CN110749123A - Radiator and refrigeration equipment - Google Patents
Radiator and refrigeration equipment Download PDFInfo
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- CN110749123A CN110749123A CN201910958598.8A CN201910958598A CN110749123A CN 110749123 A CN110749123 A CN 110749123A CN 201910958598 A CN201910958598 A CN 201910958598A CN 110749123 A CN110749123 A CN 110749123A
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- heat
- fins
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- fin group
- fan
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B21/00—Machines, plants or systems, using electric or magnetic effects
- F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
- F25B2321/02—Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
- F25B2321/025—Removal of heat
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- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Thermal Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The application relates to the technical field of heat dissipation of refrigeration equipment, and discloses a radiator, including: a heat conductive substrate; a heat-dissipating substrate; the radiating fin group is arranged on the radiating substrate and is provided with a notch forming an accommodating space; the heat pipe comprises a heat conduction pipe part embedded in the heat conduction substrate and a heat dissipation pipe part embedded in the heat dissipation substrate. According to the radiator provided by the embodiment of the disclosure, the radiating fin group is provided with the notch, the notch forms the accommodating space, the accommodating space can be used for accommodating the fan, heat among the fins can be dissipated in time, and the radiating effect of the hot-end radiator is improved. The application also discloses a refrigeration device.
Description
Technical Field
The present application relates to the field of heat dissipation technology for refrigeration equipment, and for example, to a heat sink and refrigeration equipment.
Background
At present, with the development of semiconductor refrigeration technology, semiconductor refrigeration equipment which adopts a semiconductor refrigeration chip to carry out refrigeration is widely used. The semiconductor refrigeration chip comprises a cold end for releasing cold and a hot end for releasing heat, wherein the cold end releases the cold to a refrigeration space of the refrigeration equipment through a cold end radiator, and the hot end releases the heat to the outside through a hot end radiator.
In the process of implementing the embodiments of the present disclosure, it is found that at least the following problems exist in the related art: the existing hot end radiator has poor heat dissipation effect and influences the refrigeration capacity of semiconductor refrigeration equipment.
Disclosure of Invention
The following presents a simplified summary in order to provide a basic understanding of some aspects of the disclosed embodiments. This summary is not an extensive overview nor is intended to identify key/critical elements or to delineate the scope of such embodiments but rather as a prelude to the more detailed description that is presented later.
The embodiment of the disclosure provides a radiator and refrigeration equipment, so as to solve the technical problem that the heat dissipation effect of a hot-end radiator is not good.
In some embodiments, the heat sink comprises: a heat conductive substrate; a heat-dissipating substrate; the radiating fin group is arranged on the radiating substrate and is provided with a notch forming an accommodating space; the heat pipe comprises a heat conduction pipe part embedded in the heat conduction substrate and a heat dissipation pipe part embedded in the heat dissipation substrate.
In some embodiments, the refrigeration appliance comprises the aforementioned heat sink.
The radiator and the refrigeration equipment provided by the embodiment of the disclosure can realize the following technical effects:
at present, the method of arranging the fan on the surface of the hot end radiator is mostly adopted to dissipate the heat of the hot end radiator of the semiconductor refrigeration equipment, however, the fan is arranged on the fins, the wind power generated by the rotation of the fan can only dissipate the heat around the fan, and can not dissipate the heat generated between the fins, thereby affecting the heat dissipation effect of the hot end radiator.
According to the radiator provided by the embodiment of the disclosure, the radiating fin group is provided with the notch, the notch forms the accommodating space, the accommodating space can be used for accommodating the fan, heat among the fins can be dissipated in time, and the radiating effect of the hot-end radiator is improved.
The foregoing general description and the following description are exemplary and explanatory only and are not restrictive of the application.
Drawings
One or more embodiments are illustrated by way of example in the accompanying drawings, which correspond to the accompanying drawings and not in limitation thereof, in which elements having the same reference numeral designations are shown as like elements and not in limitation thereof, and wherein:
fig. 1 is a schematic structural diagram of a heat sink provided in an embodiment of the present disclosure;
fig. 2 is another schematic structural diagram of a heat sink provided in the embodiment of the present disclosure;
fig. 3 is another schematic structural diagram of a heat sink provided in the embodiments of the present disclosure;
FIG. 4 is a schematic structural diagram of a fan support provided by an embodiment of the present disclosure;
FIG. 5 is another schematic structural view of a fan support provided in the embodiments of the present disclosure;
FIG. 6 is another schematic structural view of a fan support provided in the embodiments of the present disclosure;
FIG. 7 is another schematic structural view of a fan support provided by embodiments of the present disclosure;
FIG. 8 is another schematic structural view of a fan support provided by embodiments of the present disclosure;
fig. 9 is another schematic structural diagram of a heat sink provided in the embodiments of the present disclosure.
Reference numerals:
11: a first thermally conductive substrate; 12: a second thermally conductive substrate; 21: a first heat dissipation substrate; 22: a second heat dissipation substrate; 211: a first set of fins; 221: a second set of fins; 31: a first accommodating space; 32: a second accommodating space; 33: a third accommodating space; 4: a fan bracket; 41: a flat plate; 411: a first through-hole; 412: a second penetration portion; 413: a third penetration portion; 421: a first windshield; 422: a second wind deflector; 423: a third wind deflector; 424: a fourth wind deflector; 431: a first reinforcing plate; 432: a second reinforcing plate; 433: a third reinforcing plate; 434: a fourth reinforcing plate; 44: fixing grooves; 51: a first fan; 52: a second fan; 53: a third fan; 61: a first heat pipe set; 62: a second heat pipe set.
Detailed Description
So that the manner in which the features and elements of the disclosed embodiments can be understood in detail, a more particular description of the disclosed embodiments, briefly summarized above, may be had by reference to the embodiments, some of which are illustrated in the appended drawings. In the following description of the technology, for purposes of explanation, numerous details are set forth in order to provide a thorough understanding of the disclosed embodiments. However, one or more embodiments may be practiced without these details. In other instances, well-known structures and devices may be shown in simplified form in order to simplify the drawing.
The terms "first," "second," and the like, herein are used solely to distinguish one element from another without requiring or implying any actual such relationship or order between such elements. In practice, a first element can also be referred to as a second element, and vice versa. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a structure, apparatus, or device that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such structure, apparatus, or device. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other like elements in a structure, device or apparatus that comprises the element. The embodiments are described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments are referred to each other.
The disclosed embodiment provides a heat sink, including: a heat conductive substrate; a heat-dissipating substrate; the radiating fin group is arranged on the radiating substrate and is provided with a notch forming an accommodating space; the heat pipe comprises a heat conducting pipe portion embedded in the heat conducting substrate and a heat dissipation pipe portion embedded in the heat dissipation substrate.
It will be appreciated that the thermally conductive substrate may be a substrate in direct contact with the hot side semiconductor chip of the semiconductor refrigeration device. The heat conducting substrate is in direct contact with the hot end semiconductor chip which releases heat, the heat released by the hot end semiconductor chip is transferred to the heat conducting substrate through contact heat conduction, and the heat is dissipated by the radiator comprising the heat conducting substrate.
Optionally, a fin group is disposed on the heat conducting substrate, and the fin group disposed on the heat conducting substrate is defined as a middle fin group. Optionally, the intermediate fin group comprises two or more fins. The fins in the middle fin group may be fixedly connected to the heat conducting substrate, for example, the fins in the middle fin group are welded to the heat conducting substrate. Alternatively, the thickness of the individual fins in the intermediate fin group may be 0.8-1.3mm, such as 1mm, and the fins in the intermediate fin group may be aluminum sheets or blown sheets. When the fins in the middle fin group are the blowing plates, the blowing plates are filled with phase change working media such as refrigerants, and the heat dissipation effect of the fins in the middle fin group is improved.
As shown in fig. 1, the heat pipe includes a heat conducting pipe portion embedded in the heat conducting substrate, and a heat dissipating pipe portion embedded in the heat dissipating substrate.
The heat conducting pipe portion and the heat dissipating pipe portion are used herein for naming different portions of the heat pipe, and the function of the heat pipe is not limited. Alternatively, the heat conducting tube portion and the heat dissipating tube portion of the heat pipe communicate with each other. The radiating tube parts of the heat pipes are embedded into the radiating substrate, heat is transferred to the radiating substrate, and further radiation is performed through the radiating substrate and the fins in the radiating fin group on the radiating substrate.
Alternatively, the heat conductive substrate may be shaped as a hexahedron including a first surface, a second surface opposite to the first surface, a third surface located between the first surface and the second surface and directly contacting the hot side semiconductor chip, a fourth surface opposite to the third surface, a remaining fifth surface, and a sixth surface opposite to the fifth surface, such as a rectangular parallelepiped. Optionally, the fins in the intermediate fin group are connected with the fourth face of the heat conductive base plate. Optionally, the areas of the third surface and the fourth surface are larger than the areas of the first surface and the second surface, so that the contact area with the hot-end semiconductor chip is increased, and the heat conduction effect of the heat conduction substrate is improved.
The radiating fin group is arranged on the radiating substrate and is provided with a notch forming an accommodating space.
The radiating fin group comprises two or more radiating fins. Optionally, the area of a single fin in the set of fins is greater than the area of the fins in the intermediate set of fins. Optionally, the fins in the set of heat dissipating fins have a thickness less than the thickness of the fins in the intermediate set of fins. Optionally, the fins in the set of cooling fins have a thickness of 0.3-0.6mm, such as 0.5 mm.
As shown in fig. 1, the fin group is provided with notches forming an accommodation space. Optionally, the heat dissipating fin set includes N heat dissipating fins, and the notch is formed by M adjacent heat dissipating fins, that is, each of the M adjacent heat dissipating fins has a notch, such as a concave surface, and the notches of the M adjacent heat dissipating fins are formed, where N is greater than M, and M is greater than 2. Optionally, the heat dissipation fin group includes N heat dissipation fins, and the notch is formed by the N heat dissipation fins, that is, each of the N heat dissipation fins in the heat dissipation fin group has a missing surface, such as a concave surface, and the missing surfaces of the N heat dissipation fins form a notch, where N is greater than 3.
The notch forms a receiving space. The accommodating space can be used for placing a fan and other wind power elements capable of generating wind power, and a placing space is provided for the fan and other wind power elements capable of generating wind power. Wind power generated by the wind power element can penetrate through the radiating fins in the radiating fin group to dissipate heat among the radiating fins, so that the heat dissipation effect of the wind power element on the radiating fins is improved, and the radiating effect of the radiator is improved.
The heat sink provided by the embodiment of the present disclosure further includes a heat dissipation substrate.
The fins in the radiating fin group are fixed on the radiating base plate, so that the connection stability of the fins in the radiating fin group is improved. The radiating pipe part of the heat pipe transfers heat to the radiating base plate, and the radiating base plate and the fins in the radiating fin group further dissipate the heat. Optionally, the heat dissipation substrate is a uniform temperature plate, which improves the uniformity of heat distribution among different fins in the heat dissipation fin group.
Optionally, the heat conducting tube portion of the heat pipe is parallel to the heat dissipating tube portion.
Optionally, a groove is formed in a third surface of the heat conducting substrate, the heat conducting pipe portion of the heat pipe is embedded in the groove, and the heat conducting pipe portion is in direct contact with a hot end chip of the semiconductor refrigeration equipment to receive heat of the hot end chip. Optionally, the number of heat pipes is two or more. Two or more than two heat pipes all include heat conduction pipe portion and heat dissipation pipe portion, optionally, two or more than two heat conduction pipe portion parallel inlays in the heat conduction base member. Optionally, the heat conducting pipe part of the heat pipe is parallel to the fifth surface and the sixth surface of the heat conducting substrate, so that the heat conducting uniformity of the heat pipe is improved. Optionally, the heat conducting pipe portion of a single heat pipe is respectively bent and extended towards two ends, so as to obtain two heat dissipating pipe portions. Alternatively, a single heat pipe has 4 bends, as shown in fig. 1, two bends are provided between one end of the heat conducting pipe portion of the heat pipe and the heat dissipating pipe portion, and two bends are provided between the other end of the heat conducting pipe portion of the heat pipe and the other heat dissipating pipe portion. Optionally, the heat conducting tube portion of the heat pipe is parallel to the heat dissipating tube portion. Optionally, two or more heat pipe portions of the heat pipe are parallel, which improves uniformity of heat transfer from the heat pipe portions to the fins in the fin group.
Optionally, a distance between two adjacent heat conducting pipe portions is smaller than a distance between two adjacent heat dissipating pipe portions.
The distance between two adjacent heat conduction pipe parts is defined to be a first distance, the distance between two adjacent heat dissipation pipe parts is a second distance, and the first distance is smaller than the second distance, so that the uniformity of heat transfer of the heat dissipation pipe parts of the heat pipe is improved, and the heat conduction and heat dissipation effects of the heat dissipation substrate are improved.
Optionally, the fins in the fin group include: a notch portion; the extending part extends along the gap part, and the heat dissipation pipe part is arranged at the part of the heat dissipation substrate corresponding to the extending part.
It can be understood that the fins in the heat dissipation fin group include a notch portion provided with a notch and an extension portion extending along the notch portion, the notch portion and the extension portion are both connected with the heat dissipation substrate, and the heat dissipation tube portion is provided at a portion where the extension portion is connected with the heat dissipation substrate. Alternatively, the extending portion is connected to one surface of the heat dissipation base plate, and the heat dissipation tube portion is provided on the other surface opposite to the one surface, as shown in fig. 1, so that the heat dissipation effect of the fan on the heat between the fins in the heat dissipation fin group is improved.
Optionally, the thickness of the heat conducting substrate is greater than the thickness of the heat dissipating substrate.
The thickness of the heat conducting substrate is greater than that of the heat dissipating substrate, so that the heat conducting effect of the heat conducting substrate and the heat dissipating effect of the heat dissipating substrate are improved, as shown in fig. 2. The heat dissipation substrate includes a first heat dissipation substrate 21 and a second heat dissipation substrate 22, and the thickness of the heat conduction substrate is greater than that of the first heat dissipation substrate 21 and that of the second heat dissipation substrate 22. Alternatively, the thickness of the first heat dissipation substrate 21 is the same as that of the second heat dissipation substrate 22.
The pipe diameters of different parts of a single heat pipe can be the same or different. Optionally, the outer diameter of the heat conducting pipe portion of the heat pipe is larger than the outer diameter of the heat dissipating pipe portion, and the inner diameter of the heat conducting pipe portion of the heat pipe is larger than the inner diameter of the heat dissipating pipe portion, so that heat conducting and heat dissipating effects are improved.
Optionally, the fin assembly includes: the first radiating fin group is provided with a first notch forming a first accommodating space; and the second radiating fin group is provided with a second notch forming a second accommodating space.
Optionally, as shown in fig. 1, the first fin group and the second fin group are symmetrically disposed on two sides of the heat conducting substrate.
As shown in fig. 1, the first fin group 211 includes two or more heat dissipating fins. Alternatively, the area of a single fin in the first fin group 211 is larger than the area of the fins in the intermediate fin group. Optionally, the thickness of the fins in the first fin group 211 is smaller than the thickness of the fins in the intermediate fin group. Optionally, the fins in the first set of fins 211 have a thickness of 0.3-0.6mm, such as 0.5 mm.
The first fin group 211 is provided with a first notch forming the first accommodation space 31. Optionally, the first fin group 211 includes N fins, and the first gap is formed by M adjacent fins, that is, each of the M adjacent fins has a gap, such as a concave surface, and the gap of the M adjacent fins forms the first gap, where N is greater than M, and M is greater than 2. Optionally, the first fin group 211 includes N fins, and the first notch is formed by the N fins, that is, each of the N fins in the first fin group 211 has a missing surface, such as a concave surface, and the missing surfaces of the N fins form the first notch, where N is greater than 3.
The first indentation forms a first receiving space 31. The first receiving space 31 may be used to receive a wind force generating component such as a fan, and provides a receiving space for the wind force generating component such as a fan. Wind power generated by the wind power element can penetrate through the radiating fins in the first radiating fin group 211 to dissipate heat among the radiating fins, so that the heat dissipation effect of the wind power element on the radiating fins is improved, and the heat dissipation effect of the radiator is improved.
The second fin group 221 includes two or more heat dissipating fins. Optionally, the area of a single fin in the second fin group 221 is larger than the area of the fins in the middle fin group; alternatively, the area of a single fin in the second fin group 221 is the same as the area of a single fin in the first fin group 211; optionally, the thickness of the fins in the second fin group 221 is less than the thickness of the fins in the intermediate fin group, optionally, the thickness of the fins in the second fin group 221 is 0.3-0.6mm, such as 0.5 mm.
The second fin group 221 is provided with a second notch forming the second accommodation space 32. Optionally, the second fin group 221 includes N fins, and the second notch is formed by M adjacent fins, that is, each of the M adjacent fins has a missing surface, such as a concave surface, and the missing surfaces of the M adjacent fins form the second notch, where N is greater than M, and M is greater than 2. Optionally, the second fin group 221 includes N fins, and the second notch is formed by the N fins, that is, each of the N fins in the second fin group 221 has a missing surface, such as a concave surface, and the missing surfaces of the N fins form the second notch, where N is greater than 3.
The second indentation forms a second receiving space 32. The second receiving space 32 may be used to receive a wind force generating component such as a fan, and provide a receiving space for the wind force generating component such as a fan. Wind power generated by the wind power element can penetrate through the radiating fins in the second radiating fin group 221 to dissipate heat among the radiating fins, so that the heat dissipation effect of the wind power element on the radiating fins is improved, and the heat dissipation effect of the radiator is improved. Optionally, the volume of the second accommodation space 32 is equal to the volume of the first accommodation space 31.
Optionally, the thermally conductive substrate comprises: a first thermally conductive substrate; and a third accommodating space is formed between the second heat-conducting substrate and the first heat-conducting substrate. As shown in fig. 1 and 3.
A third accommodating space 33 is formed between the second heat conduction substrate 12 and the first heat conduction substrate 11, and it is understood that the second heat conduction substrate 12 is not in direct contact with the first heat conduction substrate 11, and has a certain distance therebetween, and the distance forms the third accommodating space 33. The third receiving space 33 may be used to place a fan or the like that generates wind force, and provides a space for the fan or the like that generates wind force. The wind power generated by the wind power element can dissipate heat of the first heat-conducting substrate 11 and the second heat-conducting substrate 12, and the heat dissipation effect of the heat sink is improved. Optionally, the thickness of the first heat-conducting substrate 11 is the same as the thickness of the second heat-conducting substrate 12; the area of the first heat conductive substrate 11 is the same as the area of the second heat conductive substrate 12.
Optionally, a first intermediate fin group is disposed on the first heat conducting substrate 11, and a second intermediate fin group is disposed on the second heat conducting substrate 12, and the fins in the first intermediate fin group and the fins in the second intermediate fin group are oriented in the same direction. The wind power generated by the wind power element disposed in the third accommodating space 33 can shuttle between the fins of the first middle fin group, and can also shuttle between the fins of the second middle fin group, thereby improving the heat dissipation effect on the fins in the first middle fin group and the second middle fin group.
Optionally, the heat pipe comprises: the first heat pipe set comprises a first heat conduction pipe part embedded into the first heat conduction substrate, a first heat dissipation pipe part extending along one end of the first heat conduction pipe part, and a second heat dissipation pipe part extending along the other end of the first heat conduction pipe part; the second heat pipe set comprises a second heat conduction pipe portion embedded into the second heat conduction substrate, a third heat dissipation pipe portion extending along one end of the second heat conduction pipe portion, and a fourth heat dissipation pipe portion extending along the other end of the second heat conduction pipe portion.
As shown in fig. 1, the first heat pipe set 61 includes two or more heat pipes, the first heat pipe portions of the two or more heat pipes are parallel, the first heat pipe portions are embedded in the first heat dissipation substrate and connected to the first heat dissipation substrate, and the second heat pipe portions are embedded in the second heat dissipation substrate and connected to the second heat dissipation substrate. Similarly, the second heat pipe set 62 includes two or more heat pipes, the second heat conducting pipe portions of the two or more heat pipes are parallel, the third heat dissipating pipe portion is embedded in the first heat dissipating base and connected to the first heat dissipating base, and the fourth heat dissipating pipe portion is embedded in the second heat dissipating base and connected to the second heat dissipating base, so as to improve the uniformity of heat conduction of the heat pipes.
Optionally, the heat sink further comprises: and the fan is arranged in the accommodating space.
The fan includes a first fan 51 disposed in the first receiving space 31, as shown in fig. 3 and 9.
The first accommodating space 31 is formed by a first notch of the first cooling fin group 211, the first fan 51 is arranged in the first accommodating space 31, the first fan 51 sucks air from the outer side of the refrigeration equipment, and generated wind power can shuttle through a gap between two adjacent fins of the first cooling fin group 211 under the blocking of a box body back plate of the refrigeration equipment to dissipate heat between the two adjacent fins, so that the heat dissipation effect of the first fan 51 on the fins in the first cooling fin group 211 is improved. Alternatively, the axial direction of the first fan 51 is perpendicular to the fins in the first fin group 211, so that the shuttling performance of the wind force generated by the first fan 51 in the gap between two adjacent fins in the first fin group 211 is improved, and the heat dissipation effect on the fins in the first fin group 211 is improved. Optionally, the first fan 51 is an axial fan.
The fins in the first fin group 211 include a notch portion, a first extending portion extending along a first end of the notch portion, and a second extending portion extending along a second end opposite to the first end, optionally, the area of the first extending portion is the same as the area of the second extending portion, so that the uniformity of heat dissipation of the first fan 51 to the fins in the first fin group 211 is improved, as shown in fig. 3.
The first heat dissipating fin group 211 includes end fins provided at both ends of the first heat dissipating base plate 21 and inner fins provided between the end fins, and optionally, a gap between adjacent two end fins is larger than a gap between adjacent two inner fins, thereby improving utilization of wind power generated by the first fan 51.
The fan includes a second fan 52 disposed in the second accommodating space 32, as shown in fig. 3 and 9.
The second accommodating space 32 is formed by a second notch of the second cooling fin group 221, the second fan 52 is arranged in the second accommodating space 32, the second fan 52 sucks air from the outside of the refrigeration equipment, and the generated wind power can shuttle through a gap between two adjacent fins of the second cooling fin group 221 under the blocking of a box body back plate of the refrigeration equipment, so that heat between the two adjacent fins is dissipated, and the heat dissipation effect of the second fan 52 on the fins in the second cooling fin group 221 is improved. Optionally, the axial direction of the second fan 52 is perpendicular to the fins in the second fin group, so that the shuttling performance of the wind force generated by the second fan 52 in the gap between two adjacent fins in the second fin group 221 is improved, and the heat dissipation effect on the fins in the second fin group 221 is improved. Optionally, the second fan 52 is an axial fan.
The fins in the second fin group 221 include a notch portion, a third extending portion extending along a third end of the notch portion, and a fourth extending portion extending along a fourth end opposite to the third end, and optionally, the area of the third extending portion is the same as that of the fourth extending portion, so that uniformity of heat dissipation of the second fin group 221 by the second fan 52 is improved.
The second heat dissipating fin group 221 includes end fins disposed at both ends of the second heat dissipating base plate 22 and inner fins disposed between the end fins, and optionally, a gap between two adjacent end fins is larger than a gap between two adjacent inner fins, so as to improve utilization of wind power generated by the second fan 52.
The fan includes a third fan 53 provided in the third accommodating space 33, as shown in fig. 3 and 9.
The third accommodating space 33 is formed by the distance between the first heat conducting substrate 11 and the second heat conducting substrate 12, the third fan 53 is arranged in the third accommodating space 33, the third fan 53 sucks air from the outer side of the refrigeration equipment, and generated wind power can shuttle between the gaps between two adjacent fins of the first middle fin group and can also shuttle between the gaps between two adjacent fins of the second middle fin group under the blocking of the box body back plate of the refrigeration equipment, so that the heat dissipation effect on the first middle fin group and the second middle fin group is improved. Optionally, the axial direction of the third fan 53 is perpendicular to the fins in the first intermediate fin group, and the third fan 53 is perpendicular to the fins in the second intermediate fin group, so that the shuttling performance of the wind power generated by the third fan 53 between two adjacent fins of the first intermediate fin group and the second intermediate fin group is improved, and the heat dissipation effect on the first intermediate fin group and the second intermediate fin group is improved. Optionally, the third fan 53 is an axial fan.
Optionally, the heat sink further comprises: and a fan bracket for fixing the fan, as shown in fig. 4 to 8.
Optionally, the fan bracket 4 includes:
a plate 41 provided with at least a first penetration portion 411;
the first side edge is bent and extended along the first end of the flat plate, and the bending can be vertical bending;
the second side edge is bent and extended along the second end of the flat plate, the first end is opposite to the second end, the extending directions of the first side edge and the second side edge are the same, and similarly, the bending can also be vertical bending;
the first through portion 411 is used for mounting the first fan 51.
Optionally, the plate of the fan support further includes a second through portion 412 for mounting the second fan 52.
Optionally, the flat plate of the fan support further comprises a third through-penetration 413 for mounting the third fan 53, as shown in fig. 4 and 5.
Optionally, the fan bracket is provided with fixing grooves for fixing the fins in the fin group.
Optionally, the first side edge is provided with a fin fixing groove 44, as shown in fig. 7 and 8, wherein fig. 8 is a partial enlarged view of fig. 7, for fixing the aforementioned fin, such as the fin in the aforementioned middle fin group, the first fin group or the second fin group. Wind power generated in the operation process of the fan acts on the fins, and the partial edges of the fins can be clamped in the fixing grooves, so that the fins are prevented from being deformed, and the service life of the radiator is prolonged. Optionally, the fins are blown plates.
Optionally, the second side edge is provided with a fin fixing groove 44 for fixing the aforementioned fin, such as the fin in the aforementioned middle fin group, the first fin group or the second fin group. Wind power generated in the operation process of the fan acts on the fins, and the partial edges of the fins can be clamped in the fixing grooves, so that the fins are prevented from being deformed, and the service life of the radiator is prolonged. Optionally, the fins are blown plates.
Optionally, the fan bracket further comprises a wind deflector. The wind shield is used for shielding the air flow of the fan, so that the wind generated by the fan can flow through the fins of the radiator under the action of the air outlet bypass of the fan. Optionally, the wind blocking plates are perpendicular to the flat plate, as shown in fig. 6, the wind blocking plates include a first wind blocking plate 421 disposed on one side of the first fan, a second wind blocking plate 422 disposed on the other side of the first fan and located between the first fan and the second fan, a third wind blocking plate 423 disposed on one side of the third fan and located between the second fan and the third fan, and a fourth wind blocking plate 424 disposed on the other side of the third fan.
Optionally, the fan bracket further comprises a reinforcing plate to reduce deformation and vibration of the fan frame due to the fan. Optionally, the reinforcing panel is parallel to the wind deflector. As shown in fig. 6, the reinforcing plates include a first reinforcing plate 431 and a second reinforcing plate 432 disposed at both sides of the first fan, and a third reinforcing plate 433 and a fourth reinforcing plate 434 disposed at both sides of the third fan.
Optionally, the fan bracket further comprises:
the third side edge is bent and extended along the third end of the flat plate;
a fourth side edge extending along the fourth end of the flat plate in a bending manner, the third end is opposite to the fourth end, the third side edge and the fourth side edge have the same extending direction,
and connecting pieces for fixing the fan bracket are arranged on the third side and the fourth side. Optionally, the fan bracket is fixed to a back plate of a cabinet of the refrigeration apparatus.
The embodiment of the disclosure also provides a refrigeration device comprising the radiator.
Optionally, the refrigeration device may be the aforementioned semiconductor refrigeration device, and the aforementioned heat sink is configured to dissipate heat for the hot end of the semiconductor chip. Optionally, one or more than one radiator may be installed in one refrigeration apparatus, and the number of radiators in the refrigeration apparatus is not limited in the embodiments of the present disclosure.
Claims (10)
1. A heat sink, comprising:
a heat conductive substrate;
a heat-dissipating substrate;
the radiating fin group is arranged on the radiating substrate and is provided with a notch forming an accommodating space;
the heat pipe comprises a heat conduction pipe part embedded in the heat conduction substrate and a heat dissipation pipe part embedded in the heat dissipation substrate.
2. The heat sink of claim 1,
the heat conducting pipe part of the heat pipe is parallel to the heat radiating pipe part.
3. The heat sink of claim 1,
the distance between two adjacent heat conduction pipe parts is less than the distance between two adjacent heat dissipation pipe parts.
4. The heat sink of claim 1, wherein the fins in the set of fins comprise:
a notch portion;
an extension portion extending along the notch portion,
the heat dissipation pipe part is arranged at the part of the heat dissipation substrate corresponding to the extension part.
5. The heat sink of claim 1,
the thickness of the heat conducting substrate is larger than that of the heat dissipation substrate.
6. The heat sink of claim 1,
the outer diameter of the heat conducting pipe part of the heat pipe is larger than that of the heat radiating pipe part.
7. The heat sink as recited in claim 1 wherein said set of fins comprises:
the first radiating fin group is provided with a first notch forming a first accommodating space;
and the second radiating fin group is provided with a second notch forming a second accommodating space.
8. The heat sink of claim 1, wherein the thermally conductive substrate comprises:
a first thermally conductive substrate;
and a third accommodating space is formed between the second heat-conducting substrate and the first heat-conducting substrate.
9. The heat sink of claim 1, further comprising:
and the fan is arranged in the accommodating space.
10. A refrigeration device comprising a heat sink according to any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910958598.8A CN110749123A (en) | 2019-10-10 | 2019-10-10 | Radiator and refrigeration equipment |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910958598.8A CN110749123A (en) | 2019-10-10 | 2019-10-10 | Radiator and refrigeration equipment |
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| CN110749123A true CN110749123A (en) | 2020-02-04 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201910958598.8A Pending CN110749123A (en) | 2019-10-10 | 2019-10-10 | Radiator and refrigeration equipment |
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| CN (1) | CN110749123A (en) |
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