CN108800703B - Semiconductor refrigeration equipment - Google Patents
Semiconductor refrigeration equipment Download PDFInfo
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- CN108800703B CN108800703B CN201710293549.8A CN201710293549A CN108800703B CN 108800703 B CN108800703 B CN 108800703B CN 201710293549 A CN201710293549 A CN 201710293549A CN 108800703 B CN108800703 B CN 108800703B
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- 238000005057 refrigeration Methods 0.000 title claims abstract description 113
- 239000004065 semiconductor Substances 0.000 title claims abstract description 95
- 238000009413 insulation Methods 0.000 claims description 75
- 238000009434 installation Methods 0.000 claims description 15
- 229920000742 Cotton Polymers 0.000 claims description 5
- 238000001816 cooling Methods 0.000 claims 3
- 238000005265 energy consumption Methods 0.000 abstract description 9
- 230000017525 heat dissipation Effects 0.000 description 29
- 238000000034 method Methods 0.000 description 6
- 230000008569 process Effects 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 230000005540 biological transmission Effects 0.000 description 2
- 230000003434 inspiratory effect Effects 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 230000008859 change Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000021715 photosynthesis, light harvesting Effects 0.000 description 1
- 230000008092 positive effect Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D11/00—Self-contained movable devices, e.g. domestic refrigerators
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B21/00—Machines, plants or systems, using electric or magnetic effects
- F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D19/00—Arrangement or mounting of refrigeration units with respect to devices or objects to be refrigerated, e.g. infrared detectors
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
- F25B2321/02—Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
- F25B2321/025—Removal of heat
- F25B2321/0252—Removal of heat by liquids or two-phase fluids
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D2201/00—Insulation
- F25D2201/10—Insulation with respect to heat
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Thermal Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Combustion & Propulsion (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention discloses semiconductor refrigeration equipment which comprises a box shell and an inner container arranged in the box shell, wherein a semiconductor refrigeration module is configured on the inner container, the semiconductor refrigeration module comprises a semiconductor refrigeration chip, a hot end radiator and a cold end radiator which are assembled together, the cold end radiator comprises a cold end heat conduction seat and a first heat pipe connected with the cold end heat conduction seat, the first heat pipe is attached to the inner container, the hot end radiator comprises a hot end heat conduction seat and a second heat pipe connected with the hot end heat conduction seat, a plurality of radiating fins are arranged on the second heat pipe, a notch structure is arranged on one side edge of each radiating fin, a mounting groove is formed by the notch structures, and a radiating fan is arranged in the mounting groove. The refrigeration efficiency of the refrigeration equipment is improved, and the energy consumption is reduced.
Description
Technical Field
The invention relates to refrigeration equipment, in particular to semiconductor refrigeration equipment.
Background
At present, with the development of semiconductor refrigeration technology, refrigeration equipment which adopts a semiconductor refrigeration chip to carry out refrigeration is widely used, and a Chinese patent No. 2014107111772 discloses a semiconductor refrigeration equipment which adopts the refrigeration quantity generated by the semiconductor refrigeration chip to realize refrigeration. The semiconductor refrigeration chip comprises a cold end for releasing cold and a hot end for releasing heat, wherein in the operation process, the cold end of the semiconductor refrigeration chip releases the cold into the refrigeration chamber of the refrigeration equipment through the cold end radiator, and the hot end of the semiconductor refrigeration chip needs to radiate the heat to the outside through the hot end radiator. The hot junction radiator in the above-mentioned patent includes the hot junction heat conduction seat of being connected with semiconductor refrigeration chip's hot junction, heat pipe and fin, be provided with radiator fan on the hot junction heat conduction seat, however, discover at the actual motion in-process, the wind that radiator fan produced enters into between the fin through-hole or breach on the fin, the wind direction will change 90 degrees, the fin produces great windage to the air current, lead to the radiating efficiency relatively poor, and then make semiconductor refrigeration chip reduce because of the poor refrigerating capacity that appears of heat dissipation, the whole energy consumption of refrigeration plant increases. The invention aims to solve the technical problem of how to design a refrigerating device with strong heat dissipation capacity, high refrigerating efficiency and low energy consumption.
Disclosure of Invention
The invention provides a semiconductor refrigeration device, which can improve the heat dissipation capacity and refrigeration efficiency of the refrigeration device and reduce energy consumption.
In order to achieve the technical purpose, the invention adopts the following technical scheme:
the utility model provides a semiconductor refrigeration equipment, includes the case shell and sets up inner bag in the case shell, the inner bag disposes the semiconductor refrigeration module, the semiconductor refrigeration module is including semiconductor refrigeration chip, hot junction radiator and cold junction radiator that the equipment is in the same place, the cold junction radiator includes cold junction heat conduction seat and connects the first heat pipe of cold junction heat conduction seat, first heat pipe pastes on the inner bag, the hot junction radiator includes hot junction heat conduction seat and connects the second heat pipe of hot junction heat conduction seat, be provided with the multi-disc radiating fin on the second heat pipe, radiating fin's a side is provided with the breach structure, and is a plurality of the breach structure forms mounting groove, be provided with radiator fan in the mounting groove.
Furthermore, a fan bracket is arranged on the heat dissipation fan and spans the heat dissipation fins.
Furthermore, the hot end heat conducting seat is provided with a radiating fin.
Furthermore, the semiconductor refrigeration module comprises an assembly module, the assembly module comprises a first heat insulation support and a second heat insulation support, the first heat insulation support is fixed on the second heat insulation support, an installation cavity is formed between the first heat insulation support and the second heat insulation support, a mounting hole communicated with the installation cavity is formed in the first heat insulation support, the semiconductor refrigeration chip is located in the mounting hole, the cold end heat conduction seat is arranged in the installation cavity and is in contact with the cold end face of the semiconductor refrigeration chip, and the hot end heat conduction seat is arranged on the first heat insulation support and is in contact with the hot end face of the semiconductor refrigeration chip.
Further, a heat insulation groove is formed in the outer surface of the first heat insulation support and surrounds the mounting hole, and heat insulation cotton is arranged in the heat insulation groove; the hot end of the semiconductor refrigeration chip protrudes outwards from the outer surface of the first heat insulation support.
Furthermore, an avoiding gap is formed in the cold-end heat conducting seat, through holes are formed in the first heat insulation support, the second heat insulation support and the hot-end heat conducting seat respectively, bolts penetrate through the corresponding through holes, and the bolts penetrate through an area formed by the avoiding gap.
Further, the cold end heat conducting seat comprises a first heat conducting plate and a second heat conducting plate which are connected together; the internal surface of first heat-conducting plate offers the first mounting groove of horizontal setting, the second mounting groove of vertical setting is offered to the internal surface of second heat-conducting plate, first heat pipe divide into horizontal flat heat pipe and vertical flat heat pipe, horizontal flat heat pipe sets up in the first mounting groove, vertical flat heat pipe sets up in the second mounting groove, and, horizontal flat heat pipe with vertical flat heat pipe contacts each other.
Furthermore, the inner surface of the first heat insulation support is provided with a first pipe groove for installing the first heat pipe, and the edge of the second heat insulation support is provided with a notch or a through hole or a second pipe groove for the first heat pipe to pass through.
Furthermore, a plurality of positioning baffles are arranged on the outer surface of the first heat insulation support around the outer side of the mounting hole, and the hot end heat conduction seat is arranged among the positioning baffles.
Furthermore, the semiconductor refrigeration module comprises a plurality of semiconductor refrigeration chips, the assembly module is provided with the hot end heat conduction seat and the cold end heat conduction seat which correspond to the semiconductor refrigeration chips, and the first heat insulation support is provided with the mounting hole which corresponds to the semiconductor refrigeration chip.
Compared with the prior art, the invention has the advantages and positive effects that: through forming the breach structure in a plurality of radiating fins, the breach structure forms the mounting groove who is used for installing radiator fan, and in the in-service use process, the inspiratory cold air of radiator fan can be via the passageway transmission that forms between two radiating fins to make the cold air can the at utmost carry out the heat exchange with fin contact, effectual reduction windage, improve the radiating efficiency, realize improving refrigeration plant's heat-sinking capability and refrigeration efficiency and reduce the energy consumption.
The cold end heat conduction seat is installed by the installation cavity formed between the two heat insulation supports, so that the cold end heat conduction seat and the hot end heat conduction seat are effectively insulated and spaced by the heat insulation supports, the heat exchange quantity generated between the cold end heat conduction seat and the hot end heat conduction seat can be greatly reduced, the dissipation of cold quantity is effectively reduced, and the refrigeration efficiency of refrigeration equipment is improved and the energy consumption is reduced. Meanwhile, the semiconductor refrigeration chip is embedded in the mounting hole of the first heat insulation support, the cold end face of the semiconductor refrigeration chip is ensured to be in good contact with the cold end heat conduction seat, the hot end face of the semiconductor refrigeration chip is ensured to be in good contact with the hot end heat conduction seat, heat is ensured to be rapidly dissipated, and the use reliability is improved.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly introduced below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
FIG. 1 is a schematic structural diagram of an embodiment of a semiconductor refrigeration apparatus according to the present invention;
FIG. 2 is an assembly view of the inner container and the cold end heat sink of the embodiment of the semiconductor refrigeration device of the present invention;
FIG. 3 is a schematic structural diagram of a hot side heat sink in an embodiment of the semiconductor refrigeration apparatus of the present invention;
FIG. 4 is a schematic structural diagram of a semiconductor refrigeration module according to the present invention;
FIG. 5 is a schematic front view of a first heat-insulating support of the semiconductor refrigeration module according to the present invention;
FIG. 6 is a schematic view of the reverse structure of a first heat-insulating support in the semiconductor refrigeration module according to the present invention;
FIG. 7 is a schematic front view of a second heat insulating support of the semiconductor refrigeration module according to the present invention;
FIG. 8 is a schematic view of a second heat-insulating support of the semiconductor refrigeration module of the present invention;
FIG. 9 is a schematic diagram of a first heat-conducting plate of the semiconductor refrigeration module according to the present invention;
FIG. 10 is a schematic view of a second heat-conducting plate of the semiconductor refrigeration module of the present invention;
fig. 11 is an exploded view of the semiconductor refrigeration module of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
As shown in fig. 1 to 3, the semiconductor refrigeration device of this embodiment includes a case 200 and an inner container 100 disposed in the case, the inner container 100 is configured with a semiconductor refrigeration module, the semiconductor refrigeration module includes a semiconductor refrigeration chip, a hot end heat sink and a cold end heat sink assembled together, the cold end heat sink includes a cold end heat conduction seat and a first heat pipe 2 connected to the cold end heat conduction seat, the first heat pipe 2 is attached to the inner container 100, the hot end heat sink includes a hot end heat conduction seat 33 and a second heat pipe 331 connected to the hot end heat conduction seat 33, the second heat pipe 331 is provided with a plurality of heat dissipation fins 332, one side of the heat dissipation fins 332 is provided with a notch structure, a plurality of the notch structures form a mounting groove, and a heat dissipation fan 333 is disposed in the mounting groove.
Specifically, in the semiconductor refrigeration device of this embodiment, the hot end heat conduction seat 33 absorbs heat released from the hot end surface of the semiconductor refrigeration chip and transmits the heat to the heat dissipation fins 332 through the second heat pipe 331, the heat dissipation fins 332 are provided with notch structures, and the notch structures on the heat dissipation fins 332 form mounting grooves for mounting the heat dissipation fans 333, so that the heat dissipation fans 333 are embedded into the heat dissipation fins 332, in this way, in the operation process of the heat dissipation fans 333, after the heat dissipation fans 333 absorb external cold air, the cold air flows through the space formed between two adjacent heat dissipation fins 332, so that the cold air is in contact with the surfaces of the heat dissipation fins 332 to perform heat exchange, and as the array direction of the heat dissipation fins 332 is consistent with the air flow direction, the air flow resistance is effectively reduced, the heat exchange efficiency is higher, and the heat dissipation capacity of the heat dissipation fins. Here, the heat dissipation fan 333 may be a centrifugal fan that sucks in external air in an axial direction thereof and blows out the air formed between the heat dissipation fins 332. In addition, in order to facilitate installation of the heat dissipation fan 333, the heat dissipation fan 333 is provided with a fan support 3331, the fan support 3331 spans over the heat dissipation fins 332, specifically, the fan support 3331 may span over a plurality of heat dissipation fins 332, and the inter-fan 3331 and the heat dissipation fins 332 are fixed by bolts, so that the heat dissipation fan 333 is assembled. Preferably, the hot-side heat conduction seat 33 is provided with a heat sink (not shown), and the heat of the hot-side heat conduction seat 33 is further rapidly dissipated by the heat sink.
This embodiment semiconductor refrigeration plant, through form the breach structure in a plurality of radiating fin, the breach structure forms the mounting groove who is used for installing radiator fan, and in the in-service use process, the inspiratory cold air of radiator fan can be via the passageway transmission that forms between two radiating fin to make cold air can the at utmost carry out the heat exchange with fin contact, effectual reduction windage, improve the radiating efficiency, realize improving refrigeration plant's heat-sinking capability and refrigeration efficiency and reduce the energy consumption.
Further, in order to more effectively improve the refrigeration efficiency, as shown in fig. 1 to 11, the semiconductor refrigeration module further includes an assembly module 3, the assembly module 3 includes a first heat insulation support 31 and a second heat insulation support 32, a first groove 311 is disposed on an inner surface of the first heat insulation support 31, a mounting hole 312 penetrating through the first heat insulation support 31 is opened in the first groove 311, a second groove 321 is disposed on an inner surface of the second heat insulation support 32, the first heat insulation support 31 is fixed on the second heat insulation support 32, a mounting cavity is formed between the first groove 311 and the second groove 321, the semiconductor refrigeration chip 1 is located in the mounting hole 312, the cold end heat conduction seat 34 is disposed in the mounting cavity and is in contact with a cold end surface of the semiconductor refrigeration chip 1, the hot end heat conduction seat 33 is disposed on the first heat insulation support 31 and is in contact with a hot end surface of the semiconductor refrigeration chip 1, the first heat pipe 2 is connected to the cold end heat conduction seat 34.
Specifically, the semiconductor refrigeration module of the present embodiment embeds the semiconductor refrigeration chip 1 in the mounting hole 312 of the first heat insulation support 31, the periphery of the semiconductor refrigeration chip 1 is wrapped by the first heat insulation support 31, and the hot end heat conduction seat 33 and the cold end heat conduction seat 34 are separated by the first heat insulation bracket 31, the heat transfer generated between the hot-end heat conduction seat 33 and the cold-end heat conduction seat 34 can be effectively reduced, thereby reducing the cold loss of the cold end heat conducting seat 34, meanwhile, the cold end heat conducting seat 34 is wrapped in the installation cavity which is formed by the first heat insulation bracket 31 and the second heat insulation bracket 32 and has the heat insulation function, the cold energy generated by the semiconductor refrigeration chip 1 conducted by the cold-end heat conduction seat 34 can be rapidly transmitted to a required area through the heat pipe 2 to the maximum extent, thereby reducing the amount of cold energy dissipation of the cold end heat conduction seat 34 per se, more effectively reducing the energy consumption and improving the refrigeration efficiency.
Preferably, the outer surface of the first heat insulation bracket 31 is provided with a heat insulation groove 313 around the mounting hole 312, and heat insulation cotton (not marked) is arranged in the heat insulation groove 313; the hot end of the semiconductor refrigeration chip 1 protrudes outward from the outer surface of the first heat insulation support 31. Specifically, the heat insulation cotton can be arranged on the periphery of the semiconductor refrigeration chip 1 through the heat insulation groove 313, so that the outward dissipation of cold on the cold end face of the semiconductor refrigeration chip 1 is further reduced through a heat insulation ring formed by the heat insulation cotton, meanwhile, the heat on the hot end face of the semiconductor refrigeration chip 1 can be reduced to enter the installation cavity, and the loss of cold is reduced to the maximum extent; the hot end face of the semiconductor refrigeration chip 1 is slightly higher than the outer surface of the first heat insulation support 31, so that the hot end face of the semiconductor refrigeration chip 1 and the hot end heat conduction seat 33 can conduct heat in a good contact mode, and the hot end face of the semiconductor refrigeration chip 1 is separated from the mounting hole 312, heat can be reduced from being transmitted into the mounting cavity from the mounting hole 312, and loss of cold energy can be effectively reduced. In order to facilitate the connection of circuit wiring, a wiring groove 314 is further disposed on the outer surface of the first heat insulation support 31, and the wiring groove 314 is communicated with the mounting hole 312. In addition, according to the requirement of the refrigerating capacity of the refrigerating device, the semiconductor refrigerating module of this embodiment includes a plurality of semiconductor refrigerating chips 1, the assembly module 3 is configured with the hot end heat conduction seat 33 and the cold end heat conduction seat 34 corresponding to the semiconductor refrigerating chips 1, and the first heat insulation support 31 is provided with the mounting hole 312 corresponding to the semiconductor refrigerating chips 1.
Further, in order to more effectively reduce heat transfer generated between the hot end heat conduction seat 33 and the cold end heat conduction seat 34 due to assembly, an avoidance gap 340 is provided on the cold end heat conduction seat 34, through holes (not marked) are respectively provided on the first heat insulation support 31, the second heat insulation support 32 and the hot end heat conduction seat 33, a bolt 35 is inserted into the corresponding through hole, and the bolt 35 passes through an area formed by the avoidance gap 340. Specifically, in the assembling process, the hot end heat conducting seat 33, the first heat insulating support 31, the cold end heat conducting seat 34 and the second heat insulating support 32 are sequentially assembled and fixed together through the bolt 35, and the bolt 35 avoids the cold end heat conducting seat 34 through the avoiding notch 340, so that heat exchange between the hot end heat conducting seat 33 and the cold end heat conducting seat 34 through the bolt 35 can be avoided. The inner surface of the first heat insulation support 31 is provided with a first pipe groove 316 and a first pipe groove 317 for mounting the first heat pipe 2, and the edge of the second heat insulation support 32 is provided with a notch or a through hole 322 or a second pipe groove for the first heat pipe 2 to pass through. Specifically, the heat pipe 2 passes through the assembly module 3 through the first pipe groove 316, the first pipe groove 317 and the through hole 322 in a matching manner, so that the heat pipe 2 is conveniently arranged on the inner container 100 of the refrigeration equipment. In addition, in order to facilitate quick positioning and installation of the hot end heat conduction seat 33, a plurality of positioning baffles 315 are arranged on the outer surface of the first heat insulation support 31 around the outer side of the installation hole 312, and the hot end heat conduction seat 33 is arranged among the positioning baffles 315. During assembly, the hot end heat conduction seat 33 can be conveniently positioned and installed through the positioning baffle 315, and the hot end heat conduction seat 33 can be ensured to be accurately in good contact with the semiconductor refrigeration chip 1.
Still further, the cold end heat conduction seat 34 includes a first heat conduction plate 341 and a second heat conduction plate 342 connected together, and the first heat pipe 2 is sandwiched between the first heat conduction plate 341 and the second heat conduction plate 342. Specifically, the inner surface of the first heat conducting plate 341 is provided with a first mounting groove 3411 which is transversely arranged, the inner surface of the second heat conducting plate 342 is provided with a second mounting groove 3421 which is longitudinally arranged, the first heat pipe 2 is divided into a transverse flat heat pipe and a longitudinal flat heat pipe, the transverse flat heat pipe is arranged in the first mounting groove 3411, the longitudinal flat heat pipe is arranged in the second mounting groove 3421, and the transverse flat heat pipe and the longitudinal flat heat pipe are in contact with each other. Specifically, adopt flat heat pipe can effectual increase heat pipe and the area of contact of cold junction heat conduction seat 34, simultaneously, flat heat pipe can also the area of contact between effectual increase and inner bag 100, provides heat exchange efficiency. And the transverse flat heat pipe is contacted with the longitudinal flat heat pipe, so that the temperature of the heat pipes at different positions is uniformly distributed, the temperature difference is reduced, and the temperature uniformity is improved.
The cold end heat conduction seat is installed through the installation cavity formed between the two heat insulation supports, so that the cold end heat conduction seat and the hot end heat conduction seat are effectively insulated and spaced by the heat insulation supports, the heat exchange quantity generated between the cold end heat conduction seat and the hot end heat conduction seat can be greatly reduced, the dissipation of cold quantity is effectively reduced, and the refrigeration efficiency of refrigeration equipment is improved and the energy consumption is reduced. Meanwhile, the semiconductor refrigeration chip is embedded in the mounting hole of the first heat insulation support, the cold end face of the semiconductor refrigeration chip is ensured to be in good contact with the cold end heat conduction seat, the hot end face of the semiconductor refrigeration chip is ensured to be in good contact with the hot end heat conduction seat, heat is ensured to be rapidly dissipated, and the use reliability is improved.
Finally, it should be noted that: the above examples are only intended to illustrate the technical solution of the present invention, but not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions.
Claims (9)
1. A semiconductor refrigeration device comprises a box shell and an inner container arranged in the box shell, wherein a semiconductor refrigeration module is configured on the inner container, the semiconductor refrigeration module comprises a semiconductor refrigeration chip, a hot end radiator and a cold end radiator which are assembled together, the cold end radiator comprises a cold end heat conduction seat and a first heat pipe connected with the cold end heat conduction seat, the first heat pipe is attached to the inner container, the hot end radiator comprises a hot end heat conduction seat and a second heat pipe connected with the hot end heat conduction seat, and a plurality of radiating fins are arranged on the second heat pipe; the semiconductor refrigeration module comprises an assembly module, the assembly module comprises a first heat insulation support and a second heat insulation support, the first heat insulation support is fixed on the second heat insulation support, an installation cavity is formed between the first heat insulation support and the second heat insulation support, the first heat insulation support is provided with an installation hole communicated with the installation cavity, the semiconductor refrigeration chip is located in the installation hole, a cold end heat conduction seat is arranged in the installation cavity and is in contact with a cold end face of the semiconductor refrigeration chip, and a hot end heat conduction seat is arranged on the first heat insulation support and is in contact with the hot end face of the semiconductor refrigeration chip.
2. The semiconductor cooling device as claimed in claim 1, wherein a fan bracket is provided on the cooling fan, and the fan bracket straddles the cooling fins.
3. The semiconductor refrigeration device according to claim 1, wherein the hot side heat conductive base is provided with a heat sink.
4. The semiconductor refrigeration device according to claim 1, wherein an outer surface of the first heat insulation support is provided with a heat insulation groove around the mounting hole, and heat insulation cotton is arranged in the heat insulation groove; the hot end of the semiconductor refrigeration chip protrudes outwards from the outer surface of the first heat insulation support.
5. The semiconductor refrigeration device according to claim 1, wherein an avoidance notch is formed in the cold-end heat conduction seat, through holes are formed in the first heat insulation support, the second heat insulation support and the hot-end heat conduction seat respectively, a bolt is inserted into the corresponding through hole, and the bolt penetrates through an area formed by the avoidance notch.
6. The semiconductor refrigeration unit of claim 1 wherein the cold end heat conductive mount comprises a first heat conductive plate and a second heat conductive plate joined together; the internal surface of first heat-conducting plate offers the first mounting groove of horizontal setting, the second mounting groove of vertical setting is offered to the internal surface of second heat-conducting plate, first heat pipe divide into horizontal flat heat pipe and vertical flat heat pipe, horizontal flat heat pipe sets up in the first mounting groove, vertical flat heat pipe sets up in the second mounting groove, and, horizontal flat heat pipe with vertical flat heat pipe contacts each other.
7. The semiconductor refrigeration equipment as claimed in claim 1, wherein the inner surface of the first heat insulation support is provided with a first pipe groove for installing the first heat pipe, and the edge of the second heat insulation support is provided with a notch or a through hole or a second pipe groove for the first heat pipe to pass through.
8. The semiconductor refrigeration device according to claim 1, wherein a plurality of positioning baffles are arranged on the outer surface of the first heat insulation support around the outer side of the mounting hole, and the hot end heat conduction seat is arranged among the positioning baffles.
9. The semiconductor refrigeration device according to claim 1, wherein the semiconductor refrigeration module comprises a plurality of semiconductor refrigeration chips, the assembly module is configured with the hot end heat conduction seat and the cold end heat conduction seat corresponding to the semiconductor refrigeration chips, and the first heat insulation bracket is provided with the mounting hole corresponding to the semiconductor refrigeration chip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710293549.8A CN108800703B (en) | 2017-04-28 | 2017-04-28 | Semiconductor refrigeration equipment |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201710293549.8A CN108800703B (en) | 2017-04-28 | 2017-04-28 | Semiconductor refrigeration equipment |
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| CN108800703A CN108800703A (en) | 2018-11-13 |
| CN108800703B true CN108800703B (en) | 2020-12-15 |
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Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111326487A (en) * | 2018-12-17 | 2020-06-23 | 青岛海尔智能技术研发有限公司 | Fin radiator and refrigeration cabinet machine |
| CN110749121B (en) * | 2019-10-10 | 2024-05-17 | 青岛海尔智能技术研发有限公司 | Method and device for controlling operation of semiconductor refrigeration equipment and refrigeration equipment |
| CN110749123A (en) * | 2019-10-10 | 2020-02-04 | 青岛海尔智能技术研发有限公司 | Radiator and refrigeration equipment |
| CN110749124A (en) * | 2019-10-10 | 2020-02-04 | 青岛海尔智能技术研发有限公司 | Radiator and refrigeration equipment |
| CN110749122A (en) * | 2019-10-10 | 2020-02-04 | 青岛海尔智能技术研发有限公司 | Radiator and refrigeration equipment |
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| CN204693888U (en) * | 2015-05-29 | 2015-10-07 | 青岛海尔智能技术研发有限公司 | Heat abstractor and there is the semiconductor refrigerating box of this heat abstractor |
| CN105716315A (en) * | 2014-12-01 | 2016-06-29 | 青岛海尔特种电冰柜有限公司 | Semiconductor refrigeration equipment |
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| CN200943973Y (en) * | 2006-08-15 | 2007-09-05 | 中山市柏迪半导体致冷设备有限公司 | Heat radiating device of semi-conductor refrigerating device |
| CN203943523U (en) * | 2014-04-28 | 2014-11-19 | 广东新创意科技有限公司 | A kind of semiconductor refrigerating drinking water apparatus |
| CN204373476U (en) * | 2014-12-01 | 2015-06-03 | 青岛海尔特种电冰柜有限公司 | Heat abstractor and semiconductor refrigerating equipment |
| CN105716315A (en) * | 2014-12-01 | 2016-06-29 | 青岛海尔特种电冰柜有限公司 | Semiconductor refrigeration equipment |
| CN204693888U (en) * | 2015-05-29 | 2015-10-07 | 青岛海尔智能技术研发有限公司 | Heat abstractor and there is the semiconductor refrigerating box of this heat abstractor |
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