CN201497248U - Refrigeration device and electronic wine cabinet - Google Patents
Refrigeration device and electronic wine cabinet Download PDFInfo
- Publication number
- CN201497248U CN201497248U CN 200920062195 CN200920062195U CN201497248U CN 201497248 U CN201497248 U CN 201497248U CN 200920062195 CN200920062195 CN 200920062195 CN 200920062195 U CN200920062195 U CN 200920062195U CN 201497248 U CN201497248 U CN 201497248U
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- heat pipe
- micro heat
- array micro
- radiating fin
- refrigerating plant
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Abstract
The utility model relates to a refrigeration device and an electronic wine cabinet with the refrigeration device. The refrigeration device includes a radiating fin, a semiconductor refrigeration chip and an array-type micro heat pipe, and the radiating fin is connected with the array-type micro heat pipe, wherein the hot end of the semiconductor refrigeration chip is at least in fit connection with the array-type micro heat pipe or the radiating fin. The utility model adopts the array-type micro heat pipe to transfer heat, enlarges the contact areas between the heat pipe and the semiconductor refrigeration chip as well as between the heat pipe and the radiating fin, greatly enhances the heat transfer efficiency and enables the refrigeration to be faster.
Description
Technical field
The utility model relates to a kind of refrigeration technology field, relates in particular to a kind of Electronic Wine Cabinet that uses the refrigerating plant of array micro heat pipe and have this refrigerating plant; Described refrigerating plant can also be used in other products that need freeze or heat.
Background technology
The electronic cooling wine cabinet mostly is to design and produce a kind of refrigerating plant that forms on the basis of semiconductor refrigerating principle at present, the mode that its energy distributes generally all is to adopt traditional heat radiation aluminium flake to add to force air-cooled mode to be carried out, this kind mode one comes thermal resistance bigger, heat transfer efficiency is lower, and cooling time is long; Two cause the waste of electric flux, and the cost of paying concerning the consumer is higher; Air blast cooling simultaneously makes big, the easy defective such as vibrations of utensil noise.
In recent years, continuous maturation along with hot pipe technique, it utilizes the liquid of liquid working substance/vapour phase to become advantages such as the stronger heat-transfer capability that heat transfer type had (its thermal conductivity performance is higher two more than the order of magnitude than copper/aluminium material), excellent isothermal performance and volume are little, in light weight, makes its application in continuous expansion.
Summary of the invention
The deficiency that exists for the refrigerating plant that overcomes prior art and Electronic Wine Cabinet, application in conjunction with hot pipe technique, the utility model provides a kind of New Refrigerating device and has had the Electronic Wine Cabinet of this refrigerating plant, adopted a kind of hot pipe technique of array, but its contact area is doubled and redoubled, and heat transfer efficiency improves greatly.
The technical scheme that its technical problem that solves the utility model adopts is:
Refrigerating plant includes refrigeration part, thermal component and cold scattering parts; Wherein, described refrigeration part is a semiconductor chilling plate, and described semiconductor chilling plate has hot junction and cold junction; Described thermal component includes array micro heat pipe and radiating fin, and described radiating fin is connected with described array micro heat pipe, and the hot junction of described semiconductor chilling plate links to each other with described array micro heat pipe or one of them applying of described radiating fin at least.
Described cold scattering parts include: cold scattering fin and cold junction array micro heat pipe, described cold scattering fin is connected with described cold junction array micro heat pipe, and the cold junction of described semiconductor chilling plate links to each other with described cold junction array micro heat pipe or one of them applying of described cold scattering fin.
Described array micro heat pipe and cold junction array micro heat pipe be interconnect and be arranged in parallel, the cross section hydraulic diameter is the combination of numerous micro heat pipes of 0.4-5mm, integral body is plane tabular or curved surface is tabular or the plane combines form tabular with curved surface, and described micro heat pipe cross sectional shape is generally polygons such as circle or triangle, square, rectangle.
The body material of described array micro heat pipe is a metal, adopts aluminium and aluminium alloy or copper and copper alloy especially.
Described radiating fin or cold scattering fin side are provided with accelerates the cross-ventilation fan that heat distributes.
Electronic Wine Cabinet includes above-mentioned refrigerating plant, and the cold scattering parts of described refrigerating plant are arranged in the body inner chamber of described Electronic Wine Cabinet.
The beneficial effects of the utility model are:
Refrigerating plant of the present utility model, refrigeration part is a semiconductor chilling plate, thermal component includes array micro heat pipe and radiating fin, the cold scattering parts include: cold scattering fin and cold junction array micro heat pipe, described array micro heat pipe are to interconnect and be arranged in parallel and the combination of numerous micro heat pipes of forming.
One; Adopt array micro heat pipe more traditional air blast cooling structure of conducting heat, it is little, in light weight to have a volume, defectives such as noiselessness, vibrations, and heat transfer efficiency is higher, and cooling time is faster;
Its two: adopt array micro heat pipe spread pattern, make contact area increasing between heat pipe and semiconductor chilling plate and the radiating fin, heat transfer efficiency strengthens greatly,
Description of drawings
Fig. 1 is the structural upright schematic diagram of the utility model refrigerating plant embodiment 1.
Fig. 2 is the structure cross-sectional schematic of the utility model refrigerating plant embodiment 1.
Fig. 3 is the structural upright schematic diagram of the utility model refrigerating plant embodiment 2.
Fig. 4 is the structure cross-sectional schematic of the utility model refrigerating plant embodiment 2.
Among the figure:
1-array micro heat pipe, 2-radiating fin, 3-heat conduction pad, 4-semiconductor chilling plate, 5-cold junction array micro heat pipe, 6-cold scattering fin, 7-cold junction heat conduction fan, 8-heat conduction fan, 41-semiconductor chilling plate hot junction, 42-semiconductor chilling plate cold junction, 21-heat radiation aluminum substrate, 61-cold scattering aluminum substrate, 9-wine cabinet.
Concrete embodiment
The utility model discloses a kind of refrigerating plant, includes refrigeration part, thermal component and cold scattering parts; Wherein, described refrigeration part is a semiconductor chilling plate, and described semiconductor chilling plate has hot junction and cold junction; Described thermal component includes array micro heat pipe and radiating fin, and described radiating fin is connected with described array micro heat pipe, and the hot junction of described semiconductor chilling plate links to each other with described array micro heat pipe or one of them applying of described radiating fin at least.
Described cold scattering parts include: cold scattering fin and cold junction array micro heat pipe, described cold scattering fin is connected with described cold junction array micro heat pipe, and the cold junction of described semiconductor chilling plate links to each other with described cold junction array micro heat pipe or one of them applying of described cold scattering fin.
Described array micro heat pipe and cold junction array micro heat pipe be interconnect and be arranged in parallel, the cross section hydraulic diameter is the combination of numerous micro heat pipes of 0.4-5mm, integral body is plane tabular or curved surface is tabular or the plane combines form tabular with curved surface, and described micro heat pipe cross sectional shape is generally polygons such as circle or triangle, square, rectangle.
The body material of described array micro heat pipe is a metal, adopts aluminium and aluminium alloy or copper and copper alloy especially.
Described radiating fin or cold scattering fin side are provided with accelerates the cross-ventilation fan that heat distributes.
Electronic Wine Cabinet includes above-mentioned refrigerating plant, and the cold scattering parts of described refrigerating plant are arranged in the body inner chamber of described Electronic Wine Cabinet.
Embodiment 1:
As shown in Figure 1, 2, a kind of Electronic Wine Cabinet array micro heat pipe refrigerating plant, comprise: semiconductor chilling plate 4, radiating fin 2 and array micro heat pipe 1, the hot junction 41 of described array micro heat pipe 1 one ends and described semiconductor chilling plate 4 is fitted and connected, and array micro heat pipe 1 is connected with radiating fin 2 away from the other end of semiconductor chilling plate 4.So-called heat pipe is the metal closed body of two ends sealing, and inboard wall of tube body is the liquid sucting core structure of capillary, and inner liquid working substance is in the vacuum environment, after being subjected to variations in temperature, liquid/vapour phase change very easily takes place and produce the heat transfer effect, its thermal resistance is very little, has the very high capacity of heat transmission.Usually its heat-transfer capability is higher two more than the order of magnitude than metals such as copper/aluminium.Described array micro heat pipe 1 is to interconnect and be arranged in parallel, and the cross section hydraulic diameter is numerous micro heat pipes combinations of 0.4-5mm, and its micro heat pipe cross section is generally polygons such as circle, triangle, square, rectangle.After fitting fully with the hot junction 41 of described semiconductor chilling plate 4 and described radiating fin 2, not only make contact area increase, be convenient to the heat that described semiconductor chilling plate 4 is produced in time is passed to described radiating fin 2 rapidly, and heat transfer efficiency is further improved.For reducing thermal resistance, weight reduction reduces cost, and metallic aluminium that the material employing thermal conductivity factor of described array micro heat pipe 1 is higher and aluminium alloy or copper and copper alloy are as the base material of body.Simultaneously since described array micro heat pipe 1 surface irregularity cause its with described semiconductor chilling plate 4 between applying incomplete, make that thermal resistance is bigger between the two, heat transfer efficiency is influenced, between the hot junction face of described array micro heat pipe 1 and described semiconductor chilling plate 4 usually with being connected with the heat conduction pad 3 or the Heat Conduction Material of identical function with it.
Described radiating fin 2 is connected by certain rule for the higher foil of numerous thermal conductivity factors on the matrix of identical material to be formed, and it has big area of dissipation usually, generally all adopts flake aluminum.Described radiating fin 2 of the present utility model can be one-body molded by surface or the direct and described array micro heat pipe 1 of riveting or be soldered to described array micro heat pipe 1, in the hope of reaching both abundant contacts, reduce the transmission thermal resistance between the two, be convenient to pass to described radiating fin 2 by described array micro heat pipe 1 with the heat of described semiconductor chilling plate 4 is in time quick, improve the radiating efficiency of described radiating fin 2.
A kind of Electronic Wine Cabinet described in the utility model also comprises cold junction array micro heat pipe 5 and the cold scattering fin 6 that is positioned at wine cabinet 9 inside with array micro heat pipe refrigerating plant, described cold junction array micro heat pipe 5 is identical with structure with described array micro heat pipe 1 principle, its volume and heat transfer efficiency and described array micro heat pipe 1 can slightly be had any different, described cold scattering fin 6 is identical with described radiating fin 2 structures, the quantity of its foil and volume also all can be distinguished described radiating fin 2, the cold junction 42 of described semiconductor chilling plate 4 equally by described heat conductive silica gel 3 or with it the Heat Conduction Material of identical function fit with described cold junction array micro heat pipe 5 and be connected, described cold scattering fin 6 is connected or making one-body molded with it with described cold junction array micro heat pipe 5 by welding or riveted joint, transmit rapidly through described cold junction array micro heat pipe 5 from the cold junction 42 generation colds of described semiconductor chilling plate 4, and be distributed to the inner chamber of described wine cabinet 9 by described cold scattering fin 6, produce heats from the hot junction 41 of described semiconductor chilling plate 4 and be distributed to described wine cabinet 9 atmosphere outside by described array micro heat pipe 1 and by described radiating fin 2 and go, thereby finally reach the quick decline of temperature in the described wine cabinet 9.
Embodiment 2:
Shown in Fig. 3,4, be the another kind of frame mode of the utility model refrigerating plant, the parts of its same sequence number representative all are same as embodiment one, only describe its difference herein, and something in common sees that embodiment one is described.
For the ease of needing on structure installation and the technology, radiating fin 2 described in the utility model also can include the heat radiation aluminum substrate 21 with plane, the and arranged on left and right sides of described radiating fin 2 respectively is connected with the heat radiation aluminum substrate 21 of one flat plate shape, described radiating fin 2 is fixed between two described heat radiation aluminum substrates 21 or is one-body molded with it, shown in Fig. 3,4.
The hot junction 41 of described semiconductor chilling plate 4 fits with the plane of the heat radiation aluminum substrate 21 in radiating fin 2 left sides, for preventing that the two from influencing heat transfer efficiency owing to other reasonses such as technology making can not fit tightly, but between is equipped with the described heat conduction pad 3 or the Heat Conduction Material of identical function with it.
Described array micro heat pipe 1 adopts " n " or " U " shape structure, and the mode that described array micro heat pipe 1 adopts the plane to fit is connected with heat radiation aluminum substrate 21; Perhaps described array micro heat pipe 1 is implanted aluminium matter heat radiation aluminum substrate 21 inside with transmission of heat by contact complete with it, so that with the heat of described semiconductor chilling plate 4 by described array micro heat pipe 1 with flash heat transfer characteristic, the fast as far as possible other end of passing to described radiating fin 2 is accelerated its radiating efficiency.The bending section of described array micro heat pipe 1 stretches out the outside of heat radiation aluminum substrate 21.Can be connected with the described heat conduction pad 3 or the Heat Conduction Material of identical function with it between described array micro heat pipe 1 and the described aluminum substrate 21,, accelerate heat transfer efficiency to reduce thermal resistance between the two.(not shown)
Equally, the utility model also can comprise and be positioned at the cold scattering aluminum substrate 61 that described wine cabinet 9 inside have the plane, and described cold scattering fin 6 is fixed on the aluminium matter cold scattering aluminum substrate 61 or is one-body molded with it, shown in Fig. 3,4.The cold junction 42 of described semiconductor chilling plate 4 fits with described cold scattering aluminum substrate 61 and is connected, for reducing thermal resistance, application between the two has the described heat conductive pad sheet 3 or the Heat Conduction Material of identical function with it, described cold junction array micro heat pipe 5 one ends link to each other with described cold scattering aluminum substrate 61 applyings or implant its inside, the other end links to each other with other end cold scattering aluminum substrate 61 applyings of described cold scattering fin 6 or implants its inside, by described cold junction array micro heat pipe 5 with flash heat transfer characteristic, the cold junction 42 of described semiconductor chilling plate 4 produces cold and transmits rapidly through described cold junction array micro heat pipe 5, and is distributed to the inner chamber of described wine cabinet 9 by described cold scattering fin 6; And the heat that the hot junction 41 of described semiconductor chilling plate 4 produces is passed to the outside atmosphere space of described wine cabinet 9 by a series of heat transfer mediums such as the mentioned described heat radiation aluminum substrate 21 in front, described array micro heat pipe 1 and described radiating fins 2, thereby reaches the quick decline of temperature in the described wine cabinet 9.Be to improve thermal conductivity, be connected with the described heat conduction pad 3 or the Heat Conduction Material of identical function with it between described cold junction array micro heat pipe 5 and the described cold scattering aluminum substrate 61.(not shown)
For in wine cabinet 9, absorbing heat as early as possible, also be discharged in the outside atmosphere faster simultaneously for the heat that described semiconductor chilling plate is discharged, the novel refrigerating plant of this use also can install heat conduction fan 7 and 8 additional at the position of described radiating fin 2 and described cold scattering fin 6, flow to quicken the radiating fin ambient air, accelerate the exchange heat in itself and space of living in.Shown in Fig. 2,4
The utility model is not limited to above cited embodiment, adopts cold and hot end exchange combination and close structure with above two embodiment all to belong at protection domain of the present utility model.
Claims (10)
1. refrigerating plant includes refrigeration part, thermal component and cold scattering parts; It is characterized in that described refrigeration part is a semiconductor chilling plate, described semiconductor chilling plate has hot junction and cold junction; Described thermal component includes array micro heat pipe and radiating fin, and described radiating fin is connected with described array micro heat pipe, and the hot junction of described semiconductor chilling plate links to each other with described array micro heat pipe or one of them applying of described radiating fin at least.
2. refrigerating plant according to claim 1, it is characterized in that, described cold scattering parts include: cold scattering fin and cold junction array micro heat pipe, described cold scattering fin is connected with described cold junction array micro heat pipe, and the cold junction of described semiconductor chilling plate links to each other with described cold junction array micro heat pipe or one of them applying of described cold scattering fin.
3. refrigerating plant according to claim 3 is characterized in that, described array micro heat pipe and cold junction array micro heat pipe be interconnect and be arranged in parallel, the cross section hydraulic diameter is the combination of numerous micro heat pipes of 0.4-5mm.
4. refrigerating plant according to claim 3 is characterized in that, described array micro heat pipe and cold junction array micro heat pipe integral body are plane tabular or curved surface is tabular or the plane combines form tabular with curved surface.
5. refrigerating plant according to claim 3 is characterized in that, the body material of described array micro heat pipe is aluminum or aluminum alloy or copper or copper alloy.
6. refrigerating plant according to claim 3 is characterized in that, described radiating fin or cold scattering fin side are provided with accelerates the cross-ventilation fan that heat distributes.
7. refrigerating plant according to claim 4, it is characterized in that, the hot junction (41) of described array micro heat pipe (1) one end and described semiconductor chilling plate (4) is fitted and connected, and array micro heat pipe (1) is connected with radiating fin 2 away from the other end of semiconductor chilling plate (4);
8. refrigerating plant according to claim 4, it is characterized in that, described radiating fin (2) is formed for the higher foil of multi-disc thermal conductivity factor is connected by certain rule on the matrix of identical material, described radiating fin (2) by riveted joint or be soldered to the surface of described array micro heat pipe 1 or directly and described array micro heat pipe (1) one-body molded.
9. refrigerating plant according to claim 4, it is characterized in that, the and arranged on left and right sides of described radiating fin (2) respectively is connected with the heat radiation aluminum substrate (21) of one flat plate shape, and described radiating fin (2) is fixed between two described heat radiation aluminum substrates (21) or be one-body molded with it; The hot junction (41) of described semiconductor chilling plate (4) fits with the plane of the heat radiation aluminum substrate (21) in radiating fin (2) left side; Described array micro heat pipe (1) adopts " n " or " U " shape structure, and the mode that described array micro heat pipe (1) adopts the plane to fit is connected with heat radiation aluminum substrate (21); It is inner with transmission of heat by contact complete with it that perhaps described array micro heat pipe (1) is implanted heat radiation aluminum substrate (21); The bending section of described array micro heat pipe (1) stretches out the outside of heat radiation aluminum substrate (21).
10. Electronic Wine Cabinet is characterized in that, includes as any one described refrigerating plant in the claim 1 to 9, and the cold scattering parts of described refrigerating plant are arranged in the body inner chamber of described Electronic Wine Cabinet.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200920062195 CN201497248U (en) | 2009-08-12 | 2009-08-12 | Refrigeration device and electronic wine cabinet |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200920062195 CN201497248U (en) | 2009-08-12 | 2009-08-12 | Refrigeration device and electronic wine cabinet |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201497248U true CN201497248U (en) | 2010-06-02 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200920062195 Expired - Fee Related CN201497248U (en) | 2009-08-12 | 2009-08-12 | Refrigeration device and electronic wine cabinet |
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| CN (1) | CN201497248U (en) |
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103557570A (en) * | 2013-11-18 | 2014-02-05 | 北京德能恒信科技有限公司 | Multilayer heat pipe heat exchange type semiconductor refrigeration system |
| CN104329853A (en) * | 2014-08-29 | 2015-02-04 | 青岛海尔股份有限公司 | Semiconductor refrigeration refrigerator and manufacturing method thereof |
| CN104329890A (en) * | 2014-03-28 | 2015-02-04 | 海尔集团公司 | Heat conduction device and semiconductor refrigerator with heat conduction device |
| CN104329848A (en) * | 2014-03-28 | 2015-02-04 | 海尔集团公司 | Semiconductor refrigeration refrigerator |
| CN105376994A (en) * | 2015-11-16 | 2016-03-02 | 珠海格力电器股份有限公司 | Heat abstractor and have its refrigeration electrical apparatus |
| CN104329853B (en) * | 2014-08-29 | 2017-01-04 | 青岛海尔股份有限公司 | Semiconductor refrigeration refrigerator and manufacturing method thereof |
| CN110174013A (en) * | 2019-05-13 | 2019-08-27 | 江苏高科应用科学研究所有限公司 | A kind of heat-exchange device |
| CN110749122A (en) * | 2019-10-10 | 2020-02-04 | 青岛海尔智能技术研发有限公司 | Radiator and refrigeration equipment |
| CN110749123A (en) * | 2019-10-10 | 2020-02-04 | 青岛海尔智能技术研发有限公司 | Radiator and refrigeration equipment |
| CN112968362A (en) * | 2021-02-22 | 2021-06-15 | 淄博博一新能源科技发展有限公司 | Anti-icing mute condensation dehumidifier, ring main unit and use method of dehumidifier |
| WO2021248901A1 (en) * | 2020-06-12 | 2021-12-16 | 佛山市顺德区大磐电器实业有限公司 | Refrigeration system and refrigeration device |
| CN114526951A (en) * | 2022-02-24 | 2022-05-24 | 南京理工大学 | Semiconductor refrigerating device for collecting flame soot particles |
| CN115029843A (en) * | 2022-01-30 | 2022-09-09 | 绍兴丰煊纺织品有限公司 | Rapier tape heat dissipation device of rapier machine |
-
2009
- 2009-08-12 CN CN 200920062195 patent/CN201497248U/en not_active Expired - Fee Related
Cited By (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103557570A (en) * | 2013-11-18 | 2014-02-05 | 北京德能恒信科技有限公司 | Multilayer heat pipe heat exchange type semiconductor refrigeration system |
| CN103557570B (en) * | 2013-11-18 | 2016-06-01 | 北京德能恒信科技有限公司 | A kind of multilayer heat pipe heat exchange type semiconductor refrigeration system |
| CN104329848B (en) * | 2014-03-28 | 2017-03-29 | 海尔集团公司 | Semiconductor freezer |
| CN104329890A (en) * | 2014-03-28 | 2015-02-04 | 海尔集团公司 | Heat conduction device and semiconductor refrigerator with heat conduction device |
| CN104329848A (en) * | 2014-03-28 | 2015-02-04 | 海尔集团公司 | Semiconductor refrigeration refrigerator |
| CN104329890B (en) * | 2014-03-28 | 2017-01-04 | 海尔集团公司 | Heat-transfer device and there is the semiconductor freezer of this heat-transfer device |
| CN104329853A (en) * | 2014-08-29 | 2015-02-04 | 青岛海尔股份有限公司 | Semiconductor refrigeration refrigerator and manufacturing method thereof |
| CN104329853B (en) * | 2014-08-29 | 2017-01-04 | 青岛海尔股份有限公司 | Semiconductor refrigeration refrigerator and manufacturing method thereof |
| CN105376994A (en) * | 2015-11-16 | 2016-03-02 | 珠海格力电器股份有限公司 | Heat abstractor and have its refrigeration electrical apparatus |
| CN105376994B (en) * | 2015-11-16 | 2018-12-07 | 珠海格力电器股份有限公司 | Refrigeration appliance |
| CN110174013A (en) * | 2019-05-13 | 2019-08-27 | 江苏高科应用科学研究所有限公司 | A kind of heat-exchange device |
| CN110749122A (en) * | 2019-10-10 | 2020-02-04 | 青岛海尔智能技术研发有限公司 | Radiator and refrigeration equipment |
| CN110749123A (en) * | 2019-10-10 | 2020-02-04 | 青岛海尔智能技术研发有限公司 | Radiator and refrigeration equipment |
| WO2021248901A1 (en) * | 2020-06-12 | 2021-12-16 | 佛山市顺德区大磐电器实业有限公司 | Refrigeration system and refrigeration device |
| CN112968362A (en) * | 2021-02-22 | 2021-06-15 | 淄博博一新能源科技发展有限公司 | Anti-icing mute condensation dehumidifier, ring main unit and use method of dehumidifier |
| CN115029843A (en) * | 2022-01-30 | 2022-09-09 | 绍兴丰煊纺织品有限公司 | Rapier tape heat dissipation device of rapier machine |
| CN114526951A (en) * | 2022-02-24 | 2022-05-24 | 南京理工大学 | Semiconductor refrigerating device for collecting flame soot particles |
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| CF01 | Termination of patent right due to non-payment of annual fee |