a first pipe groove 316 for installing the first heat pipe 2. The notch or through hole 322 or the second pipe groove through which the first heat pipe 2 passes. Specifically, the heat pipe 2 passes through the assembly module 3 through the first pipe groove 316 and the first pipe groove 317 in cooperation with the through hole 322, so as to facilitate the arrangement of the heat pipe 2 on the inner container 100 of the refrigeration equipment. In addition, in order to facilitate the quick positioning and installation of the hot-end heat-conducting seat 33, the outer surface of the first heat insulating bracket 31 is provided with a plurality of positioning baffles 315 around the outer side of the installation hole 312, and the hot-end heat-conducting seat 33 is provided on a plurality of blocks between the positioning baffles 315 . During assembly, the hot-end heat-conducting seat 33 can be conveniently positioned and installed by the positioning baffle plate 315 , and it is ensured that the hot-end heat-conducting seat 33 can be in good contact with the semiconductor refrigeration chip 1 accurately.

Still further, the cold-end heat-conducting seat 34 includes a first heat-conducting plate 341 and a second heat-conducting plate 342 connected together, and the first heat pipe 2 is sandwiched between the first heat-conducting plate 341 and the second heat-conducting plate between 342. Specifically, the inner surface of the first heat-conducting plate 341 is provided with a first installation groove 3411 arranged horizontally, the inner surface of the second heat-conducting plate 342 is provided with a second installation groove 3421 arranged vertically, and the first heat pipe is divided into two parts. They are horizontal flat heat pipes and vertical flat heat pipes. The longitudinal flat heat pipes are in contact with each other. Specifically, the use of the flat heat pipe can effectively increase the contact area between the heat pipe and the cold end heat conducting seat 34 , and at the same time, the flat heat pipe can also effectively increase the contact area with the inner tank 100 to improve heat exchange efficiency. In addition, the horizontal flat heat pipes and the longitudinal flat heat pipes are in contact with each other, so that the temperature distribution of the heat pipes at different positions is uniform, and the temperature difference is reduced and the temperature uniformity is improved.

The cold-end heat-conducting seat is installed by using the installation cavity formed between the two heat-insulating brackets, so that the cold-end heat-conducting seat and the hot-end heat-conducting seat are effectively separated by the heat-insulating bracket, so that the cold-end heat-conducting seat can be greatly reduced. The amount of heat exchange with the heat transfer seat at the hot end can effectively reduce the loss of cooling capacity, so as to improve the cooling efficiency of the refrigeration equipment and reduce energy consumption. At the same time, the semiconductor refrigeration chip is embedded in the mounting hole of the first heat insulation bracket, which ensures good contact between the cold end surface of the semiconductor refrigeration chip and the cold end heat conduction seat, and ensures that the hot end surface of the semiconductor refrigeration chip and the hot end heat conduction seat are in good condition. Contact to ensure rapid heat dissipation and improve reliability.

Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, but not to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that it can still be The technical solutions described in the foregoing embodiments are modified, or some technical features thereof are equivalently replaced; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims (9)

1. A semiconductor refrigeration equipment, comprising a box shell and an inner tank arranged in the box shell, the inner tank is configured with a semiconductor refrigeration module, and the semiconductor refrigeration module comprises a semiconductor refrigeration chip assembled together, a thermal an end radiator and a cold end radiator, the cold end radiator includes a cold end heat conducting seat and a first heat pipe connected to the cold end heat conducting seat, the first heat pipe is attached to the inner tank, and the hot end The radiator includes a hot-end heat-conducting seat and a second heat pipe connected to the hot-end heat-conducting seat, the second heat pipe is provided with a plurality of heat dissipation fins, and it is characterized in that a side edge of the heat dissipation fin is provided with a gap structure, a plurality of the notch structures form installation grooves, and a cooling fan is arranged in the installation grooves; the semiconductor refrigeration module includes an assembly module, and the assembly module includes a first heat insulation bracket and a second heat insulation bracket , the first thermal insulation bracket is fixed on the second thermal insulation bracket, an installation cavity is formed between the first thermal insulation bracket and the second thermal insulation bracket, and the first thermal insulation bracket is provided with The installation hole communicates with the installation cavity, the semiconductor refrigeration chip is located in the installation hole, the cold end heat-conducting seat is arranged in the installation cavity and is in contact with the cold end surface of the semiconductor refrigeration chip, the The hot-end heat-conducting seat is arranged on the first heat-insulating support and is in contact with the hot-end surface of the semiconductor refrigeration chip. 2 . The semiconductor refrigeration equipment according to claim 1 , wherein a fan bracket is provided on the cooling fan, and the fan bracket spans the cooling fins. 3 . 3 . The semiconductor refrigeration equipment according to claim 1 , wherein a heat sink is provided on the heat-conducting seat of the hot end. 4 . 4 . The semiconductor refrigeration equipment according to claim 1 , wherein a heat insulating groove is provided on the outer surface of the first heat insulating support around the installation hole, and heat insulating cotton is provided in the heat insulating groove; 5 . The hot end face of the semiconductor refrigeration chip protrudes outward from the outer surface of the first heat insulating support. 5 . The semiconductor refrigeration equipment according to claim 1 , wherein an escape gap is provided on the cold end heat conducting seat, and the first heat insulating support, the second heat insulating support and the hot end heat conducting heat. 6 . The seats are respectively provided with through holes, the bolts pass through the corresponding through holes, and the bolts pass through the area formed by the avoidance gap. 6 . The semiconductor refrigeration equipment according to claim 1 , wherein the cold-end heat-conducting seat comprises a first heat-conducting plate and a second heat-conducting plate that are connected together; the inner surface of the first heat-conducting plate is provided with a transverse The first installation groove is provided, the inner surface of the second heat-conducting plate is provided with a longitudinally arranged second installation groove, the first heat pipe is divided into a horizontal flat heat pipe and a vertical flat heat pipe, and the horizontal flat heat pipe is arranged in the In the first installation groove, the longitudinal flat heat pipe is arranged in the second installation groove, and the transverse flat heat pipe and the longitudinal flat heat pipe are in contact with each other. 7 . The semiconductor refrigeration equipment according to claim 1 , wherein the inner surface of the first heat insulating support is provided with a first pipe groove for installing the first heat pipe, and the second heat insulating support is provided with a first pipe groove. 8 . The edge is provided with a notch or a through hole or a second pipe groove for the first heat pipe to pass through. 8 . The semiconductor refrigeration equipment according to claim 1 , wherein a plurality of positioning baffles are arranged on the outer surface of the first heat insulation bracket around the outside of the installation hole, and the hot end heat conduction seat is arranged on the outer side of the mounting hole. 9 . between a plurality of the positioning baffles. 9 . The semiconductor refrigeration equipment according to claim 1 , wherein the semiconductor refrigeration module comprises a plurality of the semiconductor refrigeration chips, and the assembly module is configured with the hot end corresponding to the semiconductor refrigeration chips. 10 . The heat-conducting seat and the cold-end heat-conducting seat, and the first heat insulating support is provided with the mounting hole corresponding to the semiconductor refrigeration chip.

Images